JPH0617248U - Resin-sealed electronic component device - Google Patents

Abstract

(57) [Summary] (Revised) [Purpose] In the surface mounting structure on a circuit board such as a printed wiring board, any surface of the resin case can be a mounting surface. For the purpose of obtaining a static type electronic component device, it can be used for an electronic device or the like having a high-density mounting structure. [Structure] A lead piece derived from a resin case is divided into a plurality of sections on the end side, and a plurality of mounting surfaces are formed using the bent ends as planar external electrodes. ..

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a structure of a resin-sealed electronic component device, and more particularly to a resin-sealed electronic component device having a plurality of mounting surfaces and suitable for surface mounting. Electronic component elements enclosed in the electronic component device include active elements including semiconductor elements such as diodes, transistors and thyristors, passive elements such as resistors and capacitors, integrated circuits and composite circuits thereof.

[0002]

[Prior art]

 Conventionally, as a structure of a resin-sealed electronic component device provided with an external electrode, in particular, a resin-sealed electronic component device in which the external electrode has a planar shape to facilitate surface mounting on a circuit board or the like, for example, as shown in FIG. There is something like the one shown in the perspective structure diagram. Reference numeral 1 is a lead piece, which is led out from an electronic component element (not shown) sealed in the resin case 2 directly or through a connector. The lead piece 1 is usually formed by a lead frame, and after the electronic component element is soldered, the resin case 2 is molded to cut off unnecessary portions of the lead frame. Next, the end of the lead piece 1 is bent along the resin case 2 by forming as shown in FIG. As a result, the end of 1 forms a planar external electrode such that the surface A of the resin case 2 is the mounting surface. Therefore, when the surface mounting (2) structure is formed on a circuit board such as a printed wiring board, the mounting surface is limited to the surface A using the lead piece 1 as an external electrode.

That is, in surface mounting on a circuit board, in the conventional structure, for example, since the mounting surface is limited to the A surface, the height direction with respect to the mounting surface can be reduced, but the lateral space is restricted. In such a case, the occupied area could not be reduced by using the B side as the mounting surface, and the structure was not flexible and inconvenient in terms of equipment design.

[0004]

[Problems to be solved by the device]

 The problem to be solved is that the mounting surface is limited to one surface, and there are restrictions on the placement of the resin-sealed electronic component device in the surface mounting structure on a circuit board such as a printed wiring board.

[0005]

[Means for Solving the Problems]

 It is characterized in that the lead piece derived from the resin case is divided into a plurality of parts on the end side and the bent end parts are used as planar external electrodes to form a plurality of mounting surfaces. As a result, it is possible to provide a resin-sealed type electronic component device which has a simple structure and is easy to manufacture, in which the arrangement on the mounted circuit board is flexible.

[0006]

【Example】

 2 (a) and 2 (b) are perspective structural views showing an embodiment of the present invention, and the same reference numerals as those in FIG. 1 denote the same parts. 3 (a) and 3 (b) are perspective structural views before bending of one end of the lead corresponding to FIGS. 2 (a) and 2 (b), respectively.

3A and 3B, similar to FIG. 1, an electronic component element such as a semiconductor chip (not shown) is encapsulated in a resin case 2 and is directly or via a connector, a lead. It is a piece derived. The lead pieces 1a and 1b form an essential part of the structure of the present invention and are divided into two at the lead-out side end of the lead piece. In FIG. 3 (b), the resin case 2 (3) This is an example in which the outer side is divided into 1a and 1b, and in FIG. 3 (a), the inner side of 2 is divided into 1a and 1b. In FIG. 3 (a), one lead piece may be divided into 1a and 1b inside, or any two dividing means 1a and 1b may be connected inside 2 by a connector or the like. 3 (a), 3 (b) to 2 (a), 2 (b), the ends of the lead pieces 1a and 1b are bent along the resin case 2 by forming, 1a is formed on the mounting surface A and 1b is formed on the mounting surface B as external electrodes.

As another embodiment of the present invention, a perspective structural view is shown in FIGS. In FIG. 4, four external electrodes formed by the lead pieces 1 are provided on the mounting surface A and the mounting surface B, respectively, along the resin case 2. Similarly, in FIG. 5, three external electrodes are provided on each mounting surface. As an example, the semiconductor device of FIG. 4 constitutes a bridge type rectifying circuit, and has an AC terminal and a DC terminal. The semiconductor device shown in FIG. 5 constitutes a center-tap rectifier circuit. In addition, it can be applied to any of the electronic component elements described above.

In addition, using the C surface shown in FIGS. 2A and 2B as the mounting surface can be easily implemented as in the above description. Therefore, either surface of the resin case 2 can be a mounting surface. In addition, modifications, conversions, additions and other changes can be arbitrarily made within the scope of the present invention. The bending of one end of the lead was done by forming after cutting the unnecessary part of the lead frame for resin molding, but if necessary, it should be bent before resin molding. Is also possible.

[0010]

[Effect of device]

 As described above, according to the present invention, a resin-sealed electronic component device in which any surface of the resin case can be a mounting surface can be easily manufactured and can be obtained with a simple structure. It is very effective when used for various purposes such as circuit boards with high-density mounting structure (4).

[Brief description of drawings]

FIG. 1 is a perspective structural view of a conventional device.

FIG. 2 is a perspective structural view of the embodiment of the present invention, FIG.
(B) shows an example in which the shape of one end of the lead is different.

FIG. 3 is a perspective structural view of one end of the lead before bending, corresponding to FIGS. 2 (a) and 2 (b), respectively.

FIG. 4 is a perspective structural view of another embodiment of the present invention.

FIG. 5 is a perspective structural view of another embodiment of the present invention.

[Explanation of symbols]

 1, 1a, 1b Lead one end 2 Resin case A, B Mounting surface C Surface that can be mounted surface

Claims (1)

[Scope of utility model registration request] 1. A resin encapsulation comprising at least an electronic component element, a lead piece, and a resin case, wherein an end of the lead piece is bent along the resin case to form a planar external electrode on a mounting surface. In a static electronic device, a plurality of lead pieces are divided inside or outside the resin case, and the bent ends of the divided lead pieces are used as planar external electrodes to form a plurality of mounting surfaces. A resin-sealed electronic component device characterized by the above.