JPH0313746U - - Google Patents

Info

Publication number
JPH0313746U
JPH0313746U JP7358389U JP7358389U JPH0313746U JP H0313746 U JPH0313746 U JP H0313746U JP 7358389 U JP7358389 U JP 7358389U JP 7358389 U JP7358389 U JP 7358389U JP H0313746 U JPH0313746 U JP H0313746U
Authority
JP
Japan
Prior art keywords
electronic component
base
wiring pattern
component element
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7358389U
Other languages
English (en)
Other versions
JP2502612Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989073583U priority Critical patent/JP2502612Y2/ja
Publication of JPH0313746U publication Critical patent/JPH0313746U/ja
Application granted granted Critical
Publication of JP2502612Y2 publication Critical patent/JP2502612Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す断面図、第２図
ａはチツプキヤリアの上面に配置した配線パター
ンの一実施例を示す平面図、第２図ｂは第２図ａ
のＡ−Ａ′断面図、第３図ａはチツプキヤリアの
上面に配置した配線パターンの他の実施例を示す
平面図、第３図ｂは第３図ａのＢ−Ｂ′断面図、
、第４図ａは従来例を示す平面図、第４図ｂは第
４図ａのＣ−Ｃ′断面図である。 １……チツプキヤリア、２……配線パターン、
３……スルーホール、４……コバールリング、５
……金属製キヤツプ、６……電子部品素子、７…
…接着部材、８……ボンデイングワイヤ、９……
非導電体。

Claims (1)

  1. 【実用新案登録請求の範囲】 電子部品素子と、 この電子部品素子を上面に載置する基台と、 この基台に配置され、且つ前記電子部品素子に
    信号を伝える配線パターンと、 この配線パターンに接続し、且つ前記基台上面
    から下面に貫通する様に設けられたスルホールと
    を少なくとも備えたことを特徴とする電子部品。
JP1989073583U 1989-06-26 1989-06-26 電子部品 Expired - Lifetime JP2502612Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989073583U JP2502612Y2 (ja) 1989-06-26 1989-06-26 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989073583U JP2502612Y2 (ja) 1989-06-26 1989-06-26 電子部品

Publications (2)

Publication Number Publication Date
JPH0313746U true JPH0313746U (ja) 1991-02-12
JP2502612Y2 JP2502612Y2 (ja) 1996-06-26

Family

ID=31612525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989073583U Expired - Lifetime JP2502612Y2 (ja) 1989-06-26 1989-06-26 電子部品

Country Status (1)

Country Link
JP (1) JP2502612Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227586U (ja) * 1989-07-26 1990-02-22
JPH11251488A (ja) * 1998-03-05 1999-09-17 Sumitomo Metal Electronics Devices Inc セラミックパッケージ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123271A (ja) * 1973-03-28 1974-11-26
JPS5899839U (ja) * 1981-12-28 1983-07-07 三菱電機株式会社 半導体装置用実装基板
JPS6083353A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd チツプキヤリア基板
JPS61182098U (ja) * 1985-04-30 1986-11-13
JPS6393136A (ja) * 1986-10-07 1988-04-23 Mitsubishi Electric Corp トランジスタ装置
JPH01125959A (ja) * 1987-11-11 1989-05-18 Matsushita Electric Ind Co Ltd 高周波用パッケージ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123271A (ja) * 1973-03-28 1974-11-26
JPS5899839U (ja) * 1981-12-28 1983-07-07 三菱電機株式会社 半導体装置用実装基板
JPS6083353A (ja) * 1983-10-14 1985-05-11 Oki Electric Ind Co Ltd チツプキヤリア基板
JPS61182098U (ja) * 1985-04-30 1986-11-13
JPS6393136A (ja) * 1986-10-07 1988-04-23 Mitsubishi Electric Corp トランジスタ装置
JPH01125959A (ja) * 1987-11-11 1989-05-18 Matsushita Electric Ind Co Ltd 高周波用パッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0227586U (ja) * 1989-07-26 1990-02-22
JPH11251488A (ja) * 1998-03-05 1999-09-17 Sumitomo Metal Electronics Devices Inc セラミックパッケージ

Also Published As

Publication number Publication date
JP2502612Y2 (ja) 1996-06-26

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