JPH0247053U - - Google Patents

Info

Publication number
JPH0247053U
JPH0247053U JP1988126433U JP12643388U JPH0247053U JP H0247053 U JPH0247053 U JP H0247053U JP 1988126433 U JP1988126433 U JP 1988126433U JP 12643388 U JP12643388 U JP 12643388U JP H0247053 U JPH0247053 U JP H0247053U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit chip
base ribbon
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988126433U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988126433U priority Critical patent/JPH0247053U/ja
Publication of JPH0247053U publication Critical patent/JPH0247053U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例の断面図、第２
図は本考案の第２の実施例に放熱板を取付けた断
面図、第３図は従来の一例の断面図である。 １，１１……ベースリボンのマウント部、２，
１２……ベースリボンのリード部、３，１３……
半導体ＩＣチツプ、４，１４……ボンデイングワ
イヤ、５，１５……樹脂パツケージ、６……放熱
板。

Claims (1)

    【実用新案登録請求の範囲】
  1. フラツトパツケージ用ベースリボンの半導体集
    積回路チツプをマウントする部分を受皿形に整形
    し、その内側に半導体集積回路チツプをマウント
    し外側面をパツケージ表面の一部としトランスフ
    アモールドパツケージングしたことを特徴とする
    半導体集積回路。
JP1988126433U 1988-09-27 1988-09-27 Pending JPH0247053U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988126433U JPH0247053U (ja) 1988-09-27 1988-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988126433U JPH0247053U (ja) 1988-09-27 1988-09-27

Publications (1)

Publication Number Publication Date
JPH0247053U true JPH0247053U (ja) 1990-03-30

Family

ID=31377953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988126433U Pending JPH0247053U (ja) 1988-09-27 1988-09-27

Country Status (1)

Country Link
JP (1) JPH0247053U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08500U (ja) * 1990-12-17 1996-03-12 定男 山口 自動車の保護シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08500U (ja) * 1990-12-17 1996-03-12 定男 山口 自動車の保護シート

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