JPH0337466B2 - - Google Patents
Info
- Publication number
- JPH0337466B2 JPH0337466B2 JP58002857A JP285783A JPH0337466B2 JP H0337466 B2 JPH0337466 B2 JP H0337466B2 JP 58002857 A JP58002857 A JP 58002857A JP 285783 A JP285783 A JP 285783A JP H0337466 B2 JPH0337466 B2 JP H0337466B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- leadless
- positioning
- leadless component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000005476 soldering Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58002857A JPS59127968A (ja) | 1983-01-13 | 1983-01-13 | リ−ドレス部品の位置決め治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58002857A JPS59127968A (ja) | 1983-01-13 | 1983-01-13 | リ−ドレス部品の位置決め治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59127968A JPS59127968A (ja) | 1984-07-23 |
| JPH0337466B2 true JPH0337466B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-05 |
Family
ID=11541050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58002857A Granted JPS59127968A (ja) | 1983-01-13 | 1983-01-13 | リ−ドレス部品の位置決め治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59127968A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0647091A1 (en) * | 1993-10-05 | 1995-04-05 | AT&T Corp. | Passive alignment of components with micromachined tool |
| JP4770503B2 (ja) * | 2006-02-15 | 2011-09-14 | トヨタ自動車株式会社 | ロウ付け接合構造体およびその接合方法 |
| JP5274489B2 (ja) * | 2010-01-13 | 2013-08-28 | Ｃｋｄ株式会社 | ハンダ付け装置及びこれを用いたランプの製造方法 |
| CN102935537A (zh) * | 2012-07-27 | 2013-02-20 | 西安永电电气有限责任公司 | 基于IGBT的n形电极焊接工装结构及焊接方法 |
-
1983
- 1983-01-13 JP JP58002857A patent/JPS59127968A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59127968A (ja) | 1984-07-23 |