JPS5768060A - Chip carrier - Google Patents

Chip carrier

Info

Publication number
JPS5768060A
JPS5768060A JP55143809A JP14380980A JPS5768060A JP S5768060 A JPS5768060 A JP S5768060A JP 55143809 A JP55143809 A JP 55143809A JP 14380980 A JP14380980 A JP 14380980A JP S5768060 A JPS5768060 A JP S5768060A
Authority
JP
Japan
Prior art keywords
chip
carrier
ebullition
coolant
nuclide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55143809A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02856B2 (cs
Inventor
Kishio Yokouchi
Koichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55143809A priority Critical patent/JPS5768060A/ja
Publication of JPS5768060A publication Critical patent/JPS5768060A/ja
Publication of JPH02856B2 publication Critical patent/JPH02856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55143809A 1980-10-15 1980-10-15 Chip carrier Granted JPS5768060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55143809A JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55143809A JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Publications (2)

Publication Number Publication Date
JPS5768060A true JPS5768060A (en) 1982-04-26
JPH02856B2 JPH02856B2 (cs) 1990-01-09

Family

ID=15347468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55143809A Granted JPS5768060A (en) 1980-10-15 1980-10-15 Chip carrier

Country Status (1)

Country Link
JP (1) JPS5768060A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820684B1 (en) * 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6820684B1 (en) * 2003-06-26 2004-11-23 International Business Machines Corporation Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader

Also Published As

Publication number Publication date
JPH02856B2 (cs) 1990-01-09

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