JPH0322698B2 - - Google Patents
Info
- Publication number
- JPH0322698B2 JPH0322698B2 JP15060884A JP15060884A JPH0322698B2 JP H0322698 B2 JPH0322698 B2 JP H0322698B2 JP 15060884 A JP15060884 A JP 15060884A JP 15060884 A JP15060884 A JP 15060884A JP H0322698 B2 JPH0322698 B2 JP H0322698B2
- Authority
- JP
- Japan
- Prior art keywords
- case
- semiconductor
- section
- semiconductor device
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000008188 pellet Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15060884A JPS6130041A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置組立装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15060884A JPS6130041A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置組立装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6130041A JPS6130041A (ja) | 1986-02-12 |
JPH0322698B2 true JPH0322698B2 (ko) | 1991-03-27 |
Family
ID=15500600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15060884A Granted JPS6130041A (ja) | 1984-07-20 | 1984-07-20 | 半導体装置組立装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6130041A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6156078A (en) * | 1991-09-16 | 2000-12-05 | Sgs-Thomson Microelectronics Sdn. Bhd. | Testing and finishing apparatus for integrated circuit package units |
JP3499375B2 (ja) * | 1996-07-02 | 2004-02-23 | ユニ・チャーム株式会社 | 吸収シートおよびその製造方法 |
JP3675601B2 (ja) * | 1996-09-12 | 2005-07-27 | ユニ・チャーム株式会社 | 吸収体 |
JP4599063B2 (ja) | 2004-01-15 | 2010-12-15 | 株式会社東芝 | コイル巻回用絶縁テープ |
-
1984
- 1984-07-20 JP JP15060884A patent/JPS6130041A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6130041A (ja) | 1986-02-12 |
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