CN107557746A - Substrate holding apparatus, film formation device and film build method - Google Patents
Substrate holding apparatus, film formation device and film build method Download PDFInfo
- Publication number
- CN107557746A CN107557746A CN201710518668.9A CN201710518668A CN107557746A CN 107557746 A CN107557746 A CN 107557746A CN 201710518668 A CN201710518668 A CN 201710518668A CN 107557746 A CN107557746 A CN 107557746A
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- China
- Prior art keywords
- substrate
- holding apparatus
- press section
- substrate holding
- pressing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of substrate holding apparatus that substrate can be made to be shifted from clamp position to release conditions with being not adhere to pressing apparatus.Substrate holding apparatus has the support services (2) of supporting substrates (1) and is configured in opposite directions with the support services (2) and press the pressing apparatus (3) of the substrate (1), the substrate (1) is clamped by the support services (2) and the pressing apparatus (3), wherein, on the forward surface opposite with substrate (1) of the pressing apparatus (3), it is provided with the press section (4) of more than three of the substrate (1) side protrusion, and, the press section (4) is set with the top (4a) of other more than two press sections (4) relative to the top of press section any one described (4) (4a) on the in-plane parallel from the forward surface to the state that different directions separates, the substrate (1) is pressed by above-mentioned press section (4).
Description
Technical field
The present invention relates to substrate holding apparatus, film formation device and film build method.
Background technology
Clamping component is being pressed on into substrate to clamp the substrate clamping of the peripheral part of substrate disclosed in such as patent document 1
In mechanism, for example, working as makes clamping component separate and turn into the release shape for not clamping substrate from substrate from the state for being clamped with substrate
During state, the contact surface in the clamping component for pressing on substrate is peeling powered and substrate is adhered to folder to be separated sometimes
Tight component.
In this case, there is substrate to fall or the anxiety of breakage, it is desirable to be that will not be peeling powered structure.
【Citation】
【Patent document】
【Patent document 1】Japanese Unexamined Patent Publication 2006-172930 publications
The content of the invention
【The invention problem to be solved】
The present invention in view of present situation as described above and make, its object is to provide one kind can make substrate be not adhere to by
Substrate holding apparatus, film formation device and the film build method shifted from pressure apparatus from clamp position to release conditions.
【For solving the scheme of problem】
A kind of substrate holding apparatus, the substrate holding apparatus have supporting substrates support services and with the support services
Configure in opposite directions and press the pressing apparatus of the substrate, the base is clamped by the support services and the pressing apparatus
Plate, it is characterised in that on the forward surface opposite with substrate of the pressing apparatus, be provided with the substrate-side protrudes three
It is individual more than press section, also, the press section with the top relative to press section any one described other two or more
The state from the in-plane parallel from the forward surface to different directions that separated on of top of the press section set, lead to
Cross above-mentioned press section and press the substrate.
【Invention effect】
It is of the invention to form as described above, therefore being formed can be such that substrate is not adhere to pressing apparatus from clamp position to releasing
Put substrate holding apparatus, film formation device and the film build method of state transfer.
Brief description of the drawings
Fig. 1 is that the present embodiment outlines sectional view.
Fig. 2 is that the amplification of the pressing apparatus of the present embodiment outlines stereogram.
Fig. 3 is that the pressing apparatus of the present embodiment outlines sectional view.
Fig. 4 is that the press section of the present embodiment outlines sectional view.
【Symbol description】
1 substrate
2 support services
3 pressing apparatus
4 press sections
At the top of 4a
4b side surface parts
5 edges
7 vacuum tanks
Embodiment
It is considered as preferable embodiments of the present invention so as to briefly describe based on the effect of the accompanying drawing displaying present invention.
The substrate 1 for being supported on support services 2 is being pressed and when clamping substrate 1 using pressing apparatus 3, passing through pressing
The press section 4 of apparatus 3 presses substrate 1.The press section 4 is with its top 4a on the forward surface opposite with substrate 1 of pressing apparatus 3
The state separated respectively sets more than 3, therefore the power that pressing apparatus 3 applies to substrate 1 will not be as the power of locality, can
Prevent the breakage of substrate.That is, each top 4a of 3 press sections 4 is separated in the in-plane direction, and relative to any one press section
For 4 top 4a, the top 4a of other more than 2 press sections 4 is separated in a different direction, thus without as 3
The top 4a of press section 4 more than individual only configures structure point-blank, but can be pressed in a manner of multi-point dispersion
The prescribed limit of substrate 1.
In addition, when making pressing apparatus 3 be separated from clamp position, when releasing pressing and turning into release conditions, apparatus 3 is pressed
With substrate 1 opposite forward surface the press section 4 press substrate 1, therefore, with by no press section 4 pressing apparatus 3 with
The opposite opposite situation about being pressed towards substrate 1 of substrate 1 is compared, and can reduce substrate 1 with pressing the contact area of apparatus 3.From
And it is left from substrate 1 when pressing apparatus 3 is separated from substrate 1, moreover, the powered of contact surface can be reduced, by
This, can prevent that the situation that substrate 1 adheres to when apparatus 3 separates will be being pressed.
【Embodiment】
Based on accompanying drawing, illustrate specific embodiment of the invention.
As illustrated in fig. 1, the present embodiment is the example for applying the present invention to following film formation devices, and the film formation device exists
Substrate 1 and mask 8 are configured with vacuum tank 7, and film forming is carried out using the film forming mechanism formed by the grade of evaporation source 9.In the film forming
Film-thickness monitors, film thickness gauge and heater power supply etc. are provided with device, the film-thickness monitors from evaporation source 9 to releasing
The evaporation rate of evaporation particle be monitored, it is outer and by the amount of the evaporation particle monitored that the film thickness gauge is arranged on vacuum tank 7
It is converted into thickness, the heater power supply is in order to control the evaporation rate of filmogen so that the thickness to be converted turns into desired
Thickness and evaporation source 9 is heated.The film formation device is used for the display of Production Example such as organic el display
Panel.
Specifically, in vacuum tank 7, to be supported on the state of mask supporting mass 10 configuration mask 8, and being provided with covers this
The relative distance of mould 8 and substrate 1 produces the travel mechanism 6 of change.
The fixed part of travel mechanism 6 is installed on the wall of vacuum tank 7, is set in the leading section of the move portion of travel mechanism 6
Have substrate supporting body 11, the move portion by carry out separateing relative to the wall of vacuum tank 7 it is mobile in a manner of movably
It is arranged at fixed part.So as to which by moving forward and backward move portion, the substrate 1 for making to be supported on substrate supporting body 11 is relative to mask 8
Carry out contact separation movement.
Substrate supporting body 11 possesses support services 2 and pressing apparatus 3, the lower surface periphery of the support services 2 and substrate 1
Portion contacts and substrate 1 is supported, and the pressing apparatus 3 configures in opposite directions with the support services 2, i.e. is arranged on the upper of substrate 1
Face side simultaneously presses substrate 1 to clamp substrate 1 to support services 2.
In addition, substrate supporting body 11 be in the sagging section view for being provided with sleeve portion in the left and right of main part substantiallyBodies, and with
From the mode of the front end inwardly projecting in sleeve portion, support services 2 are set.Moreover, by with the support services 2 distinguish it is opposite in a manner of
Base portion 12 is set, and the base portion 12 is provided with the axle portion 13 of the pressing apparatus 3 of prominent retraction freely.
Apparatus 3 is pressed by being protruded from base portion 12 and pressing substrate 1 to clamp substrate 1 to support services 2.Pass through the branch
Apparatus 2 and pressing apparatus 3 are held, can suitably switch to, which will press apparatus 3, presses on the clamp position of substrate 1 and make pressing apparatus
3 release conditions retreated from substrate 1 without clamping substrate 1.
Support services 2 and pressing apparatus 3 set multiple in a manner of a plurality of edge with substrate 1 abuts.In the present embodiment
In, support services 2 and pressing apparatus 3 are set a pair in a manner of being abutted with a pair of substrate 1 opposite edge.
In addition, in the present embodiment, relative to 1 edge, the side substantially integrally abutted with the long side direction with the edge
Formula respectively constitutes the pair of support services 2 and pressing apparatus 3.It should be noted that relative to 1 edge, can also set
Multiple support services 2 and pressing apparatus 3 and support and clamp 1 edge with multiple points.Alternatively, it is also possible to be formed as to substrate
1 corner carries out the structure of multiple location clamping.
The flat forward surface of opposite and for rectangular shape the required area with the end of substrate 1 is provided with pressing apparatus 3.
On the forward surface, the press section 4 protruded towards the side of substrate 1 is provided projectingly more than 3 with the state of its top 4a separation.Specifically
For, relative to the top 4a of any one press section 4, the top 4a of other more than 2 press sections 4 with it is described in opposite directions
The state separated in a different direction on the parallel in-plane in face is set.
Press section 4 is configured to the more tapering overshooting shape in more forward end.It is for instance possible to use by circular cone or the overhead of pyramid
Level cut away after shape.In the present embodiment, the shape after the overhead level of rectangular pyramid is cut away is formed as.
As illustrated in Fig. 2,3, the forward surface opposite with substrate 1 of the pressing apparatus 3 of the present embodiment has along clamping base
The long leg and the short leg shorter than the long leg that the edge of plate 1 is set, respectively along the row of edge 5 of the long leg and short leg
Show multiple press sections 4.
That is, the edge 5 of with substrate 1 opposite forward surface of the press section 4 of the present embodiment with pressing apparatus 3 is abreast arranged side by side
Set multiple, and multiple row (two row) is abreast set with the edge of clamped substrate 1.So as to which, multiple press sections 4 are along clamping
There is multiple row in the edge of substrate 1, Just because of this, therefore can clamp substrate 1 well.
It should be noted that the arrangement of press section 4 is not limited to above-mentioned arrangement, can according to desired chucking power with
And non-stick nature and suitably set.Such as annular shape can be arranged in, and four angles of the forward surface can be provided only on, can be with
Zigzag is arranged in, can be rounded projections arranged as being separately positioned on vertex of a triangle or be separately positioned on
Using the upper bottom of substrate center side as long side and to go to the bottom as echelon formation as the trapezoidal summit of short side.
In addition, the top 4a of press section 4 be arranged on from pressing apparatus 3 the forward surface opposite with substrate 1 edge 5 it is inside
At square retracted position.Specifically, the link bottom of press section 4 and top 4a side surface part 4b are set to inclined plane.
In the present embodiment, side surface part 4b is set to more by the top 4a sides then more tapering conical surface.So as to, in the present embodiment, with by
The bottom of splenium 4 is set up in parallel multiple press sections 4 with the mode that the bottom of adjacent press section 4 abuts with high density state, still
The top 4a contacted with substrate 1 configured separates in the in-plane direction.
In addition, corner between the top 4a and side surface part 4b of press section 4 is the substrate 1 that obtuse angle clamps even if shake
It is difficult to form corner angle, the breakage of substrate 1 can be prevented as much as possible., can also will be by it should be noted that as illustrated in figure 4
Corner 4c between the top 4a and side surface part 4b of splenium 4 is formed as rounded shapes.In this case, substrate 1 is more difficult to breakage.
In addition, the press section 4 of pressing apparatus 3 is made of the metal materials such as aluminium, and is implemented on surface and apply fluorine processing.Need
Apply fluorine processing it is noted that can also substitute and bead is implemented to surface, can also implement to apply at fluorine processing and shot-peening
Manage this both sides.
The invention is not limited in the present embodiment, the concrete structure of each constitutive requirements can be appropriately designed.
Claims (9)
1. a kind of substrate holding apparatus, the substrate holding apparatus have supporting substrates support services and with the support services phase
To configuring and pressing the pressing apparatus of the substrate, the substrate is clamped by the support services and the pressing apparatus,
Characterized in that,
On the forward surface opposite with substrate of the pressing apparatus, be provided with more than three that the substrate-side protrudes by
Splenium, also, the press section other more than two pressings with the top relative to press section any one described
The top in portion is set on the in-plane parallel from the forward surface to the state that different directions separates, and is pressed by above-mentioned
Splenium presses the substrate.
2. substrate holding apparatus according to claim 1, it is characterised in that
It is arranged at the top of the press section from the edge of the forward surface opposite with the substrate inwardly at square retracted position.
3. substrate holding apparatus according to claim 2, it is characterised in that
The link bottom of the press section and the side surface part at top are set to inclined plane.
4. substrate holding apparatus according to claim 3, it is characterised in that
The side surface part is set to more by the top side then more tapering conical surface.
5. substrate holding apparatus according to claim 1, it is characterised in that
The press section parallel to the forward surface opposite with the substrate edge be set up in parallel it is multiple.
6. substrate holding apparatus according to claim 5, it is characterised in that
The press section and the edge of the clamped substrate abreast set multiple row.
7. substrate holding apparatus according to claim 5, it is characterised in that
The press section is set up in parallel respectively along four edges of the forward surface of the rectangular shape opposite with the substrate.
8. a kind of film formation device, the film formation device carries out film forming on the substrate being arranged in vacuum tank, it is characterised in that
Provided with substrate holding apparatus according to any one of claims 1 to 7.
9. a kind of film build method, film forming is carried out on substrate, it is characterised in that including：
Clamp the clamping process of the substrate；And
Make the release process for turning into the release conditions not clamped by the substrate that the clamping process clamps,
The clamping process and the release process usage right require the substrate holding apparatus any one of 1~7 to enter
OK.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016131734A JP6309047B2 (en) | 2016-07-01 | 2016-07-01 | Substrate clamping apparatus, film forming apparatus and film forming method |
| JP2016-131734 | 2016-07-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107557746A true CN107557746A (en) | 2018-01-09 |
| CN107557746B CN107557746B (en) | 2020-11-10 |
Family
ID=60945316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710518668.9A Active CN107557746B (en) | 2016-07-01 | 2017-06-30 | Substrate clamping device, film forming device and film forming method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6309047B2 (en) |
| KR (1) | KR101960169B1 (en) |
| CN (1) | CN107557746B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112750743A (en) * | 2019-10-29 | 2021-05-04 | 佳能特机株式会社 | Substrate holding apparatus, film forming method, and method for manufacturing electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112853273B (en) * | 2020-12-31 | 2022-12-16 | 南京深光科技有限公司 | Flexible AMOLED mask plate surface coating equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282039U (en) * | 1988-12-13 | 1990-06-25 | ||
| JPH10102249A (en) * | 1996-09-27 | 1998-04-21 | Nissin Electric Co Ltd | Substrate holder |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4467367B2 (en) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method, and substrate processing method |
| JP4553124B2 (en) | 2004-12-16 | 2010-09-29 | 株式会社日立ハイテクノロジーズ | Vacuum deposition method and EL display panel |
| JP2006332460A (en) * | 2005-05-27 | 2006-12-07 | Hitachi High-Tech Control Systems Corp | Wafer transfer device |
| WO2010106958A1 (en) * | 2009-03-18 | 2010-09-23 | 株式会社アルバック | Positioning method and vapor deposition method |
| JP5479948B2 (en) * | 2010-03-02 | 2014-04-23 | 株式会社ディスコ | Transport mechanism |
| JP2011233510A (en) * | 2010-04-05 | 2011-11-17 | Canon Inc | Deposition device |
| US9076834B2 (en) * | 2012-09-28 | 2015-07-07 | United Microelectronics Corp. | Spacer for thermal plate in semiconductor processing |
-
2016
- 2016-07-01 JP JP2016131734A patent/JP6309047B2/en active Active
-
2017
- 2017-06-15 KR KR1020170075909A patent/KR101960169B1/en active IP Right Grant
- 2017-06-30 CN CN201710518668.9A patent/CN107557746B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282039U (en) * | 1988-12-13 | 1990-06-25 | ||
| JPH10102249A (en) * | 1996-09-27 | 1998-04-21 | Nissin Electric Co Ltd | Substrate holder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112750743A (en) * | 2019-10-29 | 2021-05-04 | 佳能特机株式会社 | Substrate holding apparatus, film forming method, and method for manufacturing electronic device |
| CN112750743B (en) * | 2019-10-29 | 2023-07-21 | 佳能特机株式会社 | Substrate holding device, film forming method, and method for manufacturing electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101960169B1 (en) | 2019-03-19 |
| JP2018003094A (en) | 2018-01-11 |
| CN107557746B (en) | 2020-11-10 |
| JP6309047B2 (en) | 2018-04-11 |
| KR20180003993A (en) | 2018-01-10 |
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