JPH02856B2 - - Google Patents

Info

Publication number
JPH02856B2
JPH02856B2 JP55143809A JP14380980A JPH02856B2 JP H02856 B2 JPH02856 B2 JP H02856B2 JP 55143809 A JP55143809 A JP 55143809A JP 14380980 A JP14380980 A JP 14380980A JP H02856 B2 JPH02856 B2 JP H02856B2
Authority
JP
Japan
Prior art keywords
chip carrier
semiconductor element
semiconductor
circuit board
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55143809A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5768060A (en
Inventor
Kishio Yokochi
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55143809A priority Critical patent/JPS5768060A/ja
Publication of JPS5768060A publication Critical patent/JPS5768060A/ja
Publication of JPH02856B2 publication Critical patent/JPH02856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/73

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55143809A 1980-10-15 1980-10-15 Chip carrier Granted JPS5768060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55143809A JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55143809A JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Publications (2)

Publication Number Publication Date
JPS5768060A JPS5768060A (en) 1982-04-26
JPH02856B2 true JPH02856B2 (enExample) 1990-01-09

Family

ID=15347468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55143809A Granted JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Country Status (1)

Country Link
JP (1) JPS5768060A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820684B1 (en) * 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader

Also Published As

Publication number Publication date
JPS5768060A (en) 1982-04-26

Similar Documents

Publication Publication Date Title
KR200448519Y1 (ko) 돌출형 ⅰc 패키지용 방열판
JP2901835B2 (ja) 半導体装置
JPH08222690A (ja) マイクロプロセッサ用半導体モジュール
US6643136B2 (en) Multi-chip package with embedded cooling element
CN117480602A (zh) 半导体模块
JPH04291750A (ja) 放熱フィンおよび半導体集積回路装置
JPH02856B2 (enExample)
JPH06204398A (ja) 混成集積回路装置
JP2888183B2 (ja) 樹脂封止型半導体装置
JP2624362B2 (ja) 半導体素子の放熱兼用シールドケース
JPS6130742B2 (enExample)
JP2718136B2 (ja) 樹脂封止型半導体装置
JPS6144450Y2 (enExample)
JPH05144983A (ja) 樹脂封止型半導体装置
JPS629222B2 (enExample)
JPH0529717A (ja) ヒートパイプを内蔵したプリント基板
JPH03263862A (ja) 電子部品の冷却装置
JP2765242B2 (ja) 集積回路装置
JPH06181395A (ja) 放熱形プリント配線板
JPH11284119A (ja) 半導体集積デバイスの放熱構造
JP2006140203A (ja) Sip放熱パッケージ
JP2734688B2 (ja) 混成集積回路
JP3015199U (ja) 放熱体および半導体パッケージ
JP2003017634A (ja) 半導体モジュール
JPH0722547A (ja) 半導体装置