JPH0328749U - - Google Patents
Info
- Publication number
- JPH0328749U JPH0328749U JP8937389U JP8937389U JPH0328749U JP H0328749 U JPH0328749 U JP H0328749U JP 8937389 U JP8937389 U JP 8937389U JP 8937389 U JP8937389 U JP 8937389U JP H0328749 U JPH0328749 U JP H0328749U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- bending
- bending part
- resin package
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 5
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例に係る表面実装型Ｉ
Ｃと該表面実装型ＩＣが取り付けられるプリント
基板の斜視図、第２図及び第３図は何れも第１図
−線に沿つた要部断面図であり、第２図は表
面実装型ＩＣがプリント基板に挿着された状態を
示し、第３図は半田付け前の状態を示している。
第４図は他の実施例に係る表面実装型ＩＣの斜視
図、第５図は同実施例の表面実装型ＩＣをプリン
ト基板に取り付けた状態を示す要部断面図、第６
図は従来の表面実装型ＩＣをプリント基板に取る
付けた状態を示す斜視図、第７図はその側面図で
ある。
１，１０……樹脂パツケージ、２１，２２……
リード、２１ａ，２２ａ……第１の折曲部、２１
ｂ……第２の折曲部、Ｃ……表面中央部。
Figure 1 shows a surface mount type I according to an embodiment of the present invention.
C and a perspective view of the printed circuit board to which the surface mount IC is attached, and FIGS. It shows a state inserted into a printed circuit board, and FIG. 3 shows a state before soldering.
FIG. 4 is a perspective view of a surface mount IC according to another embodiment, FIG.
The figure is a perspective view showing a state in which a conventional surface-mounted IC is mounted on a printed circuit board, and FIG. 7 is a side view thereof. 1, 10... Resin package cage, 21, 22...
Leads, 21a, 22a...first bent portion, 21
b...Second bent part, C...Central part of the surface.
Claims (1)
中で、少なくとも前記樹脂パツケージの表面中央
部を基準として対角線上に配置される２本のリー
ドを第１の折曲部で上方に折曲すると共に、第２
の折曲部でリード導出方向と平行で且つ外側方向
に折曲し、その他のリードを第１の折曲部で下方
に折曲してなる表面実装型ＩＣ。 Among the plurality of leads led out from the resin package, at least two leads arranged diagonally with respect to the central part of the surface of the resin package are bent upward at the first bending part, and 2
A surface mount IC formed by bending the leads parallel to the lead-out direction and outward at the bending part, and bending the other leads downward at the first bending part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8937389U JPH0328749U (en) | 1989-07-28 | 1989-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8937389U JPH0328749U (en) | 1989-07-28 | 1989-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0328749U true JPH0328749U (en) | 1991-03-22 |
Family
ID=31638951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8937389U Pending JPH0328749U (en) | 1989-07-28 | 1989-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328749U (en) |
-
1989
- 1989-07-28 JP JP8937389U patent/JPH0328749U/ja active Pending