JPH0317857B2 - - Google Patents

Info

Publication number
JPH0317857B2
JPH0317857B2 JP388486A JP388486A JPH0317857B2 JP H0317857 B2 JPH0317857 B2 JP H0317857B2 JP 388486 A JP388486 A JP 388486A JP 388486 A JP388486 A JP 388486A JP H0317857 B2 JPH0317857 B2 JP H0317857B2
Authority
JP
Japan
Prior art keywords
prepreg
epoxy resin
weight
printed wiring
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP388486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62161838A (ja
Inventor
Masami Yusa
Katsuji Shibata
Yasuo Myadera
Tomio Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP61003884A priority Critical patent/JPS62161838A/ja
Publication of JPS62161838A publication Critical patent/JPS62161838A/ja
Publication of JPH0317857B2 publication Critical patent/JPH0317857B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
JP61003884A 1986-01-10 1986-01-10 印刷配線板用プリプレグの製造方法 Granted JPS62161838A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61003884A JPS62161838A (ja) 1986-01-10 1986-01-10 印刷配線板用プリプレグの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61003884A JPS62161838A (ja) 1986-01-10 1986-01-10 印刷配線板用プリプレグの製造方法

Publications (2)

Publication Number Publication Date
JPS62161838A JPS62161838A (ja) 1987-07-17
JPH0317857B2 true JPH0317857B2 (enrdf_load_stackoverflow) 1991-03-11

Family

ID=11569609

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61003884A Granted JPS62161838A (ja) 1986-01-10 1986-01-10 印刷配線板用プリプレグの製造方法

Country Status (1)

Country Link
JP (1) JPS62161838A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5685956A (en) * 1979-12-15 1981-07-13 Ricoh Co Ltd Communication equipment
JPS5922475A (ja) * 1982-07-29 1984-02-04 Hitachi Ltd フアクシミリ装置リモ−トメンテナンス方式

Also Published As

Publication number Publication date
JPS62161838A (ja) 1987-07-17

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