JPH0334914Y2 - - Google Patents
Info
- Publication number
- JPH0334914Y2 JPH0334914Y2 JP4096685U JP4096685U JPH0334914Y2 JP H0334914 Y2 JPH0334914 Y2 JP H0334914Y2 JP 4096685 U JP4096685 U JP 4096685U JP 4096685 U JP4096685 U JP 4096685U JP H0334914 Y2 JPH0334914 Y2 JP H0334914Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- heat
- semiconductor element
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 28
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096685U JPH0334914Y2 (ko) | 1985-03-20 | 1985-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096685U JPH0334914Y2 (ko) | 1985-03-20 | 1985-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61157336U JPS61157336U (ko) | 1986-09-30 |
| JPH0334914Y2 true JPH0334914Y2 (ko) | 1991-07-24 |
Family
ID=30550350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4096685U Expired JPH0334914Y2 (ko) | 1985-03-20 | 1985-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334914Y2 (ko) |
-
1985
- 1985-03-20 JP JP4096685U patent/JPH0334914Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61157336U (ko) | 1986-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002290087A (ja) | オンボード実装型電子機器およびオンボード実装型電源装置 | |
| US6351385B1 (en) | Heat sink for integrated circuit packages | |
| US5757619A (en) | Cooling apparatus for electronic components | |
| JPH09283886A (ja) | 基板実装方法及び実装基板構造並びに該実装基板構造を用いた電子機器 | |
| JPH0334914Y2 (ko) | ||
| JPH0736468U (ja) | 電子部品の放熱構造 | |
| JP2536470Y2 (ja) | プリント基盤固定構造 | |
| JPH09102685A (ja) | 電子装置の放熱構造 | |
| JP2612455B2 (ja) | 半導体素子搭載用基板 | |
| JPH10224065A (ja) | 電子回路の放熱構造 | |
| JP2003152365A (ja) | 電子回路パッケージの冷却構造及びヒートシンク | |
| JP2575953Y2 (ja) | 半導体部品取付構造 | |
| JPS6228773Y2 (ko) | ||
| JPH039335Y2 (ko) | ||
| JPH0412684Y2 (ko) | ||
| JP2002033428A (ja) | 放熱板固定端子 | |
| JPH0810230Y2 (ja) | 電気部品と放熱体の取付構造 | |
| JPS6246270Y2 (ko) | ||
| JPH0222956Y2 (ko) | ||
| JPH11289036A (ja) | 電子装置 | |
| JPH1093270A (ja) | 表面実装素子の放熱構造 | |
| JPS598364Y2 (ja) | 電子機器用絶縁ケ−ス | |
| JPS6144443Y2 (ko) | ||
| JPS621251A (ja) | 放熱フインの構造 | |
| JPH10144834A (ja) | 電子部品用放熱装置とその組立方法 |