JPS63145363U - - Google Patents
Info
- Publication number
- JPS63145363U JPS63145363U JP3756687U JP3756687U JPS63145363U JP S63145363 U JPS63145363 U JP S63145363U JP 3756687 U JP3756687 U JP 3756687U JP 3756687 U JP3756687 U JP 3756687U JP S63145363 U JPS63145363 U JP S63145363U
- Authority
- JP
- Japan
- Prior art keywords
- case
- electronic component
- leads
- lead
- protrude
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図ないし第４図は本考案の一実施例による
圧電振動部品を説明するための図で、第１図はそ
の構成を説明するための分解斜視図、第２図はそ
の斜視図、第３図ａはそのリードを示す斜視図、
第３図ｂはそのベースケースを示す斜視図、第３
図ｃはそのベースケースにリードを固定する工程
を示す斜視図、第４図はその平面図、第５図従来
の電子部品を示す斜視図、第６図はその問題点を
説明するための平面図である。
図において、１は圧電振動部品（電子部品）、
２は圧電素子（電子部品素子）、４はリード、５
はパツケージケース（ケース）である。
1 to 4 are diagrams for explaining a piezoelectric vibrating component according to an embodiment of the present invention. FIG. 1 is an exploded perspective view for explaining its configuration, and FIG. 2 is a perspective view thereof. Figure 3a is a perspective view showing the lead;
Figure 3b is a perspective view showing the base case;
Figure c is a perspective view showing the process of fixing the lead to the base case, Figure 4 is a plan view thereof, Figure 5 is a perspective view showing a conventional electronic component, and Figure 6 is a plane view for explaining the problem. It is a diagram. In the figure, 1 is a piezoelectric vibrating component (electronic component);
2 is a piezoelectric element (electronic component element), 4 is a lead, 5
is a package case.
Claims (1)
された電子部品素子に接続するとともに、該ケー
スから外方に突出させ、上記リードを実装基板上
面の配線パターンに接続するようにした電子部品
において、上記リードをケースの一側面から複数
本突出させるとともに、該ケースの一側面と対向
する他側面から少なくとも１本突出させたことを
特徴とする電子部品。 In the electronic component, the plurality of external lead-out leads are connected to an electronic component element housed in a case, and are made to protrude outward from the case, and the leads are connected to a wiring pattern on the upper surface of a mounting board. An electronic component characterized in that a plurality of leads protrude from one side of a case, and at least one lead protrudes from the other side opposite to the one side of the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3756687U JPS63145363U (en) | 1987-03-13 | 1987-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3756687U JPS63145363U (en) | 1987-03-13 | 1987-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145363U true JPS63145363U (en) | 1988-09-26 |
Family
ID=30849010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3756687U Pending JPS63145363U (en) | 1987-03-13 | 1987-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145363U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106727U (en) * | 1989-02-14 | 1990-08-24 |
-
1987
- 1987-03-13 JP JP3756687U patent/JPS63145363U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106727U (en) * | 1989-02-14 | 1990-08-24 |
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