JPH0348661B2 - - Google Patents

Info

Publication number
JPH0348661B2
JPH0348661B2 JP59111678A JP11167884A JPH0348661B2 JP H0348661 B2 JPH0348661 B2 JP H0348661B2 JP 59111678 A JP59111678 A JP 59111678A JP 11167884 A JP11167884 A JP 11167884A JP H0348661 B2 JPH0348661 B2 JP H0348661B2
Authority
JP
Japan
Prior art keywords
wiring board
pattern
integrated circuit
heat
metal cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59111678A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60254757A (ja
Inventor
Yoshitaka Fukuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59111678A priority Critical patent/JPS60254757A/ja
Publication of JPS60254757A publication Critical patent/JPS60254757A/ja
Publication of JPH0348661B2 publication Critical patent/JPH0348661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H10W90/00—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59111678A 1984-05-31 1984-05-31 高密度実装回路部品 Granted JPS60254757A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59111678A JPS60254757A (ja) 1984-05-31 1984-05-31 高密度実装回路部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59111678A JPS60254757A (ja) 1984-05-31 1984-05-31 高密度実装回路部品

Publications (2)

Publication Number Publication Date
JPS60254757A JPS60254757A (ja) 1985-12-16
JPH0348661B2 true JPH0348661B2 (enExample) 1991-07-25

Family

ID=14567406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59111678A Granted JPS60254757A (ja) 1984-05-31 1984-05-31 高密度実装回路部品

Country Status (1)

Country Link
JP (1) JPS60254757A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6328054A (ja) * 1986-07-22 1988-02-05 Fujitsu Ltd 高集積部品の放熱構造
US10825821B2 (en) 2015-12-18 2020-11-03 International Business Machines Corporation Cooling and power delivery for a wafer level computing board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875860A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 冷媒封入型半導体装置

Also Published As

Publication number Publication date
JPS60254757A (ja) 1985-12-16

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