JPH0217850U - - Google Patents

Info

Publication number
JPH0217850U
JPH0217850U JP9631188U JP9631188U JPH0217850U JP H0217850 U JPH0217850 U JP H0217850U JP 9631188 U JP9631188 U JP 9631188U JP 9631188 U JP9631188 U JP 9631188U JP H0217850 U JPH0217850 U JP H0217850U
Authority
JP
Japan
Prior art keywords
resin
sealed
stress
chip
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9631188U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9631188U priority Critical patent/JPH0217850U/ja
Publication of JPH0217850U publication Critical patent/JPH0217850U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案による樹脂封止パツケージの一
実施例を示す断面図、第２図は従来の樹脂封止パ
ツケージの一例を示す断面図、第３図は従来の樹
脂封止パツケージの他の例を示す断面図である。 ２……ＩＣチツプ、３……エポキシ樹脂（高応
力樹脂）、５……ボンデイングワイヤ、６……シ
リコン樹脂（低応力樹脂）。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＩＣチツプ及びボンデイングワイヤの全体を低
    応力樹脂で封止すると共に、その外側を高応力樹
    脂で封止したことを特徴とする樹脂封止パツケー
    ジ。
JP9631188U 1988-07-20 1988-07-20 Pending JPH0217850U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9631188U JPH0217850U (ja) 1988-07-20 1988-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9631188U JPH0217850U (ja) 1988-07-20 1988-07-20

Publications (1)

Publication Number Publication Date
JPH0217850U true JPH0217850U (ja) 1990-02-06

Family

ID=31321185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9631188U Pending JPH0217850U (ja) 1988-07-20 1988-07-20

Country Status (1)

Country Link
JP (1) JPH0217850U (ja)

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