JPH0330977B2 - - Google Patents
Info
- Publication number
- JPH0330977B2 JPH0330977B2 JP60068768A JP6876885A JPH0330977B2 JP H0330977 B2 JPH0330977 B2 JP H0330977B2 JP 60068768 A JP60068768 A JP 60068768A JP 6876885 A JP6876885 A JP 6876885A JP H0330977 B2 JPH0330977 B2 JP H0330977B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- resin
- insulating resin
- type capacitor
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 33
- 229920005989 resin Polymers 0.000 claims description 33
- 239000003990 capacitor Substances 0.000 claims description 28
- 238000000605 extraction Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6876885A JPS60220922A (ja) | 1985-04-01 | 1985-04-01 | チツプ型コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6876885A JPS60220922A (ja) | 1985-04-01 | 1985-04-01 | チツプ型コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60220922A JPS60220922A (ja) | 1985-11-05 |
| JPH0330977B2 true JPH0330977B2 (US07922777-20110412-C00004.png) | 1991-05-01 |
Family
ID=13383240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6876885A Granted JPS60220922A (ja) | 1985-04-01 | 1985-04-01 | チツプ型コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60220922A (US07922777-20110412-C00004.png) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61202412A (ja) * | 1985-03-06 | 1986-09-08 | 松下電器産業株式会社 | チツプ状電子部品 |
| JP2766446B2 (ja) * | 1993-05-12 | 1998-06-18 | ローム株式会社 | 固体電解コンデンサーの構造 |
| JP2774921B2 (ja) * | 1993-05-12 | 1998-07-09 | ローム株式会社 | パッケージ型固体電解コンデンサー |
| JP3150244B2 (ja) * | 1993-07-09 | 2001-03-26 | ローム株式会社 | 固体電解コンデンサにおけるコンデンサ素子の構造 |
| US5638253A (en) * | 1994-04-28 | 1997-06-10 | Rohm Co. Ltd. | Package-type solid electrolytic capacitor |
| JPH0831687A (ja) * | 1994-07-19 | 1996-02-02 | Nec Corp | 角型チップ状電子部品 |
| US6785124B2 (en) | 2002-05-20 | 2004-08-31 | Rohm Co., Ltd. | Capacitor element for solid electrolytic capacitor, process of making the same and solid electrolytic capacitor utilizing the capacitor element |
| JP2006086348A (ja) | 2004-09-16 | 2006-03-30 | Rohm Co Ltd | 固体電解コンデンサにおけるコンデンサ素子及びその製造方法 |
| US20220028622A1 (en) * | 2018-11-30 | 2022-01-27 | Panasonic Intellectual Property Management Co., Ltd. | Electrolytic capacitor and method for producing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104171A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Mold for semiconductor device |
| JPS5664446A (en) * | 1979-10-29 | 1981-06-01 | Peshitsuku:Kk | Method of molding synthetic resin insert for metal terminal, metal terminal and mold |
| JPS56140619A (en) * | 1980-04-02 | 1981-11-04 | Matsushita Electric Ind Co Ltd | Chip-shaped solid electrolytic condenser and method of manufacturing same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49102945U (US07922777-20110412-C00004.png) * | 1972-12-26 | 1974-09-04 | ||
| JPS49114447U (US07922777-20110412-C00004.png) * | 1973-01-27 | 1974-09-30 | ||
| JPS54176845U (US07922777-20110412-C00004.png) * | 1978-06-02 | 1979-12-13 | ||
| JPS6244521Y2 (US07922777-20110412-C00004.png) * | 1978-11-25 | 1987-11-25 | ||
| JPS6018837Y2 (ja) * | 1980-03-17 | 1985-06-07 | 松下電器産業株式会社 | チップ状固体電解コンデンサ |
-
1985
- 1985-04-01 JP JP6876885A patent/JPS60220922A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53104171A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Mold for semiconductor device |
| JPS5664446A (en) * | 1979-10-29 | 1981-06-01 | Peshitsuku:Kk | Method of molding synthetic resin insert for metal terminal, metal terminal and mold |
| JPS56140619A (en) * | 1980-04-02 | 1981-11-04 | Matsushita Electric Ind Co Ltd | Chip-shaped solid electrolytic condenser and method of manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60220922A (ja) | 1985-11-05 |
