JPH02150791U - - Google Patents
Info
- Publication number
- JPH02150791U JPH02150791U JP6145489U JP6145489U JPH02150791U JP H02150791 U JPH02150791 U JP H02150791U JP 6145489 U JP6145489 U JP 6145489U JP 6145489 U JP6145489 U JP 6145489U JP H02150791 U JPH02150791 U JP H02150791U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- leads
- exterior part
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connecting Device With Holders (AREA)
Description
第１図及び第２図は本考案の実施例を示し、第
１図は正面図、第２図は側面図である。第３図は
第１図電子部品のＩＣソケツトへの実装状態を示
す部分側断面図、第４図は第１図電子部品のプリ
ント配線基板への実装方法を説明する部分側断面
図、第５図及び第６図はそれぞれ本考案の他の実
施例を示し、第５図は斜視図、第６図は側面図で
ある。第７図は第６図電子部品のプリント配線基
板への実装状態を示す部分側断面図、第８図及び
第９図は従来のリード付き電子部品を示し、第８
図は正面図、第９図は側面図を示す。
５……電子部品本体、６，１５，１５ｂ，１８
……リード、７，１６，１９……外装部、８，１
７，２０……電子部品。
1 and 2 show an embodiment of the present invention, with FIG. 1 being a front view and FIG. 2 being a side view. 3 is a partial side sectional view showing how the electronic component shown in FIG. 1 is mounted on the IC socket, FIG. 4 is a partial side sectional view illustrating a method of mounting the electronic component shown in FIG. 6 and 6 respectively show other embodiments of the present invention, FIG. 5 being a perspective view and FIG. 6 being a side view. FIG. 7 is a partial side sectional view showing how the electronic component shown in FIG. 6 is mounted on a printed wiring board, FIGS. 8 and 9 show a conventional electronic component with leads,
The figure shows a front view, and FIG. 9 shows a side view. 5...Electronic component body, 6, 15, 15b, 18
... Lead, 7, 16, 19 ... Exterior part, 8, 1
7,20...Electronic parts.
Claims (1)
子部品本体を被覆した外装部より導出し、上記リ
ードを任意本毎に反対方向に湾曲させ外装部のリ
ード導出面と隣接する面上にリード遊端を配置し
たことを特徴とする電子部品。 A plurality of leads connected to the electronic component body are led out from the exterior part covering the electronic component body, and the leads are bent in opposite directions for each arbitrary lead, and the leads are loose on the surface adjacent to the lead lead-out surface of the exterior part. An electronic component characterized by having its edges arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6145489U JPH02150791U (en) | 1989-05-26 | 1989-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6145489U JPH02150791U (en) | 1989-05-26 | 1989-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02150791U true JPH02150791U (en) | 1990-12-27 |
Family
ID=31589717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6145489U Pending JPH02150791U (en) | 1989-05-26 | 1989-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02150791U (en) |
-
1989
- 1989-05-26 JP JP6145489U patent/JPH02150791U/ja active Pending