JPH0322686B2 - - Google Patents
Info
- Publication number
- JPH0322686B2 JPH0322686B2 JP9028682A JP9028682A JPH0322686B2 JP H0322686 B2 JPH0322686 B2 JP H0322686B2 JP 9028682 A JP9028682 A JP 9028682A JP 9028682 A JP9028682 A JP 9028682A JP H0322686 B2 JPH0322686 B2 JP H0322686B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- mask
- frame
- patterned
- ray exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 239000010453 quartz Substances 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57090286A JPS58207048A (ja) | 1982-05-27 | 1982-05-27 | マスクの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57090286A JPS58207048A (ja) | 1982-05-27 | 1982-05-27 | マスクの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58207048A JPS58207048A (ja) | 1983-12-02 |
JPH0322686B2 true JPH0322686B2 (en)van) | 1991-03-27 |
Family
ID=13994275
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57090286A Granted JPS58207048A (ja) | 1982-05-27 | 1982-05-27 | マスクの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58207048A (en)van) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100674991B1 (ko) | 2005-09-02 | 2007-01-29 | 삼성전자주식회사 | 토폴로지를 갖는 보상층을 구비한 바이너리 포토 마스크 및그 제조방법 |
KR100734318B1 (ko) | 2006-06-12 | 2007-07-02 | 삼성전자주식회사 | 포토 마스크의 cd 보정 방법 및 cd가 보정된 포토마스크 |
-
1982
- 1982-05-27 JP JP57090286A patent/JPS58207048A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58207048A (ja) | 1983-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5851412B2 (ja) | 半導体装置の微細加工方法 | |
JPH0322686B2 (en)van) | ||
JPS6377122A (ja) | 半導体装置の製造方法 | |
JP4333107B2 (ja) | 転写マスク及び露光方法 | |
JPS5923105B2 (ja) | 軟x線露光用マスクの製造方法 | |
KR19980024346A (ko) | 전하빔 묘화장치용 애퍼추어 및 그 제조방법 | |
JP4983313B2 (ja) | 転写マスクおよびその製造方法 | |
JPH0345526B2 (en)van) | ||
JPS641926B2 (en)van) | ||
JPH04324613A (ja) | ウエハの貼り合わせ方法 | |
JPS5931027A (ja) | X線マスクの製造方法 | |
JPS5923104B2 (ja) | 軟x線露光用マスクの製造方法 | |
JPS59163825A (ja) | X線露光マスクおよびその製造方法 | |
JPS63202034A (ja) | 半導体装置の製造方法 | |
JPS631740B2 (en)van) | ||
KR20040095731A (ko) | 하전 입자선 노광용 마스크 및 그 제조 방법 | |
JPS6061750A (ja) | X線露光マスクの製造方法 | |
JPS5918860B2 (ja) | ハンドウタイソウチノセイゾウホウホウ | |
JPS582027A (ja) | X線露光用マスク | |
JPS5929420A (ja) | X線マスクの製造方法 | |
JPH0365652B2 (en)van) | ||
JPS63244627A (ja) | 半導体装置の製造方法 | |
JPS58207047A (ja) | マスクの製造方法 | |
JPS5931026A (ja) | X線マスクの製造方法 | |
JPS60231331A (ja) | リフトオフ・パタ−ンの形成方法 |