CN107557746B - Substrate clamping device, film forming device and film forming method - Google Patents
Substrate clamping device, film forming device and film forming method Download PDFInfo
- Publication number
- CN107557746B CN107557746B CN201710518668.9A CN201710518668A CN107557746B CN 107557746 B CN107557746 B CN 107557746B CN 201710518668 A CN201710518668 A CN 201710518668A CN 107557746 B CN107557746 B CN 107557746B
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- substrate
- pressing
- tool
- portions
- film forming
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a substrate clamping device which can make a substrate not adhered to a pressing tool and transfer from a clamping state to a releasing state. The substrate clamping device comprises a supporting tool (2) for supporting a substrate (1) and a pressing tool (3) which is arranged opposite to the supporting tool (2) and presses the substrate (1), wherein the substrate (1) is clamped by the supporting tool (2) and the pressing tool (3), wherein three or more pressing parts (4) protruding towards the substrate (1) are arranged on the opposite surface of the pressing tool (3) opposite to the substrate (1), the pressing parts (4) are arranged in a state that the tops (4a) of the other two or more pressing parts (4) are separated from the top (4a) of any one pressing part (4) in the plane direction parallel to the opposite surface in different directions, and the substrate (1) is pressed by the pressing parts (4).
Description
Technical Field
The invention relates to a substrate clamping device, a film forming device and a film forming method.
Background
In a substrate clamping mechanism in which a clamping member is pressed against a substrate to clamp an outer peripheral portion of the substrate, such as disclosed in patent document 1, for example, when the clamping member is separated from the substrate in a state in which the substrate is clamped and is in a released state in which the substrate is not clamped, peeling electrification may occur at a contact surface of the clamping member pressed against the substrate, causing the substrate to adhere to the clamping member to be separated.
In this case, the substrate may be dropped or damaged, and therefore, a structure in which peeling electrification is not generated is desired.
[ Prior Art document ]
[ patent document ]
[ patent document 1 ] Japanese patent application laid-open No. 2006-172930
Disclosure of Invention
[ problem to be solved by the invention ]
The present invention has been made in view of the above-described situation, and an object thereof is to provide a substrate clamping device, a film forming apparatus, and a film forming method capable of shifting a clamped state to a released state without adhering a substrate to a pressing tool.
[ MEANS FOR solving PROBLEMS ] A method for solving the problems
A substrate holding device is provided, which comprises a base plate,
the substrate clamping device includes a supporting tool for supporting a first surface of a substrate and a pressing tool for pressing the substrate against the supporting tool by abutting against a second surface opposite to the first surface of the substrate, wherein the pressing tool includes a facing surface separated from the second surface and a plurality of pressing portions protruding from the facing surface and abutting against the second surface, the plurality of pressing portions are arranged such that all the pressing portions are not arranged on a straight line in a plane parallel to the second surface, and each of the plurality of pressing portions is configured to connect the facing surface and a top portion abutting against the second surface by a plurality of planes.
[ Effect of the invention ]
The present invention is configured as described above, and thus provides a substrate clamping device, a film forming apparatus, and a film forming method that can shift a clamped state to a released state without adhering a substrate to a pressing tool.
Drawings
Fig. 1 is a schematic explanatory cross-sectional view of the present embodiment.
Fig. 2 is an enlarged schematic explanatory perspective view of the pressing tool of the present embodiment.
Fig. 3 is a schematic explanatory cross-sectional view of the pressing tool of the present embodiment.
Fig. 4 is a schematic explanatory cross-sectional view of the pressing portion of the present embodiment.
[ notation ] to show
1 substrate
2 supporting tool
3 pressing tool
4 pressing part
4a top
4b side part
5 edge part
7 vacuum tank
Detailed Description
The operation of the present invention is shown based on the drawings, so that the embodiment of the present invention considered to be preferred is simply explained.
When the substrate 1 supported by the supporting tool 2 is pressed by the pressing tool 3 to clamp the substrate 1, the pressing part 4 of the pressing tool 3 presses the substrate 1. Since the pressing portions 4 are provided in a state where the top portions 4a thereof are separated from each other by 3 or more on the facing surfaces of the pressing tools 3 facing the substrate 1, the force applied to the substrate 1 by the pressing tools 3 does not become a local force, and the substrate can be prevented from being damaged. That is, since the top portions 4a of the 3 pressing portions 4 are separated in the planar direction and the top portions 4a of the other 2 or more pressing portions 4 are separated in different directions from the top portion 4a of any one pressing portion 4, the top portions 4a of the 3 or more pressing portions 4 are not arranged only on one straight line, and can press a predetermined range of the substrate 1 in a multi-point dispersed manner.
Further, when the pressing tool 3 is separated from the clamped state and released from the pressing state, the pressing portion 4 of the opposite surface of the pressing tool 3 facing the substrate 1 presses the substrate 1, and therefore, the contact area between the substrate 1 and the pressing tool 3 can be reduced as compared with a case where the opposite surface of the pressing tool 3 facing the substrate 1 without the pressing portion 4 is pressed against the substrate 1. Therefore, when the pressing tool 3 is separated from the substrate 1, the pressing tool can be easily separated from the substrate 1, and the electrification of the contact surface can be reduced, thereby preventing the substrate 1 from sticking when the pressing tool 3 is separated.
[ examples ] A method for producing a compound
Specific embodiments of the present invention will be described based on the drawings.
As shown in fig. 1, the present embodiment is an example in which the present invention is applied to a film deposition apparatus in which a substrate 1 and a mask 8 are arranged in a vacuum chamber 7 and a film is deposited by using a film deposition mechanism formed by an evaporation source 9 or the like. The film forming apparatus is provided with a film thickness monitor that monitors the evaporation rate of the evaporation particles emitted from the evaporation source 9, a film thickness meter that is provided outside the vacuum chamber 7 and converts the monitored amount of the evaporation particles into a film thickness, a power supply for a heater that heats the evaporation source 9 in order to control the evaporation rate of the film forming material so that the converted film thickness becomes a desired film thickness, and the like. The film forming apparatus is used for manufacturing a display panel for an organic electroluminescent display device, for example.
Specifically, the mask 8 is disposed in the vacuum chamber 7 in a state of being supported by the mask support 10, and the moving mechanism 6 for changing the relative distance between the mask 8 and the substrate 1 is provided.
The fixed portion of the moving mechanism 6 is attached to the wall surface of the vacuum chamber 7, and a substrate support 11 is provided at the tip of the moving portion of the moving mechanism 6, and the moving portion is provided at the fixed portion so as to be movable in contact with and away from the wall surface of the vacuum chamber 7. Accordingly, the substrate 1 supported by the substrate support 11 is moved into contact with and away from the mask 8 by moving the moving portion forward and backward.
The substrate support 11 includes a support tool 2 for supporting the substrate 1 by contacting an outer peripheral portion of a lower surface of the substrate 1, and a pressing tool 3 disposed opposite to the support tool 2, that is, disposed on an upper surface side of the substrate 1, for pressing the substrate 1 against the support tool 2 to hold the substrate 1.
The substrate support body 11 is formed by hanging sleeves on the right and left sides of the main body in a cross-sectional view
A shape body, and a supporting tool 2 is provided so as to protrude inward from the front end of the sleeve. A base 12 is provided so as to face the supporting tool 2, and a shaft 13 of the pressing tool 3 is provided so as to protrude and retract from the base 12.
The pressing tool 3 is projected from the base 12 and presses the substrate 1 against the supporting tool 2 to hold the substrate 1. The supporting tool 2 and the pressing tool 3 can be switched between a holding state in which the pressing tool 3 is pressed against the substrate 1 and a release state in which the pressing tool 3 is retracted from the substrate 1 without holding the substrate 1.
The supporting tool 2 and the pressing tool 3 are provided in plural so as to be in contact with the plural side portions of the substrate 1. In the present embodiment, a pair of the supporting tool 2 and the pressing tool 3 is provided so as to abut on a pair of opposing side portions of the substrate 1.
In the present embodiment, the pair of supporting members 2 and the pressing member 3 are configured to be in contact with the entire side portion in the longitudinal direction of the side portion 1. It should be noted that a plurality of supporting tools 2 and pressing tools 3 may be provided for 1 side portion to support and hold the 1 side portion at a plurality of points. Further, the corner portion of the substrate 1 may be sandwiched at a plurality of positions.
The pressing tool 3 is provided with a flat facing surface of a predetermined area facing the end of the substrate 1 and having a rectangular shape. On the facing surface, 3 or more pressing portions 4 projecting toward the substrate 1 side are provided so as to project with their top portions 4a separated. Specifically, the top portions 4a of the other 2 or more pressing portions 4 are provided so as to be separated in different directions from the top portion 4a of one pressing portion 4 in the plane direction parallel to the facing surface.
The pressing portion 4 is formed in a projecting shape that tapers toward the tip. For example, a shape in which the vertex of a cone or a pyramid is horizontally cut off may be employed. In the present embodiment, the rectangular pyramid is formed in a shape in which the vertex is horizontally cut off.
As shown in fig. 2 and 3, the opposed surface of the pressing tool 3 of the present embodiment opposed to the substrate 1 has a long side portion provided along a side portion sandwiching the substrate 1 and a short side portion shorter than the long side portion, and a plurality of pressing portions 4 are arranged along edge portions 5 of the long side portion and the short side portion, respectively.
That is, in the present embodiment, a plurality of pressing portions 4 are provided in parallel with the edge portions 5 of the facing surfaces of the pressing tools 3 facing the substrate 1, and a plurality of rows (two rows) are provided in parallel with the side portions of the substrate 1 to be held. Accordingly, the plurality of pressing portions 4 are arranged in a plurality of rows along the side portion where the substrate 1 is held, and thus the substrate 1 can be held well.
The arrangement of the pressing portions 4 is not limited to the above arrangement, and may be set as appropriate according to a desired clamping force and adhesion prevention property. For example, the substrates may be arranged in a circular shape, may be arranged only at the four corners of the facing surface, may be arranged in a zigzag shape, may be arranged in a triangular shape such that the vertices of the triangle are arranged, or may be arranged in a trapezoidal shape such that the vertices of a trapezoid having an upper base on the center side of the substrate as a long side and a lower base as a short side are arranged.
The top 4a of the pressing portion 4 is set at a position receded inward from the edge 5 of the facing surface of the pressing tool 3 facing the substrate 1. Specifically, the side surface portion 4b of the pressing portion 4 connecting the bottom portion and the top portion 4a is formed as an inclined surface. In the present embodiment, the side surface portion 4b is formed into a tapered surface that tapers toward the top portion 4 a. Accordingly, in the present embodiment, although the plurality of pressing portions 4 are arranged in a dense state in parallel such that the bottom portions of the pressing portions 4 abut against the bottom portions of the adjacent pressing portions 4, the top portions 4a that are in contact with the substrate 1 are arranged apart in the planar direction.
Further, the substrate 1 held between the top portion 4a and the side surface portion 4b of the pressing portion 4 is at an obtuse angle, and is less likely to form an angular edge even if shaken, and damage to the substrate 1 can be prevented as much as possible. As shown in fig. 4, a corner 4c between the top portion 4a and the side surface portion 4b of the pressing portion 4 may be rounded. In this case, the substrate 1 is more difficult to break.
The pressing portion 4 of the pressing tool 3 is made of a metal material such as aluminum, and the surface thereof is fluorine-coated. Instead of the fluorine coating treatment, the surface may be subjected to a shot blasting treatment, or both of the fluorine coating treatment and the shot blasting treatment may be performed.
The present invention is not limited to the embodiment, and the specific structure of each constituent element may be appropriately designed.
Claims (7)
1. A substrate holding apparatus having a supporting tool for supporting a first surface of a substrate and a pressing tool for pressing the substrate against the supporting tool by abutting against a second surface of the substrate opposite to the first surface, the substrate being held by the supporting tool and the pressing tool,
the pressing tool has a facing surface separated from the second surface and a plurality of pressing portions protruding from the facing surface and abutting against the second surface, and the plurality of pressing portions are arranged such that all the pressing portions are not aligned in a plane parallel to the second surface, and each of the plurality of pressing portions has a structure in which the facing surface and a top portion abutting against the second surface are connected by a plurality of planes.
2. The substrate holding apparatus according to claim 1,
the area of the top of the pressing portion is smaller than the sectional area of the facing surface.
3. The substrate holding apparatus according to claim 1 or 2,
the plurality of pressing portions are arranged in parallel to the edge of the facing surface.
4. The substrate holding apparatus according to claim 1 or 2,
the pressing portions are arranged in a plurality of rows in parallel with the edge portion of the substrate to be clamped.
5. The substrate holding apparatus according to claim 3,
the pressing portions are respectively arranged in parallel along four edge portions of the rectangular facing surfaces.
6. A film forming apparatus for forming a film on a substrate placed in a vacuum chamber,
a substrate holding apparatus according to any one of claims 1 to 5.
7. A film forming method for forming a film on a substrate, comprising:
a clamping step of clamping the substrate; and
a releasing step of releasing the substrate clamped by the clamping step in an unclamped state,
the clamping step and the releasing step are performed by using the substrate clamping device according to any one of claims 1 to 5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-131734 | 2016-07-01 | ||
| JP2016131734A JP6309047B2 (en) | 2016-07-01 | 2016-07-01 | Substrate clamping apparatus, film forming apparatus and film forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107557746A CN107557746A (en) | 2018-01-09 |
| CN107557746B true CN107557746B (en) | 2020-11-10 |
Family
ID=60945316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710518668.9A Active CN107557746B (en) | 2016-07-01 | 2017-06-30 | Substrate clamping device, film forming device and film forming method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6309047B2 (en) |
| KR (1) | KR101960169B1 (en) |
| CN (1) | CN107557746B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7057335B2 (en) * | 2019-10-29 | 2022-04-19 | キヤノントッキ株式会社 | Substrate holding device, substrate processing device, substrate holding method, film forming method, and manufacturing method of electronic device |
| CN112853273B (en) * | 2020-12-31 | 2022-12-16 | 南京深光科技有限公司 | Flexible AMOLED mask plate surface coating equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282039U (en) * | 1988-12-13 | 1990-06-25 | ||
| JPH10102249A (en) * | 1996-09-27 | 1998-04-21 | Nissin Electric Co Ltd | Substrate holder |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4467367B2 (en) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | Substrate reversing device, substrate transporting device, substrate processing device, substrate reversing method, substrate transporting method, and substrate processing method |
| JP4553124B2 (en) | 2004-12-16 | 2010-09-29 | 株式会社日立ハイテクノロジーズ | Vacuum deposition method and EL display panel |
| JP2006332460A (en) * | 2005-05-27 | 2006-12-07 | Hitachi High-Tech Control Systems Corp | Wafer transfer device |
| WO2010106958A1 (en) * | 2009-03-18 | 2010-09-23 | 株式会社アルバック | Positioning method and vapor deposition method |
| JP5479948B2 (en) * | 2010-03-02 | 2014-04-23 | 株式会社ディスコ | Transport mechanism |
| JP2011233510A (en) * | 2010-04-05 | 2011-11-17 | Canon Inc | Deposition device |
| US9076834B2 (en) * | 2012-09-28 | 2015-07-07 | United Microelectronics Corp. | Spacer for thermal plate in semiconductor processing |
-
2016
- 2016-07-01 JP JP2016131734A patent/JP6309047B2/en active Active
-
2017
- 2017-06-15 KR KR1020170075909A patent/KR101960169B1/en active IP Right Grant
- 2017-06-30 CN CN201710518668.9A patent/CN107557746B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282039U (en) * | 1988-12-13 | 1990-06-25 | ||
| JPH10102249A (en) * | 1996-09-27 | 1998-04-21 | Nissin Electric Co Ltd | Substrate holder |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101960169B1 (en) | 2019-03-19 |
| JP2018003094A (en) | 2018-01-11 |
| CN107557746A (en) | 2018-01-09 |
| JP6309047B2 (en) | 2018-04-11 |
| KR20180003993A (en) | 2018-01-10 |
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