JPH0349U - - Google Patents

Info

Publication number
JPH0349U
JPH0349U JP5826289U JP5826289U JPH0349U JP H0349 U JPH0349 U JP H0349U JP 5826289 U JP5826289 U JP 5826289U JP 5826289 U JP5826289 U JP 5826289U JP H0349 U JPH0349 U JP H0349U
Authority
JP
Japan
Prior art keywords
horizontal
semiconductor chip
lead body
surface mount
mount component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5826289U
Other languages
English (en)
Other versions
JPH085562Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989058262U priority Critical patent/JPH085562Y2/ja
Publication of JPH0349U publication Critical patent/JPH0349U/ja
Application granted granted Critical
Publication of JPH085562Y2 publication Critical patent/JPH085562Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図ないし第３図は本考案の実施例に関し、
第１図は表面実装部品の斜視図、第２図は表面実
装部品の実装構造を示す断面図、第３図は表面実
装部品の他の実施例の断面図である。第４図は従
来例における表面実装部品の実装構造を示す断面
図、第５図は従来例における作用を説明するため
の部分拡大断面図である。 １…モールド樹脂部、２…半導体チツプ、３…
リード体、４…第１水平部、５…第２水平部、６
…湾曲部（中間部）。

Claims (1)

  1. 【実用新案登録請求の範囲】 半導体チツプと、 前記半導体チツプに接続される第１水平部と、
    基板への取り付け部となる第２水平部と、前記両
    水平部間に介在し、それぞれの水平部を上下位置
    に変位させるように連設する中間部とからなるリ
    ード体と、 前記半導体チツプおよび前記リード体の第１水
    平部と中間部とを一体にモールドするモールド樹
    脂部と からなる表面実装部品。
JP1989058262U 1989-05-19 1989-05-19 表面実装部品 Expired - Fee Related JPH085562Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989058262U JPH085562Y2 (ja) 1989-05-19 1989-05-19 表面実装部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989058262U JPH085562Y2 (ja) 1989-05-19 1989-05-19 表面実装部品

Publications (2)

Publication Number Publication Date
JPH0349U true JPH0349U (ja) 1991-01-07
JPH085562Y2 JPH085562Y2 (ja) 1996-02-14

Family

ID=31583712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989058262U Expired - Fee Related JPH085562Y2 (ja) 1989-05-19 1989-05-19 表面実装部品

Country Status (1)

Country Link
JP (1) JPH085562Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145825U (ja) * 1984-03-06 1985-09-27 株式会社　六▲よう▼社 袋吊り下げ具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device
JPS59145554A (ja) * 1984-02-03 1984-08-21 Hitachi Ltd 複数個の端子を有する電子部品
JPS6371551U (ja) * 1986-10-29 1988-05-13
JPS63151058A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 樹脂封止型半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57176751A (en) * 1981-04-22 1982-10-30 Toshiba Corp Semiconductor device
JPS59145554A (ja) * 1984-02-03 1984-08-21 Hitachi Ltd 複数個の端子を有する電子部品
JPS6371551U (ja) * 1986-10-29 1988-05-13
JPS63151058A (ja) * 1986-12-16 1988-06-23 Matsushita Electronics Corp 樹脂封止型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60145825U (ja) * 1984-03-06 1985-09-27 株式会社　六▲よう▼社 袋吊り下げ具

Also Published As

Publication number Publication date
JPH085562Y2 (ja) 1996-02-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees