JPH0334909Y2 - - Google Patents

Info

Publication number
JPH0334909Y2
JPH0334909Y2 JP1985082300U JP8230085U JPH0334909Y2 JP H0334909 Y2 JPH0334909 Y2 JP H0334909Y2 JP 1985082300 U JP1985082300 U JP 1985082300U JP 8230085 U JP8230085 U JP 8230085U JP H0334909 Y2 JPH0334909 Y2 JP H0334909Y2
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
cap
plate frame
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985082300U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61199052U (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985082300U priority Critical patent/JPH0334909Y2/ja
Publication of JPS61199052U publication Critical patent/JPS61199052U/ja
Application granted granted Critical
Publication of JPH0334909Y2 publication Critical patent/JPH0334909Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1985082300U 1985-05-31 1985-05-31 Expired JPH0334909Y2 (OSRAM)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985082300U JPH0334909Y2 (OSRAM) 1985-05-31 1985-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985082300U JPH0334909Y2 (OSRAM) 1985-05-31 1985-05-31

Publications (2)

Publication Number Publication Date
JPS61199052U JPS61199052U (OSRAM) 1986-12-12
JPH0334909Y2 true JPH0334909Y2 (OSRAM) 1991-07-24

Family

ID=30629893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985082300U Expired JPH0334909Y2 (OSRAM) 1985-05-31 1985-05-31

Country Status (1)

Country Link
JP (1) JPH0334909Y2 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540711B2 (ja) * 2010-01-13 2014-07-02 富士通株式会社 電子装置及びその製造方法
JP5463244B2 (ja) * 2010-08-31 2014-04-09 日立ビークルエナジー株式会社 部品実装基板
EP3499559B1 (en) 2016-08-10 2023-11-22 Kyocera Corporation Package for mounting electrical element, array package and electrical device

Also Published As

Publication number Publication date
JPS61199052U (OSRAM) 1986-12-12

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