JPH0325023B2 - - Google Patents

Info

Publication number
JPH0325023B2
JPH0325023B2 JP59043026A JP4302684A JPH0325023B2 JP H0325023 B2 JPH0325023 B2 JP H0325023B2 JP 59043026 A JP59043026 A JP 59043026A JP 4302684 A JP4302684 A JP 4302684A JP H0325023 B2 JPH0325023 B2 JP H0325023B2
Authority
JP
Japan
Prior art keywords
layer
chip
base
semiconductor chip
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59043026A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59201449A (ja
Inventor
Eru Sutenaason Geirii
Jei Miraa Toomasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PURINTETSUDO SAAKITSUTSU INTERN Inc
Original Assignee
PURINTETSUDO SAAKITSUTSU INTERN Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PURINTETSUDO SAAKITSUTSU INTERN Inc filed Critical PURINTETSUDO SAAKITSUTSU INTERN Inc
Publication of JPS59201449A publication Critical patent/JPS59201449A/ja
Publication of JPH0325023B2 publication Critical patent/JPH0325023B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/05—
    • H10W40/10—
    • H10W70/611—
    • H10W70/635—
    • H10W70/685—
    • H10W90/00—
    • H10W70/682—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP59043026A 1983-03-09 1984-03-08 ヒ−トシンクを有する半導体チツプ担体パツケ−ジ及びその製造方法 Granted JPS59201449A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/473,482 US4630172A (en) 1983-03-09 1983-03-09 Semiconductor chip carrier package with a heat sink
US473482 1983-03-09

Publications (2)

Publication Number Publication Date
JPS59201449A JPS59201449A (ja) 1984-11-15
JPH0325023B2 true JPH0325023B2 (enExample) 1991-04-04

Family

ID=23879710

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59043026A Granted JPS59201449A (ja) 1983-03-09 1984-03-08 ヒ−トシンクを有する半導体チツプ担体パツケ−ジ及びその製造方法

Country Status (3)

Country Link
US (1) US4630172A (enExample)
JP (1) JPS59201449A (enExample)
GB (1) GB2136205A (enExample)

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CN120933250B (zh) * 2025-10-16 2026-01-16 纳宇半导体材料(宁波)有限责任公司 一种嵌入式功率芯片封装结构及其制备方法

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Also Published As

Publication number Publication date
JPS59201449A (ja) 1984-11-15
US4630172A (en) 1986-12-16
GB2136205A (en) 1984-09-12
GB8405827D0 (en) 1984-04-11

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