JPH0321117B2 - - Google Patents
Info
- Publication number
- JPH0321117B2 JPH0321117B2 JP59240130A JP24013084A JPH0321117B2 JP H0321117 B2 JPH0321117 B2 JP H0321117B2 JP 59240130 A JP59240130 A JP 59240130A JP 24013084 A JP24013084 A JP 24013084A JP H0321117 B2 JPH0321117 B2 JP H0321117B2
- Authority
- JP
- Japan
- Prior art keywords
- gripping member
- rotating frame
- electronic component
- electronic components
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001105 regulatory effect Effects 0.000 description 6
- 238000007689 inspection Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Specific Conveyance Elements (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59240130A JPS61119100A (ja) | 1984-11-14 | 1984-11-14 | 電子部品の装着装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59240130A JPS61119100A (ja) | 1984-11-14 | 1984-11-14 | 電子部品の装着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61119100A JPS61119100A (ja) | 1986-06-06 |
JPH0321117B2 true JPH0321117B2 (fr) | 1991-03-20 |
Family
ID=17054941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59240130A Granted JPS61119100A (ja) | 1984-11-14 | 1984-11-14 | 電子部品の装着装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61119100A (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63232496A (ja) * | 1987-03-20 | 1988-09-28 | 松下電器産業株式会社 | 電子部品装着装置 |
JP2001163435A (ja) * | 1999-12-14 | 2001-06-19 | Nitto Kogyo Co Ltd | チップの設定面整列搬送装置 |
JP5681604B2 (ja) * | 2011-09-28 | 2015-03-11 | 株式会社フジキカイ | 物品搬送装置 |
-
1984
- 1984-11-14 JP JP59240130A patent/JPS61119100A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61119100A (ja) | 1986-06-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH07105637B2 (ja) | 部品装着装置 | |
JP2000288969A (ja) | 表面実装機のマウンタヘッド | |
JPH0245360B2 (fr) | ||
JPS6136938A (ja) | 半導体デバイスのボンデイング装置 | |
JPH0321117B2 (fr) | ||
JP2004103653A (ja) | ダイボンダ | |
JP3262683B2 (ja) | 半導体実装装置 | |
KR100445530B1 (ko) | 반도체장치 | |
JPH0715181A (ja) | 電子部品装着装置 | |
CN113471107B (zh) | 固晶机及固晶方法 | |
JP2002239850A (ja) | ハンドリング装置およびこのハンドリング装置を用いた部品組立装置 | |
JP3961083B2 (ja) | 電子部品搭載装置 | |
JP2636285B2 (ja) | 電子部品装着装置 | |
JPH0321116B2 (fr) | ||
JPS5917975B2 (ja) | 自動ワイヤレスボンディング装置 | |
JPH03289197A (ja) | 電子部品実装装置 | |
JP4765199B2 (ja) | 部品実装装置 | |
KR200262970Y1 (ko) | 표면실장기의 마운팅 헤드 | |
JPH0513993A (ja) | 電子部品装着ヘツド | |
JPS6260299A (ja) | 部品の装着方法とその装置 | |
JPH0680946B2 (ja) | 電子部品の角度規正装置 | |
JP3901804B2 (ja) | 部品装着ヘッド及び部品装着装置 | |
JP3953240B2 (ja) | 電子部品装着方法 | |
JPH0927698A (ja) | ワークの装着装置および装着方法 | |
JP2978980B2 (ja) | 自動組立装置およびそのための部品供給方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |