JPH0316347U - - Google Patents
Info
- Publication number
- JPH0316347U JPH0316347U JP7655789U JP7655789U JPH0316347U JP H0316347 U JPH0316347 U JP H0316347U JP 7655789 U JP7655789 U JP 7655789U JP 7655789 U JP7655789 U JP 7655789U JP H0316347 U JPH0316347 U JP H0316347U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- resin
- upper edge
- end surfaces
- side end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例に係る表面実装型Ｉ
Ｃの斜視図、第２図は同実施例の表面実装型ＩＣ
の側面図、第３図は同実施理例の表面実装型ＩＣ
のプリント基板へのマウント状態を示す側面図、
第４図は従来の表面実装型ＩＣの斜視図、第５図
は従来の表面実装型ＩＣのプリント基板へのマウ
ント状態を示す側面図である。
２……リード、１０……樹脂パツケージ、１１
，１２，１３，１４……上縁角部、１１ａ，１２
ａ，１３ａ，１４ａ……凹段部、１１ｂ，１２ｂ
，１３ｂ，１４ｂ……側端面。
Figure 1 shows a surface mount type I according to an embodiment of the present invention.
A perspective view of C, and Figure 2 is a surface-mounted IC of the same embodiment.
Figure 3 is a side view of the surface mount IC of the same implementation example.
side view showing how it is mounted on the printed circuit board,
FIG. 4 is a perspective view of a conventional surface-mounted IC, and FIG. 5 is a side view of the conventional surface-mounted IC mounted on a printed circuit board. 2...Lead, 10...Resin package, 11
, 12, 13, 14...upper edge corner, 11a, 12
a, 13a, 14a... recessed step, 11b, 12b
, 13b, 14b... side end surfaces.
Claims (1)
なる表面実装型ＩＣにおいて、 上記樹脂パツケージの少なくとも一方の相対向
する上縁角部に側端面が互いに平行となる凹段部
を形成したことを特徴とする表面実装型ＩＣ。[Claims for Utility Model Registration] In a surface mount IC in which a plurality of leads are led out from a resin package, a recessed step whose side end surfaces are parallel to each other is provided at the opposing upper edge corners of at least one of the resin packages. A surface mount type IC characterized in that a part is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7655789U JPH0316347U (en) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7655789U JPH0316347U (en) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316347U true JPH0316347U (en) | 1991-02-19 |
Family
ID=31618136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7655789U Pending JPH0316347U (en) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316347U (en) |
-
1989
- 1989-06-29 JP JP7655789U patent/JPH0316347U/ja active Pending
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