JPH0236047U - - Google Patents
Info
- Publication number
- JPH0236047U JPH0236047U JP1988115465U JP11546588U JPH0236047U JP H0236047 U JPH0236047 U JP H0236047U JP 1988115465 U JP1988115465 U JP 1988115465U JP 11546588 U JP11546588 U JP 11546588U JP H0236047 U JPH0236047 U JP H0236047U
- Authority
- JP
- Japan
- Prior art keywords
- package
- heat sink
- adhered
- periphery
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例による浸漬冷却用半
導体パツケージを示す斜視図、第２図は他の実施
例のヒートシンクを示す斜視図、第３図は本実施
例の作用説明図、第４図は従来の半導体パツケー
ジを示す図、第５図は課題を示す側面図である。 図において、１は素子、２はパツケージ、３は
リード、５はキヤツプ、６は基板、７は気泡、１
４はヒートシンク、を示す。
導体パツケージを示す斜視図、第２図は他の実施
例のヒートシンクを示す斜視図、第３図は本実施
例の作用説明図、第４図は従来の半導体パツケー
ジを示す図、第５図は課題を示す側面図である。 図において、１は素子、２はパツケージ、３は
リード、５はキヤツプ、６は基板、７は気泡、１
４はヒートシンク、を示す。
Claims (1)
- 周縁より中央にかけて順次高なるように成形し
て熱伝導性の優れたヒートシンク１４を、パツケ
ージ２にマウントした半導体チツプ１の背面に貼
着してなることを特徴とする浸漬冷却用半導体パ
ツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988115465U JPH0719157Y2 (ja) | 1988-08-31 | 1988-08-31 | 浸漬冷却用半導体パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988115465U JPH0719157Y2 (ja) | 1988-08-31 | 1988-08-31 | 浸漬冷却用半導体パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0236047U true JPH0236047U (ja) | 1990-03-08 |
| JPH0719157Y2 JPH0719157Y2 (ja) | 1995-05-01 |
Family
ID=31357148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988115465U Expired - Lifetime JPH0719157Y2 (ja) | 1988-08-31 | 1988-08-31 | 浸漬冷却用半導体パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719157Y2 (ja) |
-
1988
- 1988-08-31 JP JP1988115465U patent/JPH0719157Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719157Y2 (ja) | 1995-05-01 |