KR101741080B1 - robot hand for debonding work transort apparatus - Google Patents

robot hand for debonding work transort apparatus Download PDF

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KR101741080B1
KR101741080B1 KR1020160122863A KR20160122863A KR101741080B1 KR 101741080 B1 KR101741080 B1 KR 101741080B1 KR 1020160122863 A KR1020160122863 A KR 1020160122863A KR 20160122863 A KR20160122863 A KR 20160122863A KR 101741080 B1 KR101741080 B1 KR 101741080B1
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debonding
work
plate
arm
holder
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KR1020160122863A
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Korean (ko)
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문형주
공영준
박성훈
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주식회사 다이나테크
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 메탈 캐리어의 일면에 접착된 양면 테이프 상에 몰딩된 웨이퍼로 구성되는 디본딩 워크들이 적재된 카세트에서 하나의 디본딩 워크의 메탈 캐리어를 클램핑하여 예열기구로 이송하고, 예열된 디본딩 워크의 몰딩 웨이퍼를 받치는 방식으로 진공 흡착하여 이송하는 디본딩 워크 이송 기구용 로봇 핸드에 관한 것이다. In the present invention, a metal carrier of one debonding workpiece is clamped and transferred to a preheater in a cassette on which a debonding work composed of a wafer molded on a double-sided tape adhered to one surface of a metal carrier is loaded, To a robot hand for a debonding workpiece transferring mechanism that vacuum-adsorbs and transfers a molding wafer in a supporting manner.

Description

디본딩 워크의 이송 기구용 로봇 핸드{robot hand for debonding work transort apparatus}{Robot hand for debonding work transort apparatus}

본 발명은 메탈 캐리어의 일면에 접착된 양면 테이프 상에 몰딩된 웨이퍼로 구성되는 디본딩 워크들이 적재된 카세트에서 하나의 디본딩 워크의 메탈 캐리어를 클램핑하여 예열기구로 이송하고, 예열된 디본딩 워크의 몰딩 웨이퍼를 받치는 방식으로 진공 흡착하여 이송하는 디본딩 워크 이송 기구용 로봇 핸드에 관한 것이다. In the present invention, a metal carrier of one debonding workpiece is clamped and transferred to a preheater in a cassette on which a debonding work composed of a wafer molded on a double-sided tape adhered to one surface of a metal carrier is loaded, To a robot hand for a debonding workpiece transferring mechanism that vacuum-adsorbs and transfers a molding wafer in a supporting manner.

디본딩 워크란 양면 테이프가 개재된 메탈 캐리어와 몰딩 웨이퍼로 구성된 소재로서 예열하여 메탈 캐리어를 양면테이프 상에서 디본딩될 소재임을 의미한다. The debonding work means a material composed of a metal carrier having a double-sided tape and a molding wafer, which means that the metal carrier is to be debonded on a double-sided tape.

디본딩 워크(1)는 도 1과 같이 메탈 캐리어(3)의 하면(3a)에 상면이 접착된 양면 테이프(5), 양면 테이프(5)의 하면에 치약 형태의 수지를 몰딩시켜 성형한 몰딩 웨이퍼(7)로 구성되어 있다. The debonding work 1 comprises a double-sided tape 5 having an upper surface adhered to a lower surface 3a of a metal carrier 3 as shown in Fig. 1, a molding formed by molding a tooth- And a wafer 7.

이처럼 메탈 캐리어(3), 양면 테이프(5) 및 몰딩 웨이퍼(7)가 상중하 위치로 정해져 있는 것은 추후 예열을 행한 디본딩 워크에서 상측 메탈 캐리어(3)가 분리되고, 그 다음 양면 테이프(5)가 분리되는 순서 때문이다(특허문헌 1 참조). The reason why the metal carrier 3, the double-faced tape 5 and the molding wafer 7 are determined to be in the up-down position is that the upper metal carrier 3 is separated in the debonding work where the preheating is performed, (See Patent Document 1).

또한, 메탈 캐리어(3)의 직경은 양면 테이프(5)의 직경 또는 몰딩 웨이퍼(7)의 직경보다 약간 더 큰 것이 바람직하다. It is also preferable that the diameter of the metal carrier 3 is slightly larger than the diameter of the double-sided tape 5 or the diameter of the molding wafer 7.

이러한 디본딩 워크(1)는 카세트에 수납되어 있고, 카세트에서 디본딩 워크(1)를 예열기구로 이송하기 위해, 도 2 및 도 3과 같은 종래의 로봇 핸드(10)가 이용된다. Such a debonding work 1 is housed in a cassette, and a conventional robot hand 10 as shown in Figs. 2 and 3 is used to transfer the debonding work 1 from the cassette to the preheater.

종래의 로봇 핸드(10)는 상하, 전후 등으로 이동하거나 뒤집거나 회전 가능하게 구성되어 있다. The conventional robot hand 10 is configured to be moved up and down, forward and backward, or turned upside down or rotatable.

로봇 핸드(10)는 평면이 U자 형상인 판형 암(11)과, 판형 암(11)의 일면에 설치되는 클림핑 홀더(20)로 구성되어 있다. The robot hand 10 is composed of a plate-like arm 11 having a U-shaped planar surface and a clamping holder 20 provided on one surface of the plate-like arm 11.

클램핑 홀더(20)는 로봇 핸드(10)의 선단에 설치된 복수의 고정 홀딩편(21)과, 후단측에 설치된 복수의 가동 홀딩편(23)으로 구성되어 있다. The clamping holder 20 is composed of a plurality of fixed holding pieces 21 provided at the front end of the robot hand 10 and a plurality of movable holding pieces 23 provided at the rear end side.

고정 홀딩편(21)에는 메탈 캐리어(3)의 선단측 외주 일부가 끼워지고, 가동 홀더편(23)에는 메탈 캐리어(3)의 후단측 외주 일부가 끼워져, 로봇 핸드(10)에 디본딩 워크(1)가 클램핑되어 진다. A part of the distal end side outer periphery of the metal carrier 3 is fitted to the fixed holding piece 21 and a part of the outer periphery of the rear end side of the metal carrier 3 is fitted into the movable holder piece 23, (1) is clamped.

또한, 고정 홀딩편(21)과 가동 홀딩편(23)은 디본딩 워크(1)를 끼워넣어 클램핑 할 때 정렬과 홀딩 모두의 역할을 하도록 로봇 핸드(10)에 배치되어 있다. The fixed holding piece 21 and the movable holding piece 23 are arranged in the robot hand 10 so as to serve as both alignment and holding when clamping the decoupling work 1 and clamping it.

이렇게 도 2과 같이 클램핑 된 디본딩 워크(1)는 예열 장치로 이송되어 온도에 따른 예열을 순차적으로 행하여 메탈 캐리어(3)와 양면 테이프(5) 간의 접착력을 약화시킨다. As shown in FIG. 2, the clamped debonding work 1 is transferred to the preheating device to sequentially perform preheating according to the temperature to weaken the adhesion force between the metal carrier 3 and the double-faced tape 5.

그런데, 예열된 디본딩 워크(1)를 도 2와 같은 방식으로 예열된 디본딩 워크(1)를 매다는 형태로 클램핑하여 이송할 경우, 테이프(5)와 몰딩 웨이퍼(7)가 떨어져 불량품이 될 수 있다. However, when the pre-heated debonding work 1 is clamped and transferred in a dangling form to the preheated debonding work 1 in the same manner as in FIG. 2, the tape 5 and the molding wafer 7 are separated from each other and become defective .

이러한 떨어져 불량품이 생기는 것을 방지하기 위하여, 도 3과 같이 로봇 핸드(10)를 아래로 위치시켜 예열된 디본딩 워크(1)를 받치는 형태로 클램핑하여 이송할 경우에는 몰딩 웨이퍼(7)에 스크래치 등이 생겨 불량품이 될 수 있다. In order to prevent such defective products from being generated, when the robot hand 10 is placed downward and clamped and supported in the form of supporting the pre-heated debonding work 1 as shown in Fig. 3, a scratch or the like And may be defective.

즉, 예열된 디본딩 워크(1)를 클램핑 하기 위해서는 가동 홀딩편(23)을 선단측으로 슬라이딩시켜야 하는데, 이때 예열된 디본딩 워크(1)도 같이 슬라이딩하면서 몰딩 웨이퍼(7)가 로봇 핸드(10)의 일면에 대해 슬라이딩하면서 스크래치가 생길 수 있다. That is, in order to clamp the pre-heated deflection work 1, the movable holding piece 23 must be slid toward the front end side. At this time, the pre-heated debonding work 1 slides along with the molding wafer 7, And thus scratches can be generated.

로봇 핸드(10)의 후단측에는 가동 홀딩편(23)을 슬라이딩시키기 위한 공압 등의 액추에이터(30)가 설치되어 있다. An actuator 30 such as a pneumatic pressure for sliding the movable holding piece 23 is provided at the rear end side of the robot hand 10.

참고로 예열 장치는 상하부 예열 테이블로서, 하부 예열 테이블에 도 1의 디본딩 워크(1)를 놓고 상부 예열 테이블을 하강시킨 후 가열하는 장치이다.For reference, the preheating device is an upper and lower preheating table, in which the debonding work 1 of FIG. 1 is placed on the lower preheating table and the upper preheating table is lowered and heated.

예열이 끝나면 상부 예열 테이블은 상승하고, 하부 예열 테이블에서 올라온 지지핀에 의해 예열된 디본딩 워크(1)를 위로 상승시키면, 로봇 핸드(10)가 도 2 또는 도 3과 같은 자세에서 클램핑 홀딩하게 된다. When the preheating is finished, the upper preheating table is raised, and when the debonding work 1 preheated by the support pins raised from the lower preheating table is lifted up, the robot hand 10 is clamped and held in the posture as shown in FIG. 2 or 3 do.

특허문헌 1 : 한국공개특허 제10-2016-0018401호Patent Document 1: Korean Patent Publication No. 10-2016-0018401 특허문헌 2 : 한국등록특허 제10-1605298호Patent Document 2: Korean Patent No. 10-1605298

본 발명은 전술한 문제를 해결하기 위하여 안출된 것으로, 디본딩 워크의 이송 경로에 따라 클램핑 홀딩 또는 진공흡착 홀딩을 1개의 부품으로 행하게 구현되어 예열하는 공정 내에서 이송할 때 몰딩 웨이퍼가 떨어지거나 스크래치가 생기지 않게 홀딩하여 양품 효율을 매우 높인 디본딩 워크의 이송 기구용 로봇 핸드를 제공함에 그 목적이 있다. SUMMARY OF THE INVENTION The present invention has been conceived to solve the above-mentioned problems, and it is an object of the present invention to provide a method and a device for carrying out a clamping holding or a vacuum suction holding according to a conveying path of a debinding work, And a robot hand for a transfer mechanism of a debonding work which is capable of holding a robot arm without holding the robot arm so as to improve the efficiency of the robot arm.

전술한 목적을 달성하기 위하여, 본 발명의 청구항 1에 기재된 디본딩 워크의 이송 기구용 로봇 핸드는, 메탈 캐리어, 상기 메탈 캐리어의 하면에 접착된 양면 테이프, 상기 양면 테이프의 하면에 몰딩된 몰딩 웨이퍼가 상중하로 적층된 디본딩 워크를 이송하는 로봇 핸드로서, 판형 암과, 상기 판형 암의 일면에 설치되는 클램핑 홀더와, 상기 판형 암의 타면에 설치되는 진공 흡착식 홀더를 포함하여, 상기 클램핑 홀더는 예열되기 전의 상기 디본딩 워크의 상기 메탈 캐리어를 클램핑하여 매다는 방식으로 이송하고, 상기 진공 흡착식 홀더는 예열된 상기 디본딩 워크의 상기 몰딩 웨이퍼의 하면을 흡착하여 받치는 방식으로 이송한다. In order to achieve the above object, a robot hand for a transfer mechanism of a deflection work according to claim 1 of the present invention comprises: a metal carrier; a double-sided tape adhered to a lower surface of the metal carrier; A clamping holder provided on one surface of the plate-like arm; and a vacuum adsorption holder provided on the other surface of the plate-like arm, wherein the clamping holder comprises: The metal carrier of the debonding work before being preheated is clamped and transferred in a dangling manner, and the vacuum adsorption holder transfers the preheated lower surface of the molding wafer in a manner to support the lower surface of the molding wafer.

본 발명의 청구항 2에 기재된 디본딩 워크의 이송 기구용 로봇 핸드에 있어서, 상기 판형 암은 좌우에 배치되는 제1판형 암과 제2판형 암, 상기 제1,2판형 암의 후측을 연결하는 제3판형 암으로 구성되고, 상기 진공 흡착식 홀더는 상기 제1,2,3판형 암에 설치되는 제1,2,3진공 흡착판과, 상기 제3흡착판의 후측의 상기 제3판형 암에 배치되는 흡착 출구홀과, 상기 제1,2,3진공 흡착판과 상기 흡착 출구홀을 연결하는 유로를 포함한다. In the robotic hand for a conveying mechanism of a defeeding work according to claim 2 of the present invention, the plate-like arm includes a first plate arm and a second plate-like arm arranged on the left and right, Wherein the vacuum adsorption holder comprises a first, a second and a third vacuum adsorption plate provided on the first, second and third plate type arms, and a second adsorption type adsorption plate disposed on the third plate type arm on the rear side of the third adsorption plate, And a flow path connecting the first, second, and third vacuum adsorption plates to the adsorption exit holes.

본 발명에 의하면 다음과 같은 효과가 있다. The present invention has the following effects.

로봇 핸드의 일면과 타면에 클램핑 홀더와 진공 흡착식 홀더가 설치됨으로써, 카세트에 적재된 디본딩 워크를 이송할 땐 클램핑 홀더로 메탈 캐리어를 클램핑하여 매달아 하고, 예열한 디본딩 워크를 이송할 땐 진공 흡착식 홀더로 몰딩 웨이퍼를 흡착하여 받쳐서 하기 때문에, 예열된 몰딩 웨이퍼가 이송 중에 떨어지거나 슬라이딩에 따른 스크래치가 생기지 않아 불량률을 현저히 낮출 수 있다. The clamping holder and the vacuum suction holder are installed on one surface and the other surface of the robot hand so that the metal carrier is clamped and hung by the clamping holder when the debonding work loaded on the cassette is transported and when vacuum pre- Since the molding wafer is attracted and held by the holder, the preheated molding wafer does not fall during transportation or scratches due to sliding, and the defective rate can be remarkably lowered.

도 1은 디본딩 워크를 도시한 측면도.
도 2는 종래 로봇 핸드가 도 1의 디본딩 워크의 위쪽에서 클램핑한 측면도로서, 몰딩 웨이퍼의 떨어지는 상태를 설명하기 위한 측면도.
도 3은 종래 로봇 핸드가 도 1의 디본딩 워크의 아래쪽에서 클램핑한 측면도로서, 몰딩 웨이퍼의 스크래치 상태를 설명하기 위한 측면도.
도 4는 본 발명의 바람직한 실시예에 따른 로봇 핸드를 도시한 측면도로서, 예열된 디본딩 워크의 이송을 설명하기 위한 측면도.
도 5는 도 4의 로봇 핸드를 도시한 평면도. 1 is a side view showing a debonding work.
Fig. 2 is a side view of a conventional robot hand clamped at the upper side of the debonding work of Fig. 1, and is a side view for explaining a falling state of a molding wafer. Fig.
Fig. 3 is a side view of a conventional robot hand clamped at the lower side of the debonding work of Fig. 1, and is a side view for explaining a scratch state of a molding wafer. Fig.
4 is a side view showing a robot hand according to a preferred embodiment of the present invention, and is a side view for explaining the transfer of the pre-heated debonding work.
5 is a plan view showing the robot hand of FIG. 4;

이하 본 발명의 바람직한 실시예를 첨부한 도면에 따라 설명하는데, 종래와 동일한 부분에 대해서는 동일한 참조부호를 부여하고 상세한 설명은 생략한다. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, wherein like parts are denoted by like reference numerals and detailed description thereof will be omitted.

도 4는 본 발명의 바람직한 실시예에 따른 로봇 핸드를 도시한 측면도로서, 예열된 디본딩 워크의 이송을 설명하기 위한 측면도이고, 도 5는 도 4의 로봇 핸드를 도시한 평면도이다. FIG. 4 is a side view illustrating a robot hand according to a preferred embodiment of the present invention, and is a side view for explaining the transfer of the pre-heated debonding work, and FIG. 5 is a plan view of the robot hand of FIG.

도 1 및 도 2에 도시한 바와 같이, 본 실시예에 따른 로봇 핸드(100)는 판형 암(110)과, 판형 암(110)의 일면에 설치되는 클램핑 홀더(20)와, 판형 암(110)의 타면에 설치되는 진공 흡착식 홀더(120)를 포함한다. 1 and 2, the robot hand 100 according to the present embodiment includes a plate type arm 110, a clamping holder 20 provided on one surface of the plate type arm 110, a plate type arm 110 And a vacuum adsorption holder 120 provided on the other surface of the vacuum adsorption holder 120.

로봇 핸드(100)는 종래와 마찬가지로 상하, 전후 등으로 이동하거나 뒤집거나 회전 가능하게 구성되어 있다. The robot hand 100 is structured such that it can be moved up and down, forward and backward, and reversed or rotatable as in the conventional art.

판형 암(110)은 도 5와 같이 평면에서 볼 때 U자 형상으로서, 제1판형 암(111)과 제2판형 암(113), 제1판형 암(111)과 제2판형 암(113)의 후측을 연결하는 제3판형 암(115)을 포함한다. 5, the plate-like arm 110 is U-shaped when viewed from the top, and includes a first plate-like arm 111 and a second plate-like arm 113, a first plate-like arm 111 and a second plate- And a third plate arm 115 connecting the rear side of the second plate arm 115.

클램핑 홀더(20)는 종래와 마찬가지로 로봇 핸드(100)의 선단에 설치된 복수의 고정 홀딩편(21)과, 후단측에 설치된 복수의 가동 홀딩편(23)으로 구성되어 있다. The clamping holder 20 is composed of a plurality of fixed holding pieces 21 provided at the front end of the robot hand 100 and a plurality of movable holding pieces 23 provided at the rear end side as in the prior art.

즉, 고정 홀딩편(21)은 제1,2판형 암(111)(113)의 선단에 설치되고, 가동 홀딩편(23)은 제3판형 암(115)의 후측에 설치되어 있다. That is, the fixed holding piece 21 is provided at the front end of the first and second plate arms 111 and 113, and the movable holding piece 23 is provided at the rear side of the third plate arm 115.

따라서, 고정 홀딩편(21)에는 메탈 캐리어(3)의 선단측 외주 일부가 끼워지고, 가동 홀더편(23)에는 메탈 캐리어(3)의 후단측 외주 일부가 끼워져, 로봇 핸드(100)에 디본딩 워크(1)가 클램핑되어 진다(도 2 참조). The movable holder piece 23 is fitted with a part of the outer periphery of the rear end side of the metal carrier 3 so as to be engaged with the movable holder piece 23, The bonding work 1 is clamped (see Fig. 2).

또한, 고정 홀딩편(21)과 가동 홀딩편(23)은 디본딩 워크(1)를 끼워넣어 클램핑 할 때 정렬과 홀딩 모두의 역할을 하도록 로봇 핸드(100)에 배치되어 있다. The fixed holding piece 21 and the movable holding piece 23 are arranged in the robot hand 100 so as to serve as both alignment and holding when clamping the decoupling work 1 and clamping it.

이렇게 도 2과 같이 클램핑 된 디본딩 워크(1)는 예열 장치로 이송되어 온도에 따른 예열을 순차적으로 행하여 메탈 캐리어(3)와 양면 테이프(5) 간의 접착력을 약화시키게 된다. As shown in FIG. 2, the clamped debonding work 1 is transferred to the preheating device, and preheating is sequentially performed according to the temperature to weaken the adhesion force between the metal carrier 3 and the double-faced tape 5.

진공 흡착식 홀더(120)는 도 5에 도시한 바와 같이 제1,2,3판형 암(111,113,115)에 설치되는 제1,2,3진공 흡착판(121,123,125)과, 제3흡착판(125)의 후측의 제3판형 암(115)에 배치되는 흡착 출구홀(127)과, 제1,2,3진공 흡착판(111,113,115)과 흡착 출구홀(127)을 연결하는 유로(130)를 포함한다. 5, the vacuum adsorption holder 120 includes first, second and third vacuum adsorption plates 121, 123 and 125 provided on the first, second and third plate arms 111, 113 and 115, And a flow path 130 connecting the first, second and third vacuum adsorption plates 111, 113 and 115 and the adsorption outlet hole 127. The adsorption outlet hole 127 is formed in the third plate-

제1,2,3진공 흡착판(121,123,125)은 제1,2,3흡착 입구홀(121a,123a,125a)을 통해 유로(127)와 연결되어 있다. The first, second and third vacuum adsorption plates 121, 123 and 125 are connected to the flow passage 127 through the first, second and third adsorption inlet holes 121a, 123a and 125a.

흡착 출구홀(127)에는 석션을 위한 석션기구가 형성되는데, 액추에이터(300)는 진공펌프로 석션하는 기구와 가동 홀딩편(25)을 슬라이딩 시키는 기구이다. The suction outlet hole 127 is formed with a suction mechanism for suction. The actuator 300 is a mechanism for suctioning the vacuum pump and sliding the movable holding piece 25.

유로(130)는 제1,2,3흡착 입구홀(121a,123a,125a)에서 분기되어 합지(P)되는 제1,2,3유로(131,133,135)와, 제1,2,3유로(131,133,135)의 합지(P)에서 흡착 출구홀(127)에 연결되는 제4유로(137)를 포함한다. The flow path 130 includes first, second and third flow paths 131, 133 and 135 branched from the first, second and third adsorption inlet holes 121a, 123a and 125a and connected to the first and second flow paths 131, And a fourth flow path 137 connected to the adsorption outlet hole 127 at the papermaking end (P)

제1유로(131)는 제1흡착 입구홀(121a)에서 제1판형 암(121)을 따르는 제1a유로(131a)와, 제1a유로(131a)에서 직각으로 제3판형 암(125)을 따르는 제1b유로(131b)와, 제1b유로(131a)에서 합지점(p)까지 따르는 제1c유로(131c)를 포함한다. The first flow path 131 includes an a first flow path 131a along the first plate type arm 121 in the first adsorption inlet hole 121a and a third plate type air flow path 131b perpendicular to the first flow path 131a. And a first c flow path 131c extending from the first b flow path 131a to the junction point p.

제2유로(133)는 제2흡착 입구홀(123a)에서 제2판형 암(123)을 따르는 제2a유로(133a)와, 제2a유로(133a)에서 직각으로 제3판형 암(125)을 따라 합지점(p)에 이르는 제2b유로(133b)를 포함한다. The second flow path 133 is provided with a second flow path 133a along the second plate type arm 123 in the second adsorption inlet hole 123a and a second plate type flow path 133b perpendicularly intersecting the second flow path 133a. And a second b flow path 133b leading to the junction point p.

제3유로(135)는 제3흡착 입구홀(125a)에서 합지점(P)에 이르는 유로이다.And the third flow path 135 is a flow path from the third adsorption inlet hole 125a to the junction point P. [

제1,2진공 흡착판(121,123)은 제1,2판형 암(111,113)의 선측에 배치되고, 제3진공 흡착판(125)은 제2판형 암(115)에 배치되어 있어, 평면에서 볼 때 삼각형으로 배열되어 있다. The first and second vacuum attracting plates 121 and 123 are disposed on the side of the first and second plate arms 111 and 113 and the third vacuum attracting plate 125 is disposed on the second plate arm 115, Respectively.

이와 같이, 본 실시예의 로봇 핸드(100)는 상하면에 클램핑 홀더(20)와 진공 흡착식 홀더(120)가 설치됨으로써, 디본딩 워크(1)의 이송 용도에 따라 겸용으로 사용 가능하여, 특히 예열된 디본딩 워크(1)의 이송 시 도 4와 같이 몰딩 웨이퍼(7)를 받치는 형태로 진공 흡착해서 이송하기 때문에 아래로 떨어질 염려가 전혀 없고 흡착이기 때문에 몰딩 웨이퍼(7)에 스크래치가 생길 우려도 전혀 없앨 수 있다. As described above, the robot hand 100 according to the present embodiment can be used for both the clamping holder 20 and the vacuum suction holder 120 according to the use of the debindling work 1, Since the vacuum bonding is carried out in the form of supporting the molding wafer 7 as shown in Fig. 4 during transfer of the debindaining work 1, there is no fear of falling down, and there is no fear that scratches will be generated on the molding wafer 7 It can be eliminated.

물론, 도 1과 같은 디본딩 워크(1)의 메탈 캐리어(3)를 진공 흡착하여 매다는 방식으로 이송하게 되면 로봇 핸드(100)에서 클램핑 홀더(20)는 없애고 진공 흡착식 홀더(120)만 두어도 되겠지만, 통상 디본딩 워크(1)의 무게가 1.5kg 이상 무거워 카세트에서 꺼내 예열 테이블로 이송할 때 디본딩 워크(1)가 소형 흡착력만으로는 로봇 핸드(100)에서 떨어질 우려가 크다. Of course, if the metal carrier 3 of the debonding work 1 as shown in FIG. 1 is vacuum-adsorbed and transferred in a dangling manner, the clamping holder 20 may be eliminated from the robot hand 100 and only the vacuum adsorption holder 120 may be provided , The weight of the normal debonding work (1) is more than 1.5 kg, and it is highly likely that the debindling work (1) will fall off from the robot hand (100) only by the small attraction force when it is taken out from the cassette and transferred to the preheat table.

이러한 우려를 해소하기 위해 진공 흡착력의 대용량에 따른 로봇 핸드의 부피가 커져 전체적인 디본딩 장치도 커져 점유공간을 많이 차지할 수 있는 문제가 생길 수 있어서, 본 실시예에서는 판형 암(110)의 상하 양면(일면/타면)에 진공 흡착식 홀더(120)와 클램핑 홀더(20)를 두어, 예열되지 않은 무거운 디본딩 워크를 이송할 때와 예열된 무거운 디본딩 워크를 이송할 때를 구별해서 적용하여 위의 문제를 해결하게 되었다. In order to solve such a problem, the volume of the robot hand is increased according to the large capacity of the vacuum attraction force, so that the entire debonding device becomes large, which may lead to a problem of occupying a large occupied space. In this embodiment, A vacuum adsorption holder 120 and a clamping holder 20 are provided on one side or the other side to apply a distinction between the case of transferring a heavy pre-heated debonding work and the case of carrying a preheated heavy debonding work, .

전술한 바와 같이, 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 하기의 특허청구범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 변경 또는 변형하여 실시할 수 있음은 해당기술분야의 당업자라면 자명하다 할 것이다. While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be apparent to those skilled in the art.

1 : 디본딩 워크 3 : 메탈 캐리어
5 : 양면 테이프 7 : 몰딩 웨이퍼
20 : 클램핑 홀더 21 : 고정 홀딩편
23 : 가동 홀딩편 100 : 로봇 핸드
110 : 클램핑 홀더 111,113,115 : 제1,2,3판형 암
120 : 진공 흡착식 홀더
121,123,125 : 제1,2,3진공 흡착판
121a,123a,125a : 제1,2,3흡착 입구홀
127 : 흡착 출구홀 130 : 유로
131,133,135,137 : 제1~4유로1: De-bonding work 3: Metal carrier
5: double-sided tape 7: molding wafer
20: Clamping holder 21: Fixed holding piece
23: movable holding piece 100: robot hand
110: clamping holders 111, 113, 115: first, second and third plate arms
120: Vacuum suction holder
121, 123, 125: first,
121a, 123a, 125a: first, second and third adsorption inlet holes
127: adsorption outlet hole 130: flow path
131, 133, 135, 137:

Claims (2)

메탈 캐리어(3), 상기 메탈 캐리어(3)의 하면에 접착된 양면 테이프(5), 상기 양면 테이프(5)의 하면에 몰딩된 몰딩 웨이퍼(7)가 상중하로 적층된 디본딩 워크(1)를 이송하는 로봇 핸드(100)로서,
판형 암(110)과,
상기 판형 암(110)의 일면에 설치되는 클램핑 홀더(20)와,
상기 판형 암(110)의 타면에 설치되는 진공 흡착식 홀더(120)를 포함하여,
상기 진공 흡착식 홀더(120)와 상기 클램핑 홀더(20)는 상기 판형 암(110)의 상하 양면에 설치되어,
상기 클램핑 홀더(20)는 예열되기 전의 상기 디본딩 워크(1)의 상기 메탈 캐리어(3)를 클램핑하여 매다는 방식으로 이송하고,
상기 진공 흡착식 홀더(120)는 예열된 상기 디본딩 워크(1)의 상기 몰딩 웨이퍼(7)의 하면을 흡착하여 받치는 방식으로 이송하는 디본딩 워크의 이송 기구용 로봇 핸드.
(2), a metal carrier (3), a double-sided tape (5) bonded to the lower surface of the metal carrier (3), and a molding wafer (7) molded on the lower surface of the double- A robot hand (100)
A plate-like arm 110,
A clamping holder 20 installed on one side of the plate-like arm 110,
And a vacuum adsorption holder 120 installed on the other surface of the plate type arm 110,
The vacuum adsorption holder 120 and the clamping holder 20 are installed on both upper and lower surfaces of the plate-like arm 110,
The clamping holder 20 clamps and transports the metal carrier 3 of the debonding work 1 before it is preheated,
Wherein the vacuum adsorption holder (120) transfers the preheated lower surface of the molding wafer (7) of the debonding work (1) in a manner to support the lower surface of the molding wafer (7) in a supported manner.
청구항 1에 있어서,
상기 판형 암(110)은 좌우에 배치되는 제1판형 암(111)과 제2판형 암(113), 상기 제1,2판형 암(111)(113)의 후측을 연결하는 제3판형 암(115)으로 구성되고,
상기 진공 흡착식 홀더(120)는 상기 제1,2,3판형 암(111)(113)(115)에 설치되는 제1,2,3진공 흡착판(121)(123)(125)과, 상기 제3진공흡착판(125)의 후측의 상기 제3판형 암(115)에 배치되는 흡착 출구홀(127)과, 상기 제1,2,3진공 흡착판(121)(123)(125)과 상기 흡착 출구홀(127)을 연결하는 유로(130)를 포함하는 디본딩 워크의 이송 기구용 로봇 핸드.
The method according to claim 1,
The plate type arm 110 includes a first plate type arm 111 and a second plate type arm 113 disposed on the left and right sides and a third plate type arm 114 connecting the rear sides of the first and second plate type arms 111, 115,
The vacuum adsorption holder 120 includes first, second and third vacuum adsorption plates 121, 123 and 125 provided on the first, second and third plate arms 111, 113 and 115, 3 adsorption outlet holes 127 disposed on the third plate type arm 115 on the rear side of the vacuum adsorption plate 125 and the adsorption outlet holes 127 formed on the first plate type arm 115 and the first adsorption outlet 121, And a flow path (130) connecting the holes (127).
KR1020160122863A 2016-09-26 2016-09-26 robot hand for debonding work transort apparatus KR101741080B1 (en)

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Publication number Priority date Publication date Assignee Title
US10923384B2 (en) 2018-09-27 2021-02-16 Semes Co., Ltd. Transfer robot and apparatus for treating substrate with the robot

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Publication number Priority date Publication date Assignee Title
KR101447128B1 (en) 2013-12-31 2014-10-07 엠에스테크놀러지 주식회사 Substrate transferring apparatus
US20150360370A1 (en) 2014-06-17 2015-12-17 John Mazzocco Thin end effector with ability to hold wafer during motion

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101447128B1 (en) 2013-12-31 2014-10-07 엠에스테크놀러지 주식회사 Substrate transferring apparatus
US20150360370A1 (en) 2014-06-17 2015-12-17 John Mazzocco Thin end effector with ability to hold wafer during motion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10923384B2 (en) 2018-09-27 2021-02-16 Semes Co., Ltd. Transfer robot and apparatus for treating substrate with the robot

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