JPH034395B2 - - Google Patents

Info

Publication number
JPH034395B2
JPH034395B2 JP57066740A JP6674082A JPH034395B2 JP H034395 B2 JPH034395 B2 JP H034395B2 JP 57066740 A JP57066740 A JP 57066740A JP 6674082 A JP6674082 A JP 6674082A JP H034395 B2 JPH034395 B2 JP H034395B2
Authority
JP
Japan
Prior art keywords
thin film
roller
printing method
film printing
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57066740A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58183283A (ja
Inventor
Kozo Matsumura
Minoru Takaochi
Yukio Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP6674082A priority Critical patent/JPS58183283A/ja
Publication of JPS58183283A publication Critical patent/JPS58183283A/ja
Publication of JPH034395B2 publication Critical patent/JPH034395B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Methods (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP6674082A 1982-04-20 1982-04-20 薄膜印刷方法 Granted JPS58183283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6674082A JPS58183283A (ja) 1982-04-20 1982-04-20 薄膜印刷方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6674082A JPS58183283A (ja) 1982-04-20 1982-04-20 薄膜印刷方法

Publications (2)

Publication Number Publication Date
JPS58183283A JPS58183283A (ja) 1983-10-26
JPH034395B2 true JPH034395B2 (enEXAMPLES) 1991-01-22

Family

ID=13324570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6674082A Granted JPS58183283A (ja) 1982-04-20 1982-04-20 薄膜印刷方法

Country Status (1)

Country Link
JP (1) JPS58183283A (enEXAMPLES)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61293851A (ja) * 1985-06-21 1986-12-24 有限会社　柴田工業所 印刷を付した熱可塑性合成樹脂製バンドの製造方法
US5996488A (en) 1994-11-25 1999-12-07 Canon Kabushiki Kaisha Preparation of an electron source by offset printing electrodes having thickness less than 200 nm
KR101296663B1 (ko) * 2009-07-09 2013-08-14 엘지디스플레이 주식회사 인쇄 장치
JP5929396B2 (ja) * 2012-03-23 2016-06-08 凸版印刷株式会社 配線基板の製造方法
JP2019155652A (ja) * 2018-03-09 2019-09-19 シャープ株式会社 印刷基板の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6047425B2 (ja) * 1978-08-31 1985-10-22 ナショナル住宅産業株式会社 母屋取付装置

Also Published As

Publication number Publication date
JPS58183283A (ja) 1983-10-26

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