JPH031543U - - Google Patents
Info
- Publication number
- JPH031543U JPH031543U JP6052889U JP6052889U JPH031543U JP H031543 U JPH031543 U JP H031543U JP 6052889 U JP6052889 U JP 6052889U JP 6052889 U JP6052889 U JP 6052889U JP H031543 U JPH031543 U JP H031543U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- plastic molded
- lead frame
- molded semiconductor
- terminal structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の一実施例を示す図、第２図は
従来例を示す図である。 １……半導体チツプ、２……放熱板（ベース端
子）、３……ボンデイングワイヤ、４，４ａ……
リード端子。
従来例を示す図である。 １……半導体チツプ、２……放熱板（ベース端
子）、３……ボンデイングワイヤ、４，４ａ……
リード端子。
Claims (1)
- ３端子構造プラスチツクモールド半導体のベー
スリードフレームを分割し、その一部をリード端
子として用いることにより４端子構造としたこと
を特徴とするプラスチツクモールド半導体のリー
ドフレーム構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6052889U JPH031543U (ja) | 1989-05-25 | 1989-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6052889U JPH031543U (ja) | 1989-05-25 | 1989-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031543U true JPH031543U (ja) | 1991-01-09 |
Family
ID=31587969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6052889U Pending JPH031543U (ja) | 1989-05-25 | 1989-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031543U (ja) |
-
1989
- 1989-05-25 JP JP6052889U patent/JPH031543U/ja active Pending