JPS60254757A - 高密度実装回路部品 - Google Patents

高密度実装回路部品

Info

Publication number
JPS60254757A
JPS60254757A JP59111678A JP11167884A JPS60254757A JP S60254757 A JPS60254757 A JP S60254757A JP 59111678 A JP59111678 A JP 59111678A JP 11167884 A JP11167884 A JP 11167884A JP S60254757 A JPS60254757 A JP S60254757A
Authority
JP
Japan
Prior art keywords
integrated circuit
metal cap
wiring board
heat
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59111678A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0348661B2 (enExample
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59111678A priority Critical patent/JPS60254757A/ja
Publication of JPS60254757A publication Critical patent/JPS60254757A/ja
Publication of JPH0348661B2 publication Critical patent/JPH0348661B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H10W90/00—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59111678A 1984-05-31 1984-05-31 高密度実装回路部品 Granted JPS60254757A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59111678A JPS60254757A (ja) 1984-05-31 1984-05-31 高密度実装回路部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59111678A JPS60254757A (ja) 1984-05-31 1984-05-31 高密度実装回路部品

Publications (2)

Publication Number Publication Date
JPS60254757A true JPS60254757A (ja) 1985-12-16
JPH0348661B2 JPH0348661B2 (enExample) 1991-07-25

Family

ID=14567406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59111678A Granted JPS60254757A (ja) 1984-05-31 1984-05-31 高密度実装回路部品

Country Status (1)

Country Link
JP (1) JPS60254757A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6328054A (ja) * 1986-07-22 1988-02-05 Fujitsu Ltd 高集積部品の放熱構造
US10825821B2 (en) 2015-12-18 2020-11-03 International Business Machines Corporation Cooling and power delivery for a wafer level computing board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875860A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 冷媒封入型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875860A (ja) * 1981-10-30 1983-05-07 Fujitsu Ltd 冷媒封入型半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6328054A (ja) * 1986-07-22 1988-02-05 Fujitsu Ltd 高集積部品の放熱構造
US10825821B2 (en) 2015-12-18 2020-11-03 International Business Machines Corporation Cooling and power delivery for a wafer level computing board

Also Published As

Publication number Publication date
JPH0348661B2 (enExample) 1991-07-25

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