JPH0327301B2 - - Google Patents
Info
- Publication number
- JPH0327301B2 JPH0327301B2 JP60131062A JP13106285A JPH0327301B2 JP H0327301 B2 JPH0327301 B2 JP H0327301B2 JP 60131062 A JP60131062 A JP 60131062A JP 13106285 A JP13106285 A JP 13106285A JP H0327301 B2 JPH0327301 B2 JP H0327301B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- tank
- jet
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 47
- 238000005476 soldering Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 7
- 238000005192 partition Methods 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13106285A JPS61289965A (ja) | 1985-06-17 | 1985-06-17 | 噴流式ハンダ槽 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13106285A JPS61289965A (ja) | 1985-06-17 | 1985-06-17 | 噴流式ハンダ槽 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61289965A JPS61289965A (ja) | 1986-12-19 |
JPH0327301B2 true JPH0327301B2 (fr) | 1991-04-15 |
Family
ID=15049113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13106285A Granted JPS61289965A (ja) | 1985-06-17 | 1985-06-17 | 噴流式ハンダ槽 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61289965A (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01215520A (ja) * | 1988-02-24 | 1989-08-29 | Toyota Motor Corp | 反応射出成形方法およびその装置 |
JP2687218B2 (ja) * | 1988-03-11 | 1997-12-08 | 千住金属工業株式会社 | プリント基板のはんだ付け方法 |
JPH01238096A (ja) * | 1988-03-18 | 1989-09-22 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法 |
JPH01266792A (ja) * | 1988-04-19 | 1989-10-24 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法および装置 |
JPH0811077Y2 (ja) * | 1990-08-07 | 1996-03-29 | 小松技研株式会社 | 噴流式はんだ付け装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56114574A (en) * | 1980-02-14 | 1981-09-09 | Matsushita Electric Ind Co Ltd | Jet type soldering device |
JPS5744434A (en) * | 1980-08-28 | 1982-03-12 | Nippon Alum Mfg Co Ltd:The | Aging apparatus of piece coated with sealing agent |
JPS5851472B2 (ja) * | 1976-02-25 | 1983-11-16 | ケイディディ株式会社 | テレビジヨン信号の1ライン間予測符号化方式 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851472U (ja) * | 1981-10-05 | 1983-04-07 | クラリオン株式会社 | 自動はんだ付け装置 |
-
1985
- 1985-06-17 JP JP13106285A patent/JPS61289965A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5851472B2 (ja) * | 1976-02-25 | 1983-11-16 | ケイディディ株式会社 | テレビジヨン信号の1ライン間予測符号化方式 |
JPS56114574A (en) * | 1980-02-14 | 1981-09-09 | Matsushita Electric Ind Co Ltd | Jet type soldering device |
JPS5744434A (en) * | 1980-08-28 | 1982-03-12 | Nippon Alum Mfg Co Ltd:The | Aging apparatus of piece coated with sealing agent |
Also Published As
Publication number | Publication date |
---|---|
JPS61289965A (ja) | 1986-12-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102365910B (zh) | 局部喷流锡焊装置及局部喷流锡焊方法 | |
JPH08507254A (ja) | ガスナイフジェットを備えるはんだノズル | |
US4402448A (en) | Mass soldering system | |
US4401253A (en) | Mass soldering system | |
US4410126A (en) | Mass soldering system | |
EP3183086A1 (fr) | Machine de buse de brasage tendre à la vague, système de buse de brasage tendre à la vague et procédé de brasage tendre à la vague | |
JPH10258357A (ja) | ガス雰囲気形成装置およびガス雰囲気はんだ付け装置 | |
US4709846A (en) | Apparatus for the continuous hot tinning of printed circuit boards | |
JPH10113765A (ja) | ウェーブろう付けまたは錫めっきの機械、その方法および不活性化装置 | |
US4072777A (en) | Method and apparatus for forming a uniform solder wave | |
JP2001196734A (ja) | 半田噴流装置および半田付け方法 | |
JPH0327301B2 (fr) | ||
JPS63268563A (ja) | 印刷配線回路板をはんだでマス結合する装置 | |
JPH0216858Y2 (fr) | ||
EP0045909B1 (fr) | Méthode et appareil à souder | |
JP2000323826A (ja) | 噴流はんだ槽 | |
JPH0134712B2 (fr) | ||
US4375271A (en) | Soldering method for electric and or electronic component | |
JP2001044613A (ja) | はんだ噴流装置およびはんだ付け方法 | |
USRE32982E (en) | Mass soldering system | |
JPH02187261A (ja) | 半田槽 | |
JPS59159264A (ja) | 半田付け装置 | |
JP2002043732A (ja) | 噴流はんだ槽 | |
JPH0513029B2 (fr) | ||
JPS61281592A (ja) | 電気部品のハンダ付け方法 |