JPH0350639B2 - - Google Patents
Info
- Publication number
- JPH0350639B2 JPH0350639B2 JP12858984A JP12858984A JPH0350639B2 JP H0350639 B2 JPH0350639 B2 JP H0350639B2 JP 12858984 A JP12858984 A JP 12858984A JP 12858984 A JP12858984 A JP 12858984A JP H0350639 B2 JPH0350639 B2 JP H0350639B2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- brazing
- alloy
- sealing ring
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910017709 Ni Co Inorganic materials 0.000 claims description 3
- 229910003267 Ni-Co Inorganic materials 0.000 claims description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 10
- 238000004080 punching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12858984A JPS619998A (ja) | 1984-06-22 | 1984-06-22 | Ａｇろう付封着リングの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12858984A JPS619998A (ja) | 1984-06-22 | 1984-06-22 | Ａｇろう付封着リングの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS619998A JPS619998A (ja) | 1986-01-17 |
| JPH0350639B2 true JPH0350639B2 (ko) | 1991-08-02 |
Family
ID=14988489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12858984A Granted JPS619998A (ja) | 1984-06-22 | 1984-06-22 | Ａｇろう付封着リングの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619998A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248536A (ja) * | 1985-04-26 | 1986-11-05 | Kyocera Corp | Ｉｃセラミツクパツケ−ジのシ−ルリングおよびその製造方法 |
| JPS63104355A (ja) * | 1986-10-21 | 1988-05-09 | Kyocera Corp | Ｉｃセラミツクパツケ−ジのシ−ルリングおよびその製造方法 |
| JPH03283549A (ja) * | 1990-03-30 | 1991-12-13 | Ngk Insulators Ltd | 集積回路用パッケージ |
| JP5067030B2 (ja) * | 2007-06-15 | 2012-11-07 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
-
1984
- 1984-06-22 JP JP12858984A patent/JPS619998A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS619998A (ja) | 1986-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0350639B2 (ko) | ||
| KR900000399B1 (ko) | 균질의 저융점 구리기초 금속합금 | |
| KR900000400B1 (ko) | 균질의 저융점 구리기초합금, 이로부터 제조된 균질의 경납땜 호일과 그 제조방법, 및 이를 이용한 금속결합방법 | |
| US4785988A (en) | Attachment of lead to elongated conductor | |
| CN217799731U (zh) | 焊带用焊片、组合式焊带及组合式焊带串 | |
| CN1054236C (zh) | 以片状材料层叠结构的半导体二极管制造方法 | |
| US3943625A (en) | Method for making tined electrical contacts | |
| JP3582735B2 (ja) | 整流子の製造方法 | |
| US4192063A (en) | Method for manufacturing a base of a semi-conductor device | |
| CN1043173C (zh) | 以槽形外壳构件组构的半导体二极管及其封装方法 | |
| JP3051598B2 (ja) | Ａｇろう付きシールリング及びその製造方法 | |
| JPH07226281A (ja) | 圧着端子の製造方法 | |
| US3429030A (en) | Method of fabricating semiconductor devices | |
| JPH0141033B2 (ko) | ||
| JPS60113449A (ja) | 難加工性ろう材付リ−ドピンの製造方法 | |
| JPS61225786A (ja) | 電線接続用圧着端子の製造方法 | |
| JPS63104355A (ja) | Ｉｃセラミツクパツケ−ジのシ−ルリングおよびその製造方法 | |
| KR820001809B1 (ko) | 납땜(brazing)제품의 제조방법 | |
| JPS62199041A (ja) | 銀ろう付きリ−ドフレ−ムの製造方法 | |
| JPS5850762A (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS62271311A (ja) | 接点材料 | |
| JPH0227522Y2 (ko) | ||
| JPS6032768Y2 (ja) | 気密端子 | |
| JP2848923B2 (ja) | 半導体装置のリードフレームの加工方法及びその装置 | |
| JPS628546A (ja) | セラミツクスレイヤ−パツケ−ジ用端子の製造方法 |