JPH0343756Y2 - - Google Patents
Info
- Publication number
- JPH0343756Y2 JPH0343756Y2 JP2906987U JP2906987U JPH0343756Y2 JP H0343756 Y2 JPH0343756 Y2 JP H0343756Y2 JP 2906987 U JP2906987 U JP 2906987U JP 2906987 U JP2906987 U JP 2906987U JP H0343756 Y2 JPH0343756 Y2 JP H0343756Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- electronic component
- generating electronic
- board
- fpc board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005192 partition Methods 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 16
- 210000002105 tongue Anatomy 0.000 description 32
- 230000005855 radiation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 102100025490 Slit homolog 1 protein Human genes 0.000 description 1
- 101710123186 Slit homolog 1 protein Proteins 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Details Of Resistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2906987U JPH0343756Y2 (US06252093-20010626-C00008.png) | 1987-02-28 | 1987-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2906987U JPH0343756Y2 (US06252093-20010626-C00008.png) | 1987-02-28 | 1987-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63137997U JPS63137997U (US06252093-20010626-C00008.png) | 1988-09-12 |
| JPH0343756Y2 true JPH0343756Y2 (US06252093-20010626-C00008.png) | 1991-09-12 |
Family
ID=30832621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2906987U Expired JPH0343756Y2 (US06252093-20010626-C00008.png) | 1987-02-28 | 1987-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343756Y2 (US06252093-20010626-C00008.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004521281A (ja) * | 2000-12-15 | 2004-07-15 | シーメンス ヴィディーオー オートモーティヴ コーポレイション | メカトロニクスセンサーの組立て方法 |
-
1987
- 1987-02-28 JP JP2906987U patent/JPH0343756Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004521281A (ja) * | 2000-12-15 | 2004-07-15 | シーメンス ヴィディーオー オートモーティヴ コーポレイション | メカトロニクスセンサーの組立て方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63137997U (US06252093-20010626-C00008.png) | 1988-09-12 |
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