JPH0320478B2 - - Google Patents

Info

Publication number
JPH0320478B2
JPH0320478B2 JP3415987A JP3415987A JPH0320478B2 JP H0320478 B2 JPH0320478 B2 JP H0320478B2 JP 3415987 A JP3415987 A JP 3415987A JP 3415987 A JP3415987 A JP 3415987A JP H0320478 B2 JPH0320478 B2 JP H0320478B2
Authority
JP
Japan
Prior art keywords
copper
salts
zinc
acid
salt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3415987A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63203790A (ja
Inventor
Yutaka Fujiwara
Hidehiko Enomoto
Yoshiji Shimizu
Masa Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shimizu Co Ltd
Original Assignee
Shimizu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimizu Co Ltd filed Critical Shimizu Co Ltd
Priority to JP3415987A priority Critical patent/JPS63203790A/ja
Publication of JPS63203790A publication Critical patent/JPS63203790A/ja
Publication of JPH0320478B2 publication Critical patent/JPH0320478B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/58Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP3415987A 1987-02-17 1987-02-17 シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴 Granted JPS63203790A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3415987A JPS63203790A (ja) 1987-02-17 1987-02-17 シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3415987A JPS63203790A (ja) 1987-02-17 1987-02-17 シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴

Publications (2)

Publication Number Publication Date
JPS63203790A JPS63203790A (ja) 1988-08-23
JPH0320478B2 true JPH0320478B2 (is") 1991-03-19

Family

ID=12406423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3415987A Granted JPS63203790A (ja) 1987-02-17 1987-02-17 シアン化合物を含まない光沢銅−亜鉛合金電気めつき浴

Country Status (1)

Country Link
JP (1) JPS63203790A (is")

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139384A1 (ja) 2008-05-12 2009-11-19 株式会社ブリヂストン 銅‐亜鉛合金電気めっき浴およびこれを用いためっき方法
WO2010101212A1 (ja) 2009-03-04 2010-09-10 株式会社ブリヂストン 銅-亜鉛合金電気めっき浴およびこれを用いためっき方法
JP2017517649A (ja) * 2014-06-12 2017-06-29 コンパニー ゼネラール デ エタブリッスマン ミシュラン 現場ゴム引きされている、腐蝕防止剤を含むゴム引き用組成物を含むケーブル

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0819550B2 (ja) * 1990-06-05 1996-02-28 福田金属箔粉工業株式会社 印刷回路用銅箔の表面処理方法
IT1275490B (it) * 1995-07-07 1997-08-07 Pirelli Procedimento elettrolitico per ricoprire un elemento metallico con uno strato di ottone
JP5274817B2 (ja) * 2007-11-26 2013-08-28 株式会社ブリヂストン 銅−亜鉛合金電気めっき浴およびこれを用いためっき方法
US20100243466A1 (en) * 2007-11-26 2010-09-30 Bridgestone Corporation Copper-zinc alloy electroplating bath and plating method using the copper-zinc alloy electroplating bath
JP2009149978A (ja) * 2007-11-26 2009-07-09 Bridgestone Corp 銅−亜鉛合金電気めっき浴およびこれを用いためっき方法
JP5299994B2 (ja) * 2008-07-30 2013-09-25 株式会社ブリヂストン 銅−亜鉛合金電気めっき浴および銅−亜鉛合金めっき付きスチールコード用ワイヤ
JP5686961B2 (ja) * 2008-07-30 2015-03-18 株式会社ブリヂストン スチールコード用ワイヤのめっき用銅−亜鉛合金電気めっき浴およびスチールコード用ワイヤ
JP5645422B2 (ja) * 2010-02-23 2014-12-24 地方独立行政法人 大阪市立工業研究所 銅−亜鉛合金電気めっき液
JP5687051B2 (ja) * 2010-12-27 2015-03-18 株式会社ブリヂストン 銅−亜鉛合金めっき方法およびそれに用いる銅−亜鉛合金めっき浴
CN103866356B (zh) * 2012-12-11 2016-08-10 中国科学院过程工程研究所 无氰仿金电镀Cu-Zn二元合金的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009139384A1 (ja) 2008-05-12 2009-11-19 株式会社ブリヂストン 銅‐亜鉛合金電気めっき浴およびこれを用いためっき方法
WO2010101212A1 (ja) 2009-03-04 2010-09-10 株式会社ブリヂストン 銅-亜鉛合金電気めっき浴およびこれを用いためっき方法
JP2017517649A (ja) * 2014-06-12 2017-06-29 コンパニー ゼネラール デ エタブリッスマン ミシュラン 現場ゴム引きされている、腐蝕防止剤を含むゴム引き用組成物を含むケーブル

Also Published As

Publication number Publication date
JPS63203790A (ja) 1988-08-23

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