JP2018003094A - Substrate-pinching apparatus, film deposition apparatus, and film deposition method - Google Patents

Substrate-pinching apparatus, film deposition apparatus, and film deposition method Download PDF

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JP2018003094A
JP2018003094A JP2016131734A JP2016131734A JP2018003094A JP 2018003094 A JP2018003094 A JP 2018003094A JP 2016131734 A JP2016131734 A JP 2016131734A JP 2016131734 A JP2016131734 A JP 2016131734A JP 2018003094 A JP2018003094 A JP 2018003094A
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substrate
pressing
facing
support
tool
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JP6309047B2 (en
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啓介 大谷
Keisuke Otani
啓介 大谷
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Canon Tokki Corp
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Canon Tokki Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a substrate-pinching apparatus capable of transferring a substrate from a pinched state to a released state without sticking the substrate on a pressing piece.SOLUTION: A substrate-pinching apparatus has a supporting piece 2 for supporting a substrate 1 and a pressing piece 3 arranged oppositely to the supporting piece 2 for pressing the substrate 1. The substrate 1 is pinched by the supporting piece 2 and the pressing piece 3. The pressing piece 3 has three or more pressing parts 4 protruding toward the substrate 1 on the surface of the pressing piece 3 facing the substrate 1. The pressing parts 4 are arranged so that two or more apexes 4a thereof are apart from the apex 4a of any pressing part 4 in the different plane direction parallel to the surface facing the substrate 1. These pressing parts 4 press the substrate 1.SELECTED DRAWING: Figure 1

Description

本発明は、基板挟持装置、成膜装置及び成膜方法に関するものである。   The present invention relates to a substrate holding apparatus, a film forming apparatus, and a film forming method.

例えば、特許文献１に開示されるような、クランプ部材を基板に押し付けて基板の外周部を挟持する基板挟持機構において、基板を挟持した状態から、クランプ部材を基板から離間させて基板を挟持しない解放状態にする際、基板に押し付けていたクランプ部材の接触面に剥離帯電が生じ、離間するクランプ部材に基板が貼り付いてしまう場合がある。   For example, in a substrate holding mechanism that presses a clamp member against a substrate and holds the outer peripheral portion of the substrate as disclosed in Patent Document 1, the clamp member is not separated from the substrate from the state in which the substrate is held. In the release state, peeling electrification may occur on the contact surface of the clamp member that has been pressed against the substrate, and the substrate may stick to the separated clamp member.

この場合、基板の落下や破損のおそれがあることから、剥離帯電が生じない構成が要望されている。   In this case, since there is a risk of the substrate falling or being damaged, a configuration in which peeling electrification does not occur is desired.

特開２００６−１７２９３０号公報JP 2006-172930 A

本発明は、上述のような現状に鑑みなされたもので、基板を押圧具に貼り付かせることなく、挟持状態から解放状態に移行できる基板挟持装置、成膜装置及び成膜方法を提供するものである。   The present invention has been made in view of the above-described situation, and provides a substrate clamping apparatus, a film forming apparatus, and a film forming method capable of shifting from a clamped state to a released state without attaching the substrate to a pressing tool. It is.

基板を支持する支持具と、この支持具に対向配置され、前記基板を押圧する押圧具とを有し、前記支持具と前記押圧具とで前記基板を挟持する基板挟持装置であって、前記押圧具の基板との対向面には、前記基板側に向かって突出する押圧部が３つ以上設けられ、且つ、前記押圧部は、いずれかの前記押圧部の頂部に対し他の２つ以上の前記押圧部の頂部が前記対向面と平行な平面方向において異なる方向に離間した状態で設けられており、これらの押圧部で前記基板を押圧するように構成されていることを特徴とする基板挟持装置に係るものである。   A substrate holding apparatus that has a support that supports a substrate, and a pressing tool that is disposed opposite to the support and presses the substrate, and holds the substrate between the support and the pressing tool, Three or more pressing portions projecting toward the substrate side are provided on the surface of the pressing tool facing the substrate, and the other two or more pressing portions with respect to the top of any of the pressing portions. The top portion of the pressing portion is provided in a state of being separated in different directions in a plane direction parallel to the facing surface, and the substrate is configured to press the substrate with these pressing portions. The present invention relates to a clamping device.

本発明は上述のように構成したから、基板を押圧具に貼り付かせることなく、挟持状態から解放状態に移行できる基板挟持装置、成膜装置及び成膜方法となる。   Since the present invention is configured as described above, it becomes a substrate holding apparatus, a film forming apparatus, and a film forming method capable of shifting from a holding state to a released state without attaching the substrate to a pressing tool.

本実施例の概略説明断面図である。It is a schematic explanatory sectional drawing of a present Example. 本実施例の押圧具の拡大概略説明斜視図である。It is an expansion outline explanatory perspective view of the pressing tool of a present Example. 本実施例の押圧具の概略説明断面図である。It is a schematic explanatory sectional drawing of the press tool of a present Example. 本実施例の押圧部の概略説明断面図である。It is a schematic explanatory sectional drawing of the press part of a present Example.

好適と考える本発明の実施形態を、図面に基づいて本発明の作用を示して簡単に説明する。   An embodiment of the present invention which is considered to be suitable will be briefly described with reference to the drawings showing the operation of the present invention.

支持具２に支持された基板１を押圧具３で押圧することで基板１を挟持する際、押圧具３の押圧部４により基板１が押圧される。この押圧部４は、その頂部４ａが押圧具３の基板１との対向面に夫々離間した状態で３つ以上設けているから、押圧具３が基板１に与える力が局所的にならず、基板の破損を防止できる。即ち、３つの押圧部４の各頂部４ａが平面方向において離間し、且つ、いずれかの押圧部４の頂部４ａに対し他の２つ以上の押圧部４の頂部４ａが異なる方向に離間することで、３つ以上の押圧部４の頂部４ａが一直線上にのみ配置される構成とはならず、基板１の所定範囲を多数点で分散して押圧できる構成となる。   When the substrate 1 is held by pressing the substrate 1 supported by the support 2 with the pressing tool 3, the substrate 1 is pressed by the pressing portion 4 of the pressing tool 3. Since three or more of the pressing parts 4 are provided in a state in which the top part 4a is separated from the surface of the pressing tool 3 facing the substrate 1, the force that the pressing tool 3 applies to the substrate 1 is not localized, Damage to the substrate can be prevented. That is, the top portions 4a of the three pressing portions 4 are separated in the planar direction, and the top portions 4a of the other two or more pressing portions 4 are separated from the top portions 4a of any one of the pressing portions 4 in different directions. Thus, the top portions 4a of the three or more pressing portions 4 are not arranged only on a straight line, and the predetermined range of the substrate 1 can be distributed and pressed at many points.

また、挟持状態から、押圧具３を離間させて押圧を解除して解放状態とする際、押圧具３の基板１との対向面の前記押圧部４が基板１を押圧しているから、押圧部４がない押圧具３の基板１との対向面を基板１に押圧する場合に比べ、基板１と押圧具３との接触面積を小さくすることができる。従って、押圧具３を基板１から離間する際に基板１から離れ易く、また、接触面の帯電を減少させることができ、よって、押圧具３を離間する際に基板１が貼り付くことを防止できることになる。   Further, when the pressing tool 3 is released from the sandwiched state by releasing the pressing to be in the released state, the pressing portion 4 on the surface of the pressing tool 3 facing the substrate 1 presses the substrate 1. The contact area between the substrate 1 and the pressing tool 3 can be made smaller than when the surface of the pressing tool 3 that does not have the portion 4 is pressed against the substrate 1. Therefore, when the pressing tool 3 is separated from the substrate 1, it can be easily separated from the substrate 1, and charging of the contact surface can be reduced, and thus the substrate 1 is prevented from sticking when the pressing tool 3 is separated. It will be possible.

本発明の具体的な実施例について図面に基づいて説明する。   Specific embodiments of the present invention will be described with reference to the drawings.

本実施例は、図１に図示したように、真空槽７内に、基板１とマスク８とを配置して蒸発源９等から成る成膜機構を用いて成膜を行う成膜装置に本発明を適用した例である。この成膜装置には、蒸発源９から射出された蒸発粒子の蒸発レートをモニタする膜厚モニタ、真空槽７外に設けたモニタした蒸発粒子の量を膜厚に換算する膜厚計、換算された膜厚が所望の膜厚になるように成膜材料の蒸発レートを制御するために蒸発源９を加熱するヒータ用電源等が設けられる。この成膜装置は、例えば、有機エレクトロルミネッセンス表示装置のための表示パネルの製造に用いられる。   In this embodiment, as shown in FIG. 1, the substrate 1 and the mask 8 are arranged in a vacuum chamber 7 and a film forming apparatus for forming a film using a film forming mechanism including an evaporation source 9 and the like is used. It is an example to which the invention is applied. This film forming apparatus includes a film thickness monitor that monitors the evaporation rate of the evaporated particles emitted from the evaporation source 9, a film thickness meter that converts the amount of the monitored evaporated particles provided outside the vacuum chamber 7 into a film thickness, In order to control the evaporation rate of the film forming material so that the obtained film thickness becomes a desired film thickness, a heater power source for heating the evaporation source 9 is provided. This film forming apparatus is used for manufacturing a display panel for an organic electroluminescence display device, for example.

具体的には、真空槽７には、マスク８がマスク支持体10に支持された状態で配置され、このマスク８と基板１との相対距離を変化させる移動機構６が設けられている。   Specifically, the vacuum chamber 7 is provided with a mask 8 that is supported by a mask support 10 and a moving mechanism 6 that changes the relative distance between the mask 8 and the substrate 1.

移動機構６は、その固定部が真空槽７の壁面に取り付けられ、真空槽７の壁面に対して接離移動するように固定部に進退自在に設けられた移動部の先端部に基板支持体11が設けられている。従って、移動部を進退移動させることで、基板支持体11に支持された基板１１がマスク８に対して接離移動する。   The moving mechanism 6 has a fixed portion attached to the wall surface of the vacuum chamber 7, and a substrate support at the distal end of the moving portion that is provided so as to move forward and backward in the fixed portion so as to move toward and away from the wall surface of the vacuum chamber 7. 11 is provided. Therefore, the substrate 11 supported by the substrate support 11 moves toward and away from the mask 8 by moving the moving portion forward and backward.

基板支持体11には、基板１の下面外周部と接触して基板１を支持する支持具２と、この支持具２と対向配置され、即ち、基板１を挟むように基板１の上面側に設けられ基板１を支持具２に押圧する押圧具３とを備えている。   The substrate support 11 is disposed in contact with the outer peripheral portion of the lower surface of the substrate 1 to support the substrate 1 and is opposed to the support 2, that is, on the upper surface side of the substrate 1 so as to sandwich the substrate 1. And a pressing tool 3 that presses the substrate 1 against the support 2.

また、基板支持体11は、胴部の左右に袖部が垂設された断面視略コ字状体であり、袖部の先端から内方に突出するように支持具２が設けられている。また、この支持具２に夫々対向するように押圧具３の軸部13が突没自在に設けられた基部12が設けられている。   The substrate support 11 is a substantially U-shaped cross-sectional view in which sleeves are suspended from the left and right sides of the trunk, and the support 2 is provided so as to protrude inward from the tip of the sleeve. . Further, a base portion 12 is provided in which the shaft portion 13 of the pressing tool 3 is provided so as to protrude and retract so as to face the support tool 2.

押圧具３は、基部12から突出して基板１を支持具２に押し付けることで基板１を挟持するように構成されている。この支持具２及び押圧具３により、押圧具３を基板１に押圧した挟持状態と、基板１から押圧具３を後退させて基板１を挟持しない解放状態とに適宜切り替えることが可能となる。   The pressing tool 3 is configured to protrude from the base portion 12 so as to hold the substrate 1 by pressing the substrate 1 against the support tool 2. The support tool 2 and the pressing tool 3 can be appropriately switched between a holding state in which the pressing tool 3 is pressed against the substrate 1 and a released state in which the pressing tool 3 is retracted from the substrate 1 and the substrate 1 is not clamped.

支持具２及び押圧具３は、基板１の複数の辺部に当接するように複数設けられている。本実施例では、支持具２及び押圧具３は基板１の対向する一対の辺部に当接するように一対設けられている。   A plurality of support tools 2 and pressing tools 3 are provided so as to abut on a plurality of sides of the substrate 1. In this embodiment, a pair of the support tool 2 and the pressing tool 3 are provided so as to come into contact with a pair of opposite sides of the substrate 1.

また、本実施例では、１つの辺部に対して当該辺部の長手方向略全体に当接するように前記一対の支持具２及び押圧具３が夫々構成されている。なお、１つの辺部に対して複数の支持具２及び押圧具３を設けて１つの辺部を多数点で支持及び挟持する構成としても良い。また、基板１の角部を複数箇所挟持する構成としても良い。   Further, in the present embodiment, the pair of support tools 2 and the pressing tool 3 are respectively configured so as to come into contact with substantially one entire side portion in the longitudinal direction. In addition, it is good also as a structure which provides the several support tool 2 and the pressing tool 3 with respect to one side part, and supports and clamps one side part in many points. Moreover, it is good also as a structure which clamps the corner | angular part of the board | substrate 1 in multiple places.

押圧具３には、基板１の端部と対向し、矩形状で所定面積の平坦な対向面が設けられている。この対向面に基板１側に向かって突出する押圧部４が、その頂部４ａが離間した状態で３つ以上突設されている。具体的には、いずれかの押圧部４の頂部４ａに対し他の２つ以上の押圧部４の頂部４ａが前記対向面と平行な平面方向において異なる方向に離間した状態で設けられている。   The pressing tool 3 is provided with a flat opposing surface that is rectangular and has a predetermined area facing the end of the substrate 1. Three or more pressing portions 4 projecting toward the substrate 1 are provided on the opposing surface in a state where the top portions 4a are separated from each other. Specifically, the top portions 4a of the other two or more pressing portions 4 are provided in a state separated from the top portions 4a of any of the pressing portions 4 in different directions in a plane direction parallel to the facing surface.

押圧部４は先端程先細る突起状に構成される。例えば、円錐や角錐の頭頂部を水平に切り落としたような形状を採用できる。本実施例においては、四角錐の頭頂部を水平に切り落とした形状としている。   The pressing portion 4 is formed in a protruding shape that tapers toward the tip. For example, a shape obtained by horizontally cutting off the top of a cone or a pyramid can be employed. In this embodiment, the top of the quadrangular pyramid is cut horizontally.

図２，３に図示したように、本実施例の押圧具３の基板１との対向面は、基板１の挟持する辺部に沿って設けられる長辺部と、この長辺部より短い短辺部とを有し、この長辺部及び短辺部の縁部５夫々に沿って押圧部４を多数配列した構成である。   As shown in FIGS. 2 and 3, the surface of the pressing tool 3 of the present embodiment facing the substrate 1 has a long side portion provided along the side portion sandwiched by the substrate 1 and a short side shorter than the long side portion. And a plurality of pressing portions 4 are arranged along each of the edge portions 5 of the long side portion and the short side portion.

即ち、本実施例の押圧部４は、基板１との対向面の縁部５と平行に複数並設され、且つ、挟持する基板１の辺部と平行に複数列（２列）設けられている。従って、基板１を挟持する辺部に沿って多数の押圧部４が複数列存在し、それだけ基板１を良好に挟持することが可能となる。   That is, a plurality of pressing portions 4 of the present embodiment are provided in parallel with the edge portion 5 of the surface facing the substrate 1 and are provided in a plurality of rows (two rows) in parallel with the side portion of the substrate 1 to be sandwiched. Yes. Accordingly, there are a plurality of rows of the pressing portions 4 along the side portions that sandwich the substrate 1, and the substrate 1 can be favorably sandwiched accordingly.

なお、押圧部４の配列は上述の配列に限らず、求める挟持力と貼り付き防止性から適宜設定して良い。例えば円環状に配列しても良いし、前記対向面の四隅にのみ設ける構成としても良いし、千鳥状に配列しても良いし、三角形の頂点に夫々設けるような三角形配列としても良いし、基板中心側の上底を長辺とし下底を短辺とする台形の頂点に夫々設けるような台形配列としても良い。   Note that the arrangement of the pressing portions 4 is not limited to the above arrangement, and may be set as appropriate from the required clamping force and sticking prevention property. For example, it may be arranged in an annular shape, it may be provided only at the four corners of the facing surface, it may be arranged in a staggered manner, or it may be a triangular arrangement that is provided at each vertex of the triangle, A trapezoidal arrangement may be adopted in which the upper base of the substrate center side has a long side and the lower base has a short side.

また、押圧部４の頂部４ａは、押圧具３の基板１との対向面の縁部５から内方に後退した位置に設けられている。具体的には、押圧部４の底部と頂部４ａとを繋ぐ側面部４ｂが傾斜面に設定されている。本実施例では、側面部４ｂが頂部４ａ側ほど先細るテーパ面に設定されている。従って、本実施例は、押圧部４の底部が隣り合う押圧部４の底部と当接するように多数の押圧部４を密集状態で並設しているが、基板１と接触する頂部４ａは平面方向に離間して配置される。   Further, the top portion 4 a of the pressing portion 4 is provided at a position retracted inward from the edge portion 5 of the surface of the pressing tool 3 facing the substrate 1. Specifically, the side part 4b which connects the bottom part and the top part 4a of the press part 4 is set to the inclined surface. In the present embodiment, the side surface portion 4b is set to a tapered surface that tapers toward the top portion 4a side. Accordingly, in the present embodiment, a large number of pressing parts 4 are arranged in a dense state so that the bottom part of the pressing part 4 comes into contact with the bottom part of the adjacent pressing part 4, but the top part 4a in contact with the substrate 1 is flat. They are spaced apart in the direction.

また、押圧部４の頂部４ａと側面部４ｂとの間の角部が鈍角となって挟持した基板１がバタついても角が立ちにくく、基板１の破損を可及的に防止できる構成となる。なお、図４に図示したように、押圧部４の頂部４ａと側面部４ｂとの間の角部４ｃをＲ形状としても良い。この場合、一層基板１が破損し難い構成となる。   Moreover, even if the board | substrate 1 pinched by the corner | angular part between the top part 4a and the side part 4b of the press part 4 becoming obtuse, the corner | angular part is hard to stand up and it becomes the structure which can prevent the damage | damage of the board | substrate 1 as much as possible. . In addition, as illustrated in FIG. 4, the corner portion 4 c between the top portion 4 a and the side surface portion 4 b of the pressing portion 4 may be R-shaped. In this case, the substrate 1 is not easily damaged.

また、押圧具３の押圧部４は、アルミニウム等の金属材料製であり、表面にフッ素コーティングが施された構成としている。なお、フッ素コーティングに替えて表面にブラスト処理を施しても良いし、フッ素コーティング及びブラスト処理の双方を施しても良い。   Moreover, the pressing part 4 of the pressing tool 3 is made of a metal material such as aluminum, and has a configuration in which a fluorine coating is applied to the surface. Note that the surface may be subjected to blasting instead of fluorine coating, or both fluorine coating and blasting may be performed.

本発明は、本実施例に限られるものではなく、各構成要件の具体的構成は適宜設計し得るものである。   The present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.

１ 基板
２ 支持具
３ 押圧具
４ 押圧部
４ａ 頂部
４ｂ 側面部
５ 縁部
７ 真空槽 DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Support tool 3 Press tool 4 Press part 4a Top part 4b Side surface part 5 Edge part 7 Vacuum chamber

Claims (9)

基板を支持する支持具と、この支持具に対向配置され、前記基板を押圧する押圧具とを有し、前記支持具と前記押圧具とで前記基板を挟持する基板挟持装置であって、前記押圧具の基板との対向面には、前記基板側に向かって突出する押圧部が３つ以上設けられ、且つ、前記押圧部は、いずれかの前記押圧部の頂部に対し他の２つ以上の前記押圧部の頂部が前記対向面と平行な平面方向において異なる方向に離間した状態で設けられており、これらの押圧部で前記基板を押圧するように構成されていることを特徴とする基板挟持装置。   A substrate holding apparatus that has a support that supports a substrate, and a pressing tool that is disposed opposite to the support and presses the substrate, and holds the substrate between the support and the pressing tool, Three or more pressing portions projecting toward the substrate side are provided on the surface of the pressing tool facing the substrate, and the other two or more pressing portions with respect to the top of any of the pressing portions. The top portion of the pressing portion is provided in a state of being separated in different directions in a plane direction parallel to the facing surface, and the substrate is configured to press the substrate with these pressing portions. Pinching device. 前記押圧部の頂部は、前記基板との対向面の縁部から内方に後退した位置に設けられていることを特徴とする請求項１に記載の基板挟持装置。   The substrate clamping apparatus according to claim 1, wherein a top portion of the pressing portion is provided at a position retracted inward from an edge portion of a surface facing the substrate. 前記押圧部の底部と頂部とを繋ぐ側面部が傾斜面に設定されていることを特徴とする請求項２に記載の基板挟持装置。   The substrate holding apparatus according to claim 2, wherein a side surface portion connecting the bottom portion and the top portion of the pressing portion is set to be an inclined surface. 前記側面部が前記頂部側ほど先細るテーパ面に設定されていることを特徴とする請求項３に記載の基板挟持装置。   The substrate holding apparatus according to claim 3, wherein the side surface portion is set to a tapered surface that tapers toward the top side. 前記押圧部は、前記基板との対向面の縁部と平行に複数並設されていることを特徴とする請求項１〜４のいずれか１項に記載の基板挟持装置。   5. The substrate holding apparatus according to claim 1, wherein a plurality of the pressing portions are arranged in parallel with an edge portion of a surface facing the substrate. 前記押圧部は、挟持する前記基板の辺部と平行に複数列設けられていることを特徴とする請求項５に記載の基板挟持装置。   The substrate pressing apparatus according to claim 5, wherein the pressing portion is provided in a plurality of rows in parallel with a side portion of the substrate to be clamped. 前記押圧部は、前記基板との矩形状の対向面の４つの縁部夫々に沿って並設されていることを特徴とする請求項５に記載の基板挟持装置。   The substrate pressing apparatus according to claim 5, wherein the pressing portion is arranged in parallel along each of four edges of a rectangular facing surface with the substrate. 真空槽内に設けられた基板に成膜を行う成膜装置であって、請求項１〜７のいずれか１項に記載の基板挟持装置が設けられていることを特徴とする成膜装置。   A film forming apparatus for forming a film on a substrate provided in a vacuum chamber, wherein the substrate holding apparatus according to claim 1 is provided. 基板に成膜を行う成膜方法であって、
前記基板を挟持する挟持工程と、
前記挟持工程で挟持された基板を挟持しない解放状態とする解放工程とを有し、
前記挟持工程及び前記解放工程は、請求項１〜７のいずれか１項に記載の基板挟持装置を用いて行うことを特徴とする成膜方法。 A film forming method for forming a film on a substrate,
A clamping step of clamping the substrate;
A releasing step for releasing the substrate sandwiched in the sandwiching step so as not to be sandwiched,
The film-forming method characterized by performing the said clamping process and the said releasing process using the board | substrate clamping apparatus of any one of Claims 1-7.
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