JPH0351097B2 - - Google Patents

Info

Publication number
JPH0351097B2
JPH0351097B2 JP58141879A JP14187983A JPH0351097B2 JP H0351097 B2 JPH0351097 B2 JP H0351097B2 JP 58141879 A JP58141879 A JP 58141879A JP 14187983 A JP14187983 A JP 14187983A JP H0351097 B2 JPH0351097 B2 JP H0351097B2
Authority
JP
Japan
Prior art keywords
chip
connection
chips
bonding
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58141879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6034023A (ja
Inventor
Masabumi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58141879A priority Critical patent/JPS6034023A/ja
Publication of JPS6034023A publication Critical patent/JPS6034023A/ja
Publication of JPH0351097B2 publication Critical patent/JPH0351097B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/65—
    • H10W90/00—

Landscapes

  • Wire Bonding (AREA)
JP58141879A 1983-08-04 1983-08-04 半導体チップの基板への実装方法 Granted JPS6034023A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58141879A JPS6034023A (ja) 1983-08-04 1983-08-04 半導体チップの基板への実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58141879A JPS6034023A (ja) 1983-08-04 1983-08-04 半導体チップの基板への実装方法

Publications (2)

Publication Number Publication Date
JPS6034023A JPS6034023A (ja) 1985-02-21
JPH0351097B2 true JPH0351097B2 (cg-RX-API-DMAC10.html) 1991-08-05

Family

ID=15302283

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58141879A Granted JPS6034023A (ja) 1983-08-04 1983-08-04 半導体チップの基板への実装方法

Country Status (1)

Country Link
JP (1) JPS6034023A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600363A (en) * 1988-12-28 1997-02-04 Kyocera Corporation Image forming apparatus having driving means at each end of array and power feeding substrate outside head housing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582037A (ja) * 1981-06-29 1983-01-07 Oki Electric Ind Co Ltd Ｉｃ等の実装方法
JPS5862076A (ja) * 1981-10-12 1983-04-13 Oki Electric Ind Co Ltd サ−マルヘツドの二層配線部の製造方法

Also Published As

Publication number Publication date
JPS6034023A (ja) 1985-02-21

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