JPH0321854U - - Google Patents

Info

Publication number
JPH0321854U
JPH0321854U JP8203489U JP8203489U JPH0321854U JP H0321854 U JPH0321854 U JP H0321854U JP 8203489 U JP8203489 U JP 8203489U JP 8203489 U JP8203489 U JP 8203489U JP H0321854 U JPH0321854 U JP H0321854U
Authority
JP
Japan
Prior art keywords
lead terminal
semiconductor device
semiconductor chip
molded part
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8203489U
Other languages
English (en)
Other versions
JP2512441Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989082034U priority Critical patent/JP2512441Y2/ja
Publication of JPH0321854U publication Critical patent/JPH0321854U/ja
Application granted granted Critical
Publication of JP2512441Y2 publication Critical patent/JP2512441Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図〜第４図は本考案の実施例を示し、第１
図はダイオードの縦断正面図、第２図は第１図の
底面図、第３図はトランジスタの縦断正面図、第
４図は第３図の底面図、第５図は従来の半導体装
置の縦断正面図である。 １１，１１′……半導体チツプ、１２，１２′
，１２″，１３，１３′……リード端子、１２ａ
，１３ａ……内部リード端子部、１２ｂ，１３ｂ
……外部リード端子部、１４，１４′……モール
ド部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプに体して電気的に接続する少なく
    とも左右一対のリード端子を、合成樹脂製のモー
    ルド部内において内部リード端子部と、前記モー
    ルド部の底面に沿つてモールド部の左右両側面よ
    り突出する外部リード端子部とに屈曲して成る半
    導体装置において、前記各リード端子における内
    部リード端子部を、互いに重ね合せて、その間の
    部分に前記半導体チツプを挿入し、該半導体チツ
    プを前記各内部リード端子部に対して接続したこ
    とを特徴とする合成樹脂封止型半導体装置。
JP1989082034U 1989-07-11 1989-07-11 合成樹脂封止型半導体装置 Expired - Lifetime JP2512441Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989082034U JP2512441Y2 (ja) 1989-07-11 1989-07-11 合成樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989082034U JP2512441Y2 (ja) 1989-07-11 1989-07-11 合成樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPH0321854U true JPH0321854U (ja) 1991-03-05
JP2512441Y2 JP2512441Y2 (ja) 1996-10-02

Family

ID=31628492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989082034U Expired - Lifetime JP2512441Y2 (ja) 1989-07-11 1989-07-11 合成樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JP2512441Y2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001031704A1 (fr) * 1999-10-28 2001-05-03 Rohm Co., Ltd. Dispositif a semi-conducteurs
JP2002217349A (ja) * 2001-01-17 2002-08-02 Rohm Co Ltd 半導体装置の製造方法および半導体装置
JP2010212736A (ja) * 1999-10-28 2010-09-24 Rohm Co Ltd 半導体装置
JP2014135324A (ja) * 2013-01-08 2014-07-24 Joek Kim リード線が改良されたダイオードパッケージ及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device
JPS58216448A (ja) * 1982-06-09 1983-12-16 Hitachi Ltd 半導体装置及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device
JPS58216448A (ja) * 1982-06-09 1983-12-16 Hitachi Ltd 半導体装置及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001031704A1 (fr) * 1999-10-28 2001-05-03 Rohm Co., Ltd. Dispositif a semi-conducteurs
JP2001196518A (ja) * 1999-10-28 2001-07-19 Rohm Co Ltd 半導体装置
JP2010212736A (ja) * 1999-10-28 2010-09-24 Rohm Co Ltd 半導体装置
JP4651153B2 (ja) * 1999-10-28 2011-03-16 ローム株式会社 半導体装置
JP2002217349A (ja) * 2001-01-17 2002-08-02 Rohm Co Ltd 半導体装置の製造方法および半導体装置
JP4494654B2 (ja) * 2001-01-17 2010-06-30 ローム株式会社 半導体装置の製造方法および半導体装置
JP2014135324A (ja) * 2013-01-08 2014-07-24 Joek Kim リード線が改良されたダイオードパッケージ及びその製造方法

Also Published As

Publication number Publication date
JP2512441Y2 (ja) 1996-10-02

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term