JPH0322698B2 - - Google Patents

Info

Publication number
JPH0322698B2
JPH0322698B2 JP15060884A JP15060884A JPH0322698B2 JP H0322698 B2 JPH0322698 B2 JP H0322698B2 JP 15060884 A JP15060884 A JP 15060884A JP 15060884 A JP15060884 A JP 15060884A JP H0322698 B2 JPH0322698 B2 JP H0322698B2
Authority
JP
Japan
Prior art keywords
case
semiconductor
section
semiconductor device
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15060884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130041A (ja
Inventor
Kazuya Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP15060884A priority Critical patent/JPS6130041A/ja
Publication of JPS6130041A publication Critical patent/JPS6130041A/ja
Publication of JPH0322698B2 publication Critical patent/JPH0322698B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP15060884A 1984-07-20 1984-07-20 半導体装置組立装置 Granted JPS6130041A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15060884A JPS6130041A (ja) 1984-07-20 1984-07-20 半導体装置組立装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15060884A JPS6130041A (ja) 1984-07-20 1984-07-20 半導体装置組立装置

Publications (2)

Publication Number Publication Date
JPS6130041A JPS6130041A (ja) 1986-02-12
JPH0322698B2 true JPH0322698B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1991-03-27

Family

ID=15500600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15060884A Granted JPS6130041A (ja) 1984-07-20 1984-07-20 半導体装置組立装置

Country Status (1)

Country Link
JP (1) JPS6130041A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156078A (en) * 1991-09-16 2000-12-05 Sgs-Thomson Microelectronics Sdn. Bhd. Testing and finishing apparatus for integrated circuit package units
JP3499375B2 (ja) * 1996-07-02 2004-02-23 ユニ・チャーム株式会社 吸収シートおよびその製造方法
JP3675601B2 (ja) * 1996-09-12 2005-07-27 ユニ・チャーム株式会社 吸収体
JP4599063B2 (ja) * 2004-01-15 2010-12-15 株式会社東芝 コイル巻回用絶縁テープ

Also Published As

Publication number Publication date
JPS6130041A (ja) 1986-02-12

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