JPH0282039U - - Google Patents
Info
- Publication number
- JPH0282039U JPH0282039U JP16192488U JP16192488U JPH0282039U JP H0282039 U JPH0282039 U JP H0282039U JP 16192488 U JP16192488 U JP 16192488U JP 16192488 U JP16192488 U JP 16192488U JP H0282039 U JPH0282039 U JP H0282039U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- tweezers
- pair
- moving
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
Landscapes
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例の斜視図
及び正面図、第２図ａ，ｂは本考案の第２の実施
例の斜視図及び正面図、第３図は従来の半導体集
積回路ウエーハ移動用ピンセツトの一例の斜視図
である。
１……ウエーハ回路面をつまむ部分、２……ウ
エーハ裏面をつまむ部分、３……半球形突起。
Figures 1a and b are perspective views and front views of the first embodiment of the invention, Figures 2a and b are perspective views and front views of the second embodiment of the invention, and Figure 3 is a conventional FIG. 2 is a perspective view of an example of tweezers for moving a semiconductor integrated circuit wafer. 1... A part that pinches the circuit surface of the wafer, 2... A part that pinches the back side of the wafer, 3... A hemispherical protrusion.
Claims (1)
用いるピンセツトにおいて、前記ウエーハをつま
む際に該ウエーハに接触する互いに対向する一対
の面のうちの少なくとも前記ウエーハの加工面に
接触する面上に少なくとも２個の半球形の突起を
有することを特徴とするピンセツト。 In a tweezers used for moving a wafer in the manufacturing process of semiconductor integrated circuits, at least two tweezers are provided on at least the surface that contacts the processed surface of the wafer among a pair of opposing surfaces that contact the wafer when pinching the wafer. A pair of tweezers characterized by having hemispherical projections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16192488U JPH0282039U (en) | 1988-12-13 | 1988-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16192488U JPH0282039U (en) | 1988-12-13 | 1988-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0282039U true JPH0282039U (en) | 1990-06-25 |
Family
ID=31445287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16192488U Pending JPH0282039U (en) | 1988-12-13 | 1988-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0282039U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011073875A (en) * | 2009-10-02 | 2011-04-14 | Sharp Corp | Conveying method |
| CN107557746A (en) * | 2016-07-01 | 2018-01-09 | 佳能特机株式会社 | Substrate holding apparatus, film formation device and film build method |
-
1988
- 1988-12-13 JP JP16192488U patent/JPH0282039U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011073875A (en) * | 2009-10-02 | 2011-04-14 | Sharp Corp | Conveying method |
| CN107557746A (en) * | 2016-07-01 | 2018-01-09 | 佳能特机株式会社 | Substrate holding apparatus, film formation device and film build method |
| KR20180003993A (en) * | 2016-07-01 | 2018-01-10 | 캐논 톡키 가부시키가이샤 | Substrate clamping apparatus, film formation apparatus and film formation method |
| JP2018003094A (en) * | 2016-07-01 | 2018-01-11 | キヤノントッキ株式会社 | Substrate-pinching apparatus, film deposition apparatus, and film deposition method |
| CN107557746B (en) * | 2016-07-01 | 2020-11-10 | 佳能特机株式会社 | Substrate clamping device, film forming device and film forming method |