JPH0351094B2 - - Google Patents
Info
- Publication number
- JPH0351094B2 JPH0351094B2 JP56101895A JP10189581A JPH0351094B2 JP H0351094 B2 JPH0351094 B2 JP H0351094B2 JP 56101895 A JP56101895 A JP 56101895A JP 10189581 A JP10189581 A JP 10189581A JP H0351094 B2 JPH0351094 B2 JP H0351094B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- gate insulating
- thin film
- silane
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56101895A JPS583289A (ja) | 1981-06-30 | 1981-06-30 | 薄膜トランジスタの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56101895A JPS583289A (ja) | 1981-06-30 | 1981-06-30 | 薄膜トランジスタの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS583289A JPS583289A (ja) | 1983-01-10 |
JPH0351094B2 true JPH0351094B2 (enrdf_load_stackoverflow) | 1991-08-05 |
Family
ID=14312650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56101895A Granted JPS583289A (ja) | 1981-06-30 | 1981-06-30 | 薄膜トランジスタの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS583289A (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60166435A (ja) * | 1984-02-09 | 1985-08-29 | Toyobo Co Ltd | 配向ポリエステルフイルム |
JPH0682839B2 (ja) * | 1984-08-21 | 1994-10-19 | セイコー電子工業株式会社 | 表示用パネルの製造方法 |
JPS61179721A (ja) * | 1985-02-05 | 1986-08-12 | Toyobo Co Ltd | 配向ポリエステルフイルム |
JPS61237622A (ja) * | 1985-04-16 | 1986-10-22 | Teijin Ltd | ポリエステルフイルム |
JPS6292371A (ja) * | 1985-10-18 | 1987-04-27 | Hitachi Ltd | 薄膜トランジスタおよびその製造方法 |
JPS6375028A (ja) * | 1986-09-18 | 1988-04-05 | Toray Ind Inc | 磁気記録媒体用ベ−スフイルム |
JPH0659679B2 (ja) * | 1989-09-01 | 1994-08-10 | 東レ株式会社 | 二軸配向熱可塑性樹脂フイルム |
EP0608633B1 (en) * | 1993-01-28 | 1999-03-03 | Applied Materials, Inc. | Method for multilayer CVD processing in a single chamber |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5667751U (enrdf_load_stackoverflow) * | 1979-10-29 | 1981-06-05 |
-
1981
- 1981-06-30 JP JP56101895A patent/JPS583289A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS583289A (ja) | 1983-01-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3963961B2 (ja) | 半導体装置の作製方法 | |
JP2585118B2 (ja) | 薄膜トランジスタの作製方法 | |
US4692344A (en) | Method of forming a dielectric film and semiconductor device including said film | |
US6090675A (en) | Formation of dielectric layer employing high ozone:tetraethyl-ortho-silicate ratios during chemical vapor deposition | |
US5387542A (en) | Polycrystalline silicon thin film and low temperature fabrication method thereof | |
JPH0351094B2 (enrdf_load_stackoverflow) | ||
JPH08125197A (ja) | 半導体装置の作製方法および半導体装置の作製装置 | |
JP3119988B2 (ja) | 半導体装置の作製方法 | |
JPH0290568A (ja) | 薄膜トランジスタの製造方法 | |
JP3125931B2 (ja) | 半導体作製方法 | |
JP3874815B2 (ja) | 半導体装置の作製方法 | |
JP3130661B2 (ja) | 薄膜トランジスタ及びその製造方法 | |
JP3340407B2 (ja) | 絶縁被膜および半導体装置 | |
GB2179679A (en) | Forming a dielectric film and semiconductor device including said film | |
JP3130660B2 (ja) | 薄膜トランジスタ及びその製造方法 | |
JPS58148458A (ja) | 薄膜トランジスタ | |
JP3564505B2 (ja) | 半導体装置の作製方法 | |
JP3340429B2 (ja) | 半導体装置 | |
JP3340406B2 (ja) | 半導体装置の作製方法 | |
JP2000164885A (ja) | 絶縁ゲイト型半導体装置の作製方法 | |
JP2668459B2 (ja) | 絶縁膜作製方法 | |
JP3340425B2 (ja) | 半導体装置の作製方法 | |
JPH06232117A (ja) | 絶縁膜の形成方法とこれによる半導体装置の製法 | |
JP3120079B2 (ja) | 絶縁被膜および半導体装置 | |
JP3367946B2 (ja) | 半導体装置の作製方法 |