JPH02856B2 - - Google Patents

Info

Publication number
JPH02856B2
JPH02856B2 JP14380980A JP14380980A JPH02856B2 JP H02856 B2 JPH02856 B2 JP H02856B2 JP 14380980 A JP14380980 A JP 14380980A JP 14380980 A JP14380980 A JP 14380980A JP H02856 B2 JPH02856 B2 JP H02856B2
Authority
JP
Japan
Prior art keywords
chip carrier
semiconductor element
semiconductor
circuit board
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14380980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5768060A (en
Inventor
Kishio Yokochi
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14380980A priority Critical patent/JPS5768060A/ja
Publication of JPS5768060A publication Critical patent/JPS5768060A/ja
Publication of JPH02856B2 publication Critical patent/JPH02856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14380980A 1980-10-15 1980-10-15 Chip carrier Granted JPS5768060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14380980A JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14380980A JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Publications (2)

Publication Number Publication Date
JPS5768060A JPS5768060A (en) 1982-04-26
JPH02856B2 true JPH02856B2 (cs) 1990-01-09

Family

ID=15347468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14380980A Granted JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Country Status (1)

Country Link
JP (1) JPS5768060A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820684B1 (en) * 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader

Also Published As

Publication number Publication date
JPS5768060A (en) 1982-04-26

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