JPH03104747U - - Google Patents

Info

Publication number
JPH03104747U
JPH03104747U JP1990014073U JP1407390U JPH03104747U JP H03104747 U JPH03104747 U JP H03104747U JP 1990014073 U JP1990014073 U JP 1990014073U JP 1407390 U JP1407390 U JP 1407390U JP H03104747 U JPH03104747 U JP H03104747U
Authority
JP
Japan
Prior art keywords
package
secures
molybdenum
tungsten
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990014073U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990014073U priority Critical patent/JPH03104747U/ja
Publication of JPH03104747U publication Critical patent/JPH03104747U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】
第１図はこの考案の一実施例によるＩＣパツケ
ージの側断面図、第２図は従来のＩＣパツケージ
の側断面図である。 図において１……ＩＣチツプ、２……フレーム
（ボンデイング部）、３……ボンデイングブロツ
ク、４……フレーム（リード部）、５……モール
ド樹脂、６……ワイヤリード。なお、図中、同一
符号は同一、又は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. 比較的電力消費及びチツプサイズの大きな半導
    体チツプを固着するボンデイング部において、シ
    リコンと熱膨張係数の近いモリブデンあるいはタ
    ングステンなどの金属ブロツクを、あらかじめ圧
    入あるいはクラツド法により一体成形したフレー
    ム材により構成されたことを特徴とするＩＣパツ
    ケージ。
JP1990014073U 1990-02-14 1990-02-14 Pending JPH03104747U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990014073U JPH03104747U (ja) 1990-02-14 1990-02-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990014073U JPH03104747U (ja) 1990-02-14 1990-02-14

Publications (1)

Publication Number Publication Date
JPH03104747U true JPH03104747U (ja) 1991-10-30

Family

ID=31517453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990014073U Pending JPH03104747U (ja) 1990-02-14 1990-02-14

Country Status (1)

Country Link
JP (1) JPH03104747U (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008061324A (ja) * 2006-08-30 2008-03-13 Aruna:Kk 携帯用充電器
JP2009502109A (ja) * 2005-07-21 2009-01-22 ハンヒ シン 太陽電池を利用した携帯機器充電装置
JP2009153372A (ja) * 2007-12-19 2009-07-09 J Touch Corp 多様な光源で使用可能な充電装置
JP2010081711A (ja) * 2008-09-25 2010-04-08 Nippon Telegr & Teleph Corp <Ntt> 充電回路、充電回路制御方法および充電回路制御プログラム
WO2012118005A1 (ja) * 2011-02-28 2012-09-07 三洋電機株式会社 電池の状態検出装置、電源装置、移動体、充電装置、蓄電パック、及び検出装置
KR20160090292A (ko) * 2013-11-25 2016-07-29 소니 주식회사 축전 시스템 및 이차 전지의 충전 방법

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009502109A (ja) * 2005-07-21 2009-01-22 ハンヒ シン 太陽電池を利用した携帯機器充電装置
JP2008061324A (ja) * 2006-08-30 2008-03-13 Aruna:Kk 携帯用充電器
JP2009153372A (ja) * 2007-12-19 2009-07-09 J Touch Corp 多様な光源で使用可能な充電装置
JP2010081711A (ja) * 2008-09-25 2010-04-08 Nippon Telegr & Teleph Corp <Ntt> 充電回路、充電回路制御方法および充電回路制御プログラム
JP4712081B2 (ja) * 2008-09-25 2011-06-29 日本電信電話株式会社 充電回路および充電回路制御方法
WO2012118005A1 (ja) * 2011-02-28 2012-09-07 三洋電機株式会社 電池の状態検出装置、電源装置、移動体、充電装置、蓄電パック、及び検出装置
KR20160090292A (ko) * 2013-11-25 2016-07-29 소니 주식회사 축전 시스템 및 이차 전지의 충전 방법

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