JPH0298652U - - Google Patents
Info
- Publication number
- JPH0298652U JPH0298652U JP806989U JP806989U JPH0298652U JP H0298652 U JPH0298652 U JP H0298652U JP 806989 U JP806989 U JP 806989U JP 806989 U JP806989 U JP 806989U JP H0298652 U JPH0298652 U JP H0298652U
- Authority
- JP
- Japan
- Prior art keywords
- package
- board
- notch
- lower surfaces
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図は本考案の半導体実装構造の
第１の実施例を示す斜視図、第３図は基板とパツ
ケージの厚さがほぼ同一の場合の実施例の断面図
、第４図は基板よりもパツケージの厚さが大きい
場合の第２の実施例の断面図、第５図は従来例の
断面図である。
１……パツケージ、２……ピン、３……プリン
ト配線基板、５……切欠部。
1 and 2 are perspective views showing a first embodiment of the semiconductor packaging structure of the present invention, FIG. 3 is a sectional view of the embodiment in which the thickness of the board and the package are almost the same, and FIG. 4 5 is a sectional view of the second embodiment in which the thickness of the package is larger than that of the substrate, and FIG. 5 is a sectional view of the conventional example. 1... Package cage, 2... Pin, 3... Printed wiring board, 5... Notch.
Claims (1)
基板と、左右両側の上面及び下面に各々ピンが配
置されたパツケージとを有し、上記上面及び下面
のピンによつて基板を挟むようにパツケージを切
欠部に実装したことを特徴とする半導体実装装置
。 It has a board with a notch of a size corresponding to the package, and a package with pins arranged on the upper and lower surfaces of both left and right sides, and the package is held so that the board is sandwiched between the pins on the upper and lower surfaces. A semiconductor mounting device characterized in that it is mounted in a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP806989U JPH0298652U (en) | 1989-01-26 | 1989-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP806989U JPH0298652U (en) | 1989-01-26 | 1989-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298652U true JPH0298652U (en) | 1990-08-06 |
Family
ID=31213620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP806989U Pending JPH0298652U (en) | 1989-01-26 | 1989-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298652U (en) |
-
1989
- 1989-01-26 JP JP806989U patent/JPH0298652U/ja active Pending