JPH0322915Y2 - - Google Patents

Info

Publication number
JPH0322915Y2
JPH0322915Y2 JP1985037899U JP3789985U JPH0322915Y2 JP H0322915 Y2 JPH0322915 Y2 JP H0322915Y2 JP 1985037899 U JP1985037899 U JP 1985037899U JP 3789985 U JP3789985 U JP 3789985U JP H0322915 Y2 JPH0322915 Y2 JP H0322915Y2
Authority
JP
Japan
Prior art keywords
semiconductor chip
chip carrier
film
base
fine wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985037899U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61156244U (enEXAMPLES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985037899U priority Critical patent/JPH0322915Y2/ja
Publication of JPS61156244U publication Critical patent/JPS61156244U/ja
Application granted granted Critical
Publication of JPH0322915Y2 publication Critical patent/JPH0322915Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1985037899U 1985-03-16 1985-03-16 Expired JPH0322915Y2 (enEXAMPLES)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985037899U JPH0322915Y2 (enEXAMPLES) 1985-03-16 1985-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985037899U JPH0322915Y2 (enEXAMPLES) 1985-03-16 1985-03-16

Publications (2)

Publication Number Publication Date
JPS61156244U JPS61156244U (enEXAMPLES) 1986-09-27
JPH0322915Y2 true JPH0322915Y2 (enEXAMPLES) 1991-05-20

Family

ID=30544405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985037899U Expired JPH0322915Y2 (enEXAMPLES) 1985-03-16 1985-03-16

Country Status (1)

Country Link
JP (1) JPH0322915Y2 (enEXAMPLES)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2532039B2 (ja) * 1987-05-29 1996-09-11 新光電気工業株式会社 高周波用半導体装置
US4912547A (en) * 1989-01-30 1990-03-27 International Business Machines Corporation Tape bonded semiconductor device
JP2839083B2 (ja) * 1996-03-19 1998-12-16 日本電気株式会社 半導体装置

Also Published As

Publication number Publication date
JPS61156244U (enEXAMPLES) 1986-09-27

Similar Documents

Publication Publication Date Title
US3683241A (en) Radio frequency transistor package
JPS5839038A (ja) 半導体チツプ担持体
JPH0321089B2 (enEXAMPLES)
JP3158621B2 (ja) マルチチップモジュール
JPS60161641A (ja) 回路パツケージとその製造方法
JPH0322915Y2 (enEXAMPLES)
JP3741274B2 (ja) 半導体装置
US5504986A (en) Method of manufacturing collinear terminated transmission line structure with thick film circuitry
JPH05226500A (ja) 実装回路基板
JP3170017B2 (ja) 半導体装置
JPS62269349A (ja) 半導体装置
JPS6348129Y2 (enEXAMPLES)
JP2004153795A (ja) 伝送路
JPH066512Y2 (ja) 集積回路パツケ−ジ
JP2637975B2 (ja) 半導体装置用パツケージ
JPH0334911Y2 (enEXAMPLES)
JPH071844Y2 (ja) 集積回路パツケ−ジ
JPH05166965A (ja) パッケージ構造体
JPS63257306A (ja) 半導体集積回路パツケ−ジ
JPH0126109Y2 (enEXAMPLES)
JPH03110768A (ja) 配線パターン接続用チップ
JPH0427170Y2 (enEXAMPLES)
JPH0121564Y2 (enEXAMPLES)
JPS61108152A (ja) Ｉｃチツプ用パツケ−ジ
JPH07114217B2 (ja) テープキャリア方式の半導体装置