JPH0350639B2 - - Google Patents
Info
- Publication number
- JPH0350639B2 JPH0350639B2 JP12858984A JP12858984A JPH0350639B2 JP H0350639 B2 JPH0350639 B2 JP H0350639B2 JP 12858984 A JP12858984 A JP 12858984A JP 12858984 A JP12858984 A JP 12858984A JP H0350639 B2 JPH0350639 B2 JP H0350639B2
- Authority
- JP
- Japan
- Prior art keywords
- ring
- brazing
- alloy
- sealing ring
- brazed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 28
- 238000007789 sealing Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910017944 Ag—Cu Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910017709 Ni Co Inorganic materials 0.000 claims description 3
- 229910003267 Ni-Co Inorganic materials 0.000 claims description 3
- 229910003262 Ni‐Co Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 10
- 238000004080 punching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、集積回路用セラミツクス容器に取付
けるキヤツプシール用のAgろう付封着リングの
製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing an Ag brazed sealing ring for a cap seal attached to a ceramic container for an integrated circuit.
（従来技術とその問題点）
従来、集積回路用セラミツクス容器にキヤツプ
シール用のリングを取付けるには、Ag−Cu合金
を主とするAgろうを用いてろう付けしているが、
その際Agろうは次のように使用される。即ち、
第２図ａに示すAgろうコイル１から繰り出され
た帯板２を、第２図ｂに示す如く後述のキヤツプ
シール用のリングと略同形状に打抜いてAgろう
リング３を作り、このAgろうリング３と第２図
ｃに示すFe−Ni合金又はFe−Ni−Co合金のコイ
ル４から繰り出された帯板５を第２図ｄに示す如
く打抜いて作つたキヤツプシール用のリング６と
を第２図ｅに示す如くセラミツクス容器７の所定
位置に重ね合せて第２図ｆに示す如くリング６を
セラミツクス容器７にろう付けするか、或いは第
３図ａに示す如くFe−Ni合金又はFe−Ni−Co合
金の帯板５′に予め所定の厚さ（約50μ）のAg−
Cu合金の帯板２′を接合した帯板８を第３図ｂに
示す如く打抜いてAgろう付リング９を作り、こ
れを第３図ｃに示す如くセラミツクス容器７の所
定位置に裁置してろう付けしている。(Prior art and its problems) Conventionally, a cap seal ring is attached to a ceramic container for integrated circuits by brazing using an Ag solder mainly made of an Ag-Cu alloy.
In this case, Ag wax is used as follows. That is,
The strip plate 2 drawn out from the Ag brazing coil 1 shown in FIG. A cap seal ring 6 made by punching out a brazing ring 3 and a strip plate 5 drawn out from a Fe-Ni alloy or Fe-Ni-Co alloy coil 4 shown in FIG. 2c as shown in FIG. 2d. The ring 6 is stacked on the ceramic container 7 at a predetermined position as shown in FIG. 2e, and the ring 6 is brazed to the ceramic container 7 as shown in FIG. Alternatively, a predetermined thickness (approximately 50μ) of Ag-
The strip plate 8 to which the Cu alloy strip plate 2' is bonded is punched out as shown in FIG. 3b to make an Ag brazing ring 9, and this is placed in a predetermined position in the ceramic container 7 as shown in FIG. 3c. and soldered.
然し乍ら、前者のAgろうの使用法では、Agろ
うの帯板２からリング３を打抜く為、Agろうの
打抜きくずが多量に発生し、素材の歩留りが悪
く、再生に手間がかかる。またキヤツプシール用
のリング６をセラミツクス容器７の所定位置にろ
う付けする際にAgろうリング３とキヤツプシー
ル用のリング６を精度良く重ね合せ保持しなけれ
ばならないが、この作業は自動化が困難であり、
手作業で行う場合が多く、甚能率が悪く、しかも
Agろうの打抜きによるばりや異物付着等により
品質保障が難しいものである。 However, in the former method of using Ag solder, since the ring 3 is punched out from the Ag solder strip 2, a large amount of Ag solder punching waste is generated, the yield of the material is poor, and recycling is time consuming. Furthermore, when brazing the cap seal ring 6 to a predetermined position on the ceramic container 7, the Ag brazing ring 3 and the cap seal ring 6 must be accurately overlapped and held, but this work is difficult to automate. can be,
This is often done manually, which is extremely inefficient, and
Quality assurance is difficult due to burrs and foreign matter adhesion caused by Ag solder punching.
また後者のAgろうの使用法では、Agろうをセ
ツトする必要が無くなる為、Agろう付リング９
のセツトの自動化、作業精度は改善されるが、ク
ラツド帯板８からリングを打抜く為、スクラツプ
の発生量が多く、またそのスクラツプも高価な
Agを回収する必要がある為、その精製、回収に
甚だ手間がかかるものである。 In addition, in the latter method of using Ag brazing, there is no need to set Ag brazing, so the Ag brazing ring 9
Automating the setting and improving work accuracy, but since the rings are punched from the clad strip plate 8, a large amount of scrap is generated, and the scrap is also expensive.
Since Ag needs to be recovered, its purification and recovery are extremely time-consuming.
（発明の目的）
本発明は上記の問題を解決すべくなされたもの
であり、スクラツプを生じさせることなくAgろ
う付封着リングを作ることのできる方法を提供す
ることを目的とするものである。(Objective of the Invention) The present invention was made to solve the above problems, and its purpose is to provide a method that can produce an Ag brazed sealing ring without causing scrap. .
（発明の構成）
本発明のAgろう付封着リングの製造方法は、
Ag−Cu合金又はAg−Cu合金にSn、In、Bi、
Sb、Gaの少くとも１種を添加して成るAgろう線
を曲げてAgろうリングとし、このAgろうリング
とFe−Ni合金又はFe−Ni−Co合金で作つたリン
グとを重ねてカーボン治具に入れ、Agろうの融
点以上の温度で、溶融してAgろう付封着リング
となすことを特徴とするものである。(Structure of the Invention) The method for manufacturing an Ag brazed sealing ring of the present invention includes:
Ag-Cu alloy or Ag-Cu alloy with Sn, In, Bi,
Ag solder wire made of at least one of Sb and Ga is bent to form an Ag solder ring, and this Ag solder ring is stacked with a ring made of Fe-Ni alloy or Fe-Ni-Co alloy to form a carbon cure. It is characterized in that it is placed in a mold and melted at a temperature higher than the melting point of Ag solder to form a sealing ring with Ag solder.
（実施例）
本発明のAgろう付封着リングの製造方法の一
実施例を図によつて説明する。先ず第１図ａに示
す如くSUS304で作つた12mm角棒１０の表面に、
直径0.35mmのAg−Cu28％線11を巻付け、水素雰
囲気中で400℃に加熱し冷却して、角形Agろうコ
イル１２となした後、この角形Agろうコイル１
２の一辺を軸線方向に切断して多数の第１図ｂに
示すAgろうリング１３を得た。次にこのAgろう
リング１３の切断端を図示の如く突き合せ接合し
た。(Example) An example of the method for manufacturing an Ag brazed sealing ring of the present invention will be described with reference to the drawings. First, as shown in Figure 1a, on the surface of a 12mm square bar 10 made of SUS304,
A 28% Ag-Cu wire 11 with a diameter of 0.35 mm is wound around it, heated to 400°C in a hydrogen atmosphere and cooled to form a square Ag brazing coil 12.
By cutting one side of 2 in the axial direction, a large number of Ag brazing rings 13 as shown in FIG. 1b were obtained. Next, the cut ends of this Ag brazing ring 13 were butted and joined as shown.
一方厚さ0.5mmのFe−Ni−Co合金板から一辺の
長さ12.5mm、内側寸法10mm角のリングをプレス加
工により打抜き第１図ｃに示す如きキヤツプシー
ル用のリング１４を作成した。 On the other hand, a ring 14 for a cap seal as shown in FIG. 1c was produced by punching out a ring having a side length of 12.5 mm and an inner dimension of 10 mm square from a Fe--Ni--Co alloy plate having a thickness of 0.5 mm.
次いで、第１図ｄに示す如く厚さ３mmのカーボ
ン板１５に深さ0.7mm、一辺13mmの角形リング溝
１６を設けたカーボン治具１７の角形リング溝１
６内に、前記キヤツプシール用のリング１４を装
入し、その上にAgろうリング１３を載せて、非
酸化性雰囲気中で830℃に加熱、溶融して第１図
ｅに示すAgろう付封着リング１８を製作した。 Next, as shown in FIG. 1d, a square ring groove 1 of a carbon jig 17 is formed, in which a square ring groove 16 with a depth of 0.7 mm and a side of 13 mm is provided in a carbon plate 15 with a thickness of 3 mm.
6, put the ring 14 for the cap seal on it, place the Ag brazing ring 13 on top of it, heat it to 830°C in a non-oxidizing atmosphere, melt it, and perform the Ag brazing process shown in Figure 1e. A sealing ring 18 was manufactured.
このAgろう付封着リング１８をタングステン
をメタライズしたセラミツクス容器の所定位置に
搭載し、アンモニア分解ガス中にて830℃でろう
付けした結果、キヤツプシール用のリング１４ご
接合され、全く欠陥の無いろう付けが行われてい
ることが確認された。 This Ag brazed sealing ring 18 was mounted in a predetermined position on a ceramic container metallized with tungsten and brazed at 830°C in ammonia decomposition gas. As a result, the cap sealing ring 14 was bonded with no defects at all. It was confirmed that brazing was performed.
（発明の効果）
以上の説明で判るように本発明のAgろう付封
着リングの製造方法は、Agろう線材からAgろう
リングを作るので、スクラツプが全く発生するこ
とが無く、高価なAgの回収、再生作業が不要で
ある。(Effects of the Invention) As can be seen from the above explanation, the method for producing an Ag brazed sealing ring of the present invention produces an Ag brazing ring from an Ag brazing wire, so there is no scrap at all, and expensive Ag is not used. No collection or recycling work is required.
また本発明のAgろう付封着リングの製造方法
は、Agろうリングをキヤツプシール用のリング
の上に重ねてカーボン治具に入れ、Agろうの融
点以上の温度でAgろうを溶融するので、多少の
位置ずれがあつてもAgろうがキヤツプシール用
のリングの表面に一様に広がり、ばりやはみ出し
の無いAgろう付封着リングを得ることができ、
このAgろう付封着リングをセラミツクス容器の
所定位置にろう付けすると品質良好なものが得ら
れる。 In addition, in the method for manufacturing the Ag brazing sealing ring of the present invention, the Ag brazing ring is stacked on top of the cap sealing ring, placed in a carbon jig, and the Ag brazing ring is melted at a temperature higher than the melting point of the Ag brazing ring. Even if there is some misalignment, the Ag solder spreads uniformly over the surface of the cap seal ring, making it possible to obtain an Ag soldered sealing ring without burrs or protrusion.
When this Ag brazed sealing ring is brazed to a predetermined position on a ceramic container, a product of good quality can be obtained.
さらに本発明のAgろう付封着リングの製造方
法は、キヤツプシール用のリング上にAgろうリ
ングを溶融して接合するので、Agろう中の不純
物残渣はAgろう表面に浮上するので、その後そ
の不純物残渣は簡単に除去することが可能で、ろ
う付け以降の工程で発生するめつき不良等を改善
することが可能となる等の効果を奏する。 Furthermore, in the method for manufacturing the Ag soldering sealing ring of the present invention, since the Ag soldering ring is melted and bonded onto the ring for cap sealing, impurity residues in the Ag soldering float to the surface of the Ag soldering. Impurity residues can be easily removed, and it is possible to improve plating defects that occur in processes after brazing.
第１図ａ乃至ｅは本発明のAgろう付封着リン
グの製造方法の一実施例の工程を示す図、第２図
ａ乃至ｆは従来のキヤツプシール用のリングをセ
ラミツクス容器にろう付けする為の工程を示す
図、第３図ａ乃至ｃは従来のAgろう付封着リン
グの製造からセラミツクス容器にろう付けする迄
の工程を示す図である。
Figures 1a to 1e are diagrams showing the steps of an embodiment of the method for producing an Ag brazed sealing ring of the present invention, and Figures 2a to 2f are diagrams showing the process of brazing a conventional cap seal ring to a ceramic container. Figures 3a to 3c are diagrams showing the steps from manufacturing a conventional Ag brazing sealing ring to brazing it to a ceramic container.
Claims (1)
Sb、Gaの少くとも１種を添加して成るAgろう線
も曲げてAgろうリングとし、このAgろうリング
とFe−Ni合金又はFe−Ni−Co合金で作つたリン
グとを重ねてカーボン治具に入れ、Agろうの融
点以上の温度で溶融してAgろう付封着リングと
なすことを特徴とするAgろう付封着リングの製
造方法。1 Ag-Cu alloy or Ag-Cu alloy with Sn, In, Bi,
An Ag brazing wire made of at least one of Sb and Ga is also bent to form an Ag brazing ring, and this Ag brazing ring is stacked with a ring made of Fe-Ni alloy or Fe-Ni-Co alloy to form a carbon cure. A method for manufacturing an Ag brazed sealing ring, which comprises placing the Ag soldering ring in a filling and melting it at a temperature higher than the melting point of Ag soldering to form an Ag brazed sealing ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12858984A JPS619998A (en) | 1984-06-22 | 1984-06-22 | Production of ag brazing and sealing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12858984A JPS619998A (en) | 1984-06-22 | 1984-06-22 | Production of ag brazing and sealing ring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS619998A JPS619998A (en) | 1986-01-17 |
| JPH0350639B2 true JPH0350639B2 (en) | 1991-08-02 |
Family
ID=14988489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12858984A Granted JPS619998A (en) | 1984-06-22 | 1984-06-22 | Production of ag brazing and sealing ring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619998A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61248536A (en) * | 1985-04-26 | 1986-11-05 | Kyocera Corp | Seal ring for ic ceramic package and manufacture thereof |
| JPS63104355A (en) * | 1986-10-21 | 1988-05-09 | Kyocera Corp | Seal ring of ic ceramic package and manufacture thereof |
| JPH03283549A (en) * | 1990-03-30 | 1991-12-13 | Ngk Insulators Ltd | Ic package |
| JP5067030B2 (en) * | 2007-06-15 | 2012-11-07 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
-
1984
- 1984-06-22 JP JP12858984A patent/JPS619998A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS619998A (en) | 1986-01-17 |
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