JPH0482863U - - Google Patents
Info
- Publication number
- JPH0482863U JPH0482863U JP12792490U JP12792490U JPH0482863U JP H0482863 U JPH0482863 U JP H0482863U JP 12792490 U JP12792490 U JP 12792490U JP 12792490 U JP12792490 U JP 12792490U JP H0482863 U JPH0482863 U JP H0482863U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- view
- main body
- external connection
- bent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例である半導体装置
の斜視図、第２図は第１図の側面図、第３図は第
１図は半導体装置を印刷配線基板に取付けた状態
を示す側面図、第４図〜第６図および第７図〜第
９図はこの考案の他の一実施例である半導体装置
の斜視図、側面図および印刷配線基板に取付けた
状態を示す側面図、第１０図〜第１２図は従来の
ＤＩＰ形半導体装置の斜視図、側面図および印刷
配線基板に取付けた状態を示す側面図、第１３図
〜第１５図は従来のＺＩＰ形半導体装置の斜視図
、側面図および印刷配線基板に取付けた状態を示
す側面図である。
図において、１は半導体装置本体、２は半導体
装置本体より導出された外部接続用リード、３は
印刷配線基板、４は印刷配線基板に設けられたス
ルーホールを示す。なお、図中、同一符号は同一
、又は相当部分を示す。
Fig. 1 is a perspective view of a semiconductor device which is an embodiment of this invention, Fig. 2 is a side view of Fig. 1, and Fig. 3 is a side view showing the state in which the semiconductor device is attached to a printed wiring board. 4 to 6 and 7 to 9 are a perspective view and a side view of a semiconductor device according to another embodiment of this invention, and a side view and a side view showing a state in which it is attached to a printed wiring board. 10 to 12 are a perspective view, a side view, and a side view of a conventional DIP type semiconductor device and a side view showing a state in which it is attached to a printed wiring board, and FIGS. 13 to 15 are perspective views of a conventional ZIP type semiconductor device. FIG. 3 is a side view and a side view showing a state where the device is attached to a printed wiring board. In the figure, 1 is a semiconductor device main body, 2 is an external connection lead led out from the semiconductor device main body, 3 is a printed wiring board, and 4 is a through hole provided in the printed wiring board. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
用リードが前記半導体装置本体の主面に所定の間
隔で導出されている半導体装置において、隣接し
た外部接続用の各リードは屈曲され、かつ前記各
リードの先端部取付面が同一平面となる様な取付
部を備えたことを特徴とする半導体装置。 In a semiconductor device in which a plurality of external connection leads protruding from a semiconductor device main body are led out at predetermined intervals on the main surface of the semiconductor device main body, each adjacent external connection lead is bent, and each of the leads is bent. 1. A semiconductor device comprising a mounting portion such that the mounting surfaces of the tip portion thereof are flush with each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12792490U JPH0482863U (en) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12792490U JPH0482863U (en) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482863U true JPH0482863U (en) | 1992-07-20 |
Family
ID=31875406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12792490U Pending JPH0482863U (en) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482863U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982872A (en) * | 1995-09-08 | 1997-03-28 | Nec Corp | Semiconductor device |
| WO2024024595A1 (en) * | 2022-07-29 | 2024-02-01 | 株式会社鷺宮製作所 | Signal converting device, and pressure sensor |
-
1990
- 1990-11-28 JP JP12792490U patent/JPH0482863U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0982872A (en) * | 1995-09-08 | 1997-03-28 | Nec Corp | Semiconductor device |
| WO2024024595A1 (en) * | 2022-07-29 | 2024-02-01 | 株式会社鷺宮製作所 | Signal converting device, and pressure sensor |
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