JPS62170632U - - Google Patents
Info
- Publication number
- JPS62170632U JPS62170632U JP5805486U JP5805486U JPS62170632U JP S62170632 U JPS62170632 U JP S62170632U JP 5805486 U JP5805486 U JP 5805486U JP 5805486 U JP5805486 U JP 5805486U JP S62170632 U JPS62170632 U JP S62170632U
- Authority
- JP
- Japan
- Prior art keywords
- eprom
- built
- mounting structure
- molding agent
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Description
第1図は本考案の実装構造の一実施例を示す主
要平面図a及び断面図b。第2図は従来技術の実
装構造の一例を示す断面図。 1…回路基板、2…IC、3…モールド剤、4
…基板パターン、5…ハンダバンプ、A…IC(
機能・バンプ部)、B…EPROM部、a…モー
ルド剤充填箇所、b…モールド剤非充填箇所。
要平面図a及び断面図b。第2図は従来技術の実
装構造の一例を示す断面図。 1…回路基板、2…IC、3…モールド剤、4
…基板パターン、5…ハンダバンプ、A…IC(
機能・バンプ部)、B…EPROM部、a…モー
ルド剤充填箇所、b…モールド剤非充填箇所。
Claims (1)
- EPROM内蔵ICを実装した回路基板におい
て、EPROM部が基板・モールド剤等によつて
覆われていない事を特徴とするEPROM内蔵I
Cの基板実装構造。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986058054U JPH054280Y2 (ja) | 1986-04-17 | 1986-04-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986058054U JPH054280Y2 (ja) | 1986-04-17 | 1986-04-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62170632U true JPS62170632U (ja) | 1987-10-29 |
JPH054280Y2 JPH054280Y2 (ja) | 1993-02-02 |
Family
ID=30888304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986058054U Expired - Lifetime JPH054280Y2 (ja) | 1986-04-17 | 1986-04-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH054280Y2 (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56150871A (en) * | 1980-04-24 | 1981-11-21 | Toshiba Corp | Semiconductor device |
-
1986
- 1986-04-17 JP JP1986058054U patent/JPH054280Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56150871A (en) * | 1980-04-24 | 1981-11-21 | Toshiba Corp | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH054280Y2 (ja) | 1993-02-02 |