JPS63128740U - - Google Patents
Info
- Publication number
- JPS63128740U JPS63128740U JP1871387U JP1871387U JPS63128740U JP S63128740 U JPS63128740 U JP S63128740U JP 1871387 U JP1871387 U JP 1871387U JP 1871387 U JP1871387 U JP 1871387U JP S63128740 U JPS63128740 U JP S63128740U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- metal material
- material pattern
- sealed
- sio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
図は本考案の一実施例の樹脂封止ＬＳＩの縦断
面図である。 １……ＬＳＩチツプ、２……リードフレーム、
３……ボンデイングワイヤ、４……封止樹脂、５
……ゲル状ＳｉＯ２。
面図である。 １……ＬＳＩチツプ、２……リードフレーム、
３……ボンデイングワイヤ、４……封止樹脂、５
……ゲル状ＳｉＯ２。
Claims (1)
- ＬＳＩチツプ上に金属材料パターンを有する樹
脂封止半導体構造物において、金属材料パターン
表面上にゲル状ＳｉＯ２ペースト又は微粉末の薄
層を与えた後樹脂封止してなることを特徴とする
半導体構造物。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1871387U JPS63128740U (ja) | 1987-02-13 | 1987-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1871387U JPS63128740U (ja) | 1987-02-13 | 1987-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63128740U true JPS63128740U (ja) | 1988-08-23 |
Family
ID=30812636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1871387U Pending JPS63128740U (ja) | 1987-02-13 | 1987-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63128740U (ja) |
-
1987
- 1987-02-13 JP JP1871387U patent/JPS63128740U/ja active Pending