JP2003051528A - Conveyer for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conveyer for substrates, with which even a large substrate can be prevented from being deformed and an installation space can be reduced. SOLUTION: In a conveyer 5 for substrates for conveying a substrate 1 in the vertical state, this device is provided with a conveyer rail 7 at the upper part of a conveyer line 6 for the substrate 1, conveyer jig 11 composed of a horizontal member 9 having at least two or more clamps 8 for clamping the upper part of the substrate 1 in the vertical state, conveyer wagon 12 to move along with the conveyer rail 7 while supporting that conveyer jig 11 integrally with the substrate 1, a buffer 15 provided on the side of a working table 14 for performing production work while placing the substrate 1 in the horizontal state for temporarily keeping the substrate 1, and moving device 16 for moving the substrate 1 integrated with the conveyer jig 11 between that buffer 15 and the working table 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device for transferring a substrate in a vertical state.

[0002]

2. Description of the Related Art In a manufacturing factory of substrates such as LCDs, a plurality of manufacturing processing blocks for processing the substrates are provided.
A transfer device is provided to transfer the substrate between the manufacturing and processing blocks.

Conventionally, as a device for carrying a substrate, there are a carrying device for carrying a substrate in a horizontal state and delivering it with a robot having a vacuum suction hand, and a carrying device for carrying with a horizontal roller conveyor.

[0004]

By the way, in recent years, substrates have become large in size, and some have a length exceeding 1 m.

However, in the above-mentioned transfer device, since the transfer and storage of the substrate are carried out in a horizontal state, when the size of the substrate is increased, its own weight causes deformation such as bending at the center. There was a problem of being lost.

In addition, a large space for carrying is required, and the ratio of the space in the production equipment increases, and the manufacturing cost of the equipment increases. In addition, the ratio of the space for installing the manufacturing / processing block is small, and the productivity of the substrate is not so good.

In particular, in a device for delivering and receiving by a robot, the size of the robot itself is increased, the manufacturing cost of the equipment is further increased, and the space for installing the manufacturing / processing block is further narrowed.

Further, in order to achieve efficient manufacturing operation, each manufacturing apparatus is often provided with a temporary storage space at the entrance / exit of the substrate, but this storage space also occupies a large proportion in the production facility. I will end up.

Therefore, the present invention has been devised to solve the above problems, and an object thereof is to prevent deformation of a large-sized substrate and reduce the installation space. To provide a carrier device for use.

[0010]

In order to solve the above-mentioned problems, the present invention is a substrate transfer apparatus for transferring a substrate in a vertical state, and a transfer rail disposed above a transfer line of the substrate, A transfer jig composed of a horizontal member having at least two or more gripping parts for gripping an upper part of the substrate in a vertical state, and a transfer carriage that integrally supports the transfer jig with the substrate and moves along the transfer rail. A buffer unit provided on the side of a work table for carrying out the manufacturing work by placing the substrate in a horizontal state, and a buffer unit for temporarily storing the substrate, and the transfer jig integrated between the buffer unit and the work table. And a transfer device for moving the substrate.

According to the above construction, since the substrate is held in a vertical state and is conveyed by gripping the upper part thereof, it is possible to prevent the substrate from being deformed by its own weight and reduce the horizontal area. The installation space of the transfer device can be reduced, and the initial and running costs of the entire manufacturing plant can be reduced by that amount. In addition, since the installation space of the substrate transfer device is reduced, a large space for installing the manufacturing / processing block can be taken, and the productivity of the substrate can be improved.

It is preferable that the horizontal members of the transfer jig are formed so as to project from the upper ends of the substrate by a predetermined length.

Further, it is preferable that the buffer portion is provided with a pair of arms that support horizontal members protruding from both ends of the upper portion of the substrate of the carrying jig from the lower portion thereof and that are movable in a direction orthogonal to the substrate. .

Further, it is preferable that the transfer device includes a fork having a suction cup for sucking the substrate and a rotating portion for rotating the fork.

Further, the transfer device is provided with a fork having a suction cup for sucking the substrate and a support portion for supporting a horizontal member of the transfer jig, and a rotating portion for rotating the fork. Is preferred.

Further, it is preferable that the transport carriage supports a plurality of the substrates integrated with the transport jig.

Further, it is preferable that the transport carriage is provided with a locking member for supporting a horizontal member projecting from both ends of the upper portion of the substrate of the transport jig from a lower portion thereof.

Further, it is preferable that a low-dust-curing cured UV tape which is cured by irradiation of ultraviolet rays is attached to the contact surface of the transfer jig with the substrate.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is an overall perspective view showing a preferred embodiment of a substrate carrying device according to the present invention, and FIG. 2 shows a carrying jig according to a preferred embodiment of the substrate carrying device according to the present invention. FIG. 3 is a perspective view showing a buffer portion of a preferred embodiment of the substrate carrying device according to the present invention, and FIG. 4 is a plan view showing the outline of a substrate manufacturing factory.

First, an outline of a substrate manufacturing factory will be described.

As shown in FIG. 4, in the substrate manufacturing plant,
Main loop 2 for carrying a substrate (see FIGS. 1 to 3) 1
A plurality of branch conveyance paths 3 are provided around the. Around the branch conveyance path 3, a plurality of manufacturing processing blocks 4 for performing various substrate manufacturing processes are arranged. The main loop 2 and the branch transfer path 3 are provided with a board transfer device 5 according to the present invention.

As shown in FIG. 1, such a substrate transfer device 5 is provided.
Is for transporting the substrate 1 in a vertical state.
Conveyance consisting of a conveyance rail 7 arranged above the conveyance line (main loop 2 and branch conveyance path 3) 6 and a horizontal member 9 having at least two grasping portions 8 for grasping the upper portion of the substrate 1 in the vertical state. Jig 11 and its transportation jig 11
Of the substrate 1 that is supported integrally with the substrate 1 and moves along the transport rail 7, and the substrate 1 that is provided on the side of the work table 14 that places the substrate 1 in a horizontal state and performs various manufacturing operations. It is characterized in that it is provided with a buffer unit 15 for temporary storage and a transfer device 16 for moving the substrate 1 integrated with the transfer jig 11 between the buffer unit 15 and the work table 14.

The transport rail 7 is made of a member such as a steel frame having a predetermined strength, and a guide portion (not shown) for traveling a transport carriage 12, which will be described in detail later, along the longitudinal direction thereof. Are formed.

As shown in FIG. 2, the carrying jig 11 has a plurality of gripping portions 8 (shown at three locations in FIG. 2 and four locations in FIGS. 1 and 3) below the horizontal member 9. Have The grip portion 8 has two plate members 17, and these plate members 17 are provided with a biasing means (not shown) such as a spring that applies a biasing force to clamp the substrate 1. Plate material 17
A cushioning material such as resin is provided on the contact surface with the substrate 1 to prevent the substrate 1 from being damaged. Horizontal member 9
Are formed so as to project from the upper ends of the substrate 1 by a predetermined length.

The carrier truck 12 holds the carrier jig 11 from above. A locking portion 18 for supporting the transport jig 11 is formed on the transport carriage 12. This locking portion 18
Are arranged at positions corresponding to the gripping portions 8 of the transport jig 11. The locking portion 18 is provided with a moving arm 19 for opening and closing the grip portion 8 of the transport jig 11.
The movable arm 19 is configured such that by pressing a rotating pin 21 provided on the grip portion 8, one plate member 17 opens against the biasing means, and the grip of the substrate 1 is released.

As shown in FIG. 3, the buffer section 15 is provided with a pair of arms 23 that are movable in the direction orthogonal to the substrate 1. The arm 23 supports the transfer jig 11 from the lower portion of the portion 24 of the horizontal member 9 protruding from both upper ends of the substrate 1. The arm 23 has a predetermined length, and is configured to suspend and store the plurality of substrates 1 and the transfer jig 11 at predetermined intervals. Buffer unit 15
Is a delivery buffer unit 25 that is temporarily stored before the substrate 1 is transferred to the transfer device 16 described later, and a reception buffer unit 26 that is temporarily stored after the manufacturing / processing work is completed and returned from the transfer device 16. And are formed.

The buffer section 15 is provided with a transfer arm 27 for receiving the substrate 1 integrated with the transfer jig 11 from the transfer carriage 12 and passing it over the arm 23. The transfer arm 27 has a mounting portion 28 for mounting and supporting the transfer jig 11 on the upper surface thereof. The transfer arm 27 is arranged at a position offset from the arm 23, and at a position displaced from the arm 23, the transfer portion 27 is placed from a lower portion of a portion 24 protruding from both upper ends of the substrate 1 of the horizontal member 9.
It is supposed to be supported by 8. The transfer arm 27 is provided so as to be movable in a direction orthogonal to the substrate 1 and capable of moving up and down a little, and receives the substrate 1 from the transport carriage 12 and
It can be moved to any position on the arm 23.

The workbench 14 is provided in the manufacturing / processing block 4 and is provided with a plurality of fixed support pins (see FIG. 1) 22 projecting upward to support the substrate 1 in a horizontal state.

The transfer device 16 is arranged between the buffer section 15 and the workbench 14, and a support section for supporting the suction member (not shown) for sucking the substrate 1 and the horizontal member 9 of the transfer jig 11. Fork 31 having 59 and its fork 31
And a rotating unit 32 for rotating the.

A plurality of suckers are provided on the substrate 1 side of the fork 31. The support portion 59 is composed of a plate material extending in the longitudinal direction at the tip of the fork 31.
When 1 becomes horizontal, the horizontal member 9 is fixedly supported.

The rotating portion 32 moves the fork 31 to the buffer portion 15 when standing up (shown on the left side in FIG. 1) and moves the fork 31 onto the workbench 14 when horizontal (shown on the right side in FIG. 1). It has a slide mechanism to move it.

On the side of the workbench 14, the transfer jig 1 is provided.
Substrate attaching / detaching device (not shown) for releasing the grasping of the first substrate 1
Is provided, and the work is performed on the work table 14 with the substrate 1 removed from the transfer jig 11.

The transfer device 16 is formed so as to be movable in the orthogonal direction and the parallel direction of the substrate 1. Specifically, below the transfer device 16, a guide rail 33 extending in a direction orthogonal to the substrate 1 and a guide rail 3 extending in a parallel direction are provided.
4 is provided, and the transfer device 16 runs along these guide rails 33 and 34. The transfer device 16 moves between the buffer unit 15 and the workbench 14 by moving in the orthogonal direction of the substrate 1, while moving in the parallel direction of the substrate 1 so that the payout buffer unit 25 and the receiving buffer unit 26 are moved. Move between.

Next, the operation will be described while explaining the transfer operation of the substrate 1 by the substrate transfer device 5 having the above-described structure.

After the substrate 1 is loaded into the manufacturing factory, the upper part thereof is suspended and gripped by the transport jig 11, and the substrate 1 is supported by the transport carriage 12 integrally with the transport jig 11 and is supported by the main loop 2. Is conveyed to the branch conveyance path 3.

When the desired manufacturing / processing block 4 is reached, the carriage 12 stops on the side of the payout buffer 25 in the buffer 15 and the transfer arm 27 causes the horizontal member 9 of the jig 11. The substrate 1 and the transfer jig 11 are separated from the transfer carriage 12 by moving to the lower part of the table 1 and rising slightly. Then, the substrate 1 and the transfer jig 11 are transferred to a predetermined position of the arm 23 by the transfer arm 27 and temporarily stored.

At this time, since the substrate 1 is gripped by the transfer jig 11, it does not come into contact with the transfer carriage 12 or the buffer section 15 and damage can be prevented. Further, in the buffer section 15, since the transfer jig 11 functions as a spacer, the adjacent substrates 1 do not come into contact with each other.

After that, the rotating portion 32 of the transfer device 16 is rotated to take out the fork 31 and the worktable 14 of the buffer portion 25.
Stand up on the side of the substrate 1 located on the side. Then, the substrate 1 is fixed by the suction cup of the fork 31 and the horizontal member 9 of the transfer jig 11 is fixed by the support portion 59, and then the fork 31 is slightly lifted to separate the horizontal member 9 from the arm 23 and rotate. The part 32 is rotated to lay the substrate 1 and the transfer jig 11 on a substrate attaching / detaching device (not shown) in a horizontal state. And
After the transfer jig 11 and the substrate 1 are separated by the substrate attaching / detaching device, the substrate 1 is moved onto the workbench 14. At this time, since the substrate 1 is supported by the fixed support pins 22, the fork 31 can be pulled out by moving the transfer device 16 along the guide rail 33 in the direction away from the workbench 14. .

When the manufacturing process of the substrate 1 is completed, the fork 31 is inserted into the lower part of the substrate 1 and sucked by the suction cup, then the substrate 1 is moved to the substrate attaching / detaching device, and the transfer jig 11 is attached to the substrate 1. After that, the rotating unit 32 is rotated to raise the fork 31, the transfer device 16 is moved to the buffer unit 15 side along the guide rail 33, and then is moved to the substrate attaching / detaching device along the guide rail 34. After mounting the transfer jig 11 on the substrate 1, the receiving buffer unit 2
Move to side 6

After that, the horizontal member 9 of the carrying jig 11 is locked to the arm 23 of the receiving buffer portion 26 and temporarily stored. Then, by the transfer arm 27, the transfer rail 7
The substrate 1 and the transfer jig 11 are moved to the transfer carriage 12 that stands by on the side.

Then, the substrate 1 and the transfer jig 11 are integrated and accommodated in a predetermined number in a transfer storage cassette and transferred.

As described above, the substrate transfer device 5 of the present invention.
According to the above, since the substrate 1 is held in the vertical state and the upper portion thereof is grasped and hung to be conveyed, the substrate 1 can be prevented from being deformed by its own weight without applying an unreasonable force.

In addition, since the substrate 1 is held in a vertical state for transportation and temporary storage, it is possible to prevent minute debris from adhering to the surface of the substrate 1.

Further, according to the present invention, it is possible to reduce the horizontal area at the time of transfer, and to reduce the installation space of the substrate transfer device 5, and correspondingly the initial and running costs of the entire manufacturing plant. Can be held low. In addition, since the installation space of the substrate transfer device 5 is reduced, the space for installing the manufacturing processing block 4 can be increased, and the productivity of the substrate 1 can be improved.

Since the space for temporarily storing the substrate 1 can be made small, the space for installing the manufacturing / processing block 4 can be made larger, and the productivity of the substrate 1 can be further improved.

FIG. 5 is a perspective view showing a transfer carriage of another preferred embodiment of the substrate transfer apparatus according to the present invention, and FIG. 6 is another preferred embodiment of the substrate transfer apparatus according to the present invention. FIG. 7 is a side view showing a carrier truck of FIG. 7, FIG. 7 is a side view showing a carrier jig of another preferred embodiment of the substrate carrier apparatus according to the present invention, and FIG. 8 is a substrate carrier apparatus according to the present invention. FIG. 9 is a side view and a front view showing a grip portion of a transfer jig according to another preferred embodiment, and FIG. 9 shows a grip portion of the transfer jig according to another preferred embodiment of the substrate transfer device according to the present invention. It is a side view showing the released state.

The carrier truck 12 of the substrate carrier 5 according to this embodiment is configured to support a plurality of substrates 1 integrated with the carrier jig 11.

As shown in FIG. 5 and FIG.
Is composed of a traveling portion 35 that travels along the transport rail 7 and a support frame 36 that is provided below the traveling portion 35 and that supports the substrate 1.

The support frame 36 is assembled in a rectangular shape when viewed from the side, and has upper portions at both ends for supporting horizontal members 9 projecting from both upper portions of the substrate 1 of the transfer jig 11 from the lower portion. Locking member 37 is provided. As the locking member 37, for example, a channel steel 38 having a U-shaped cross section is used, and the locking member 37 extends a predetermined length in a direction orthogonal to the substrate 1 and is formed of a plurality of (four in the present embodiment). The substrate 1 of 1) can be gripped at the same time.

The protruding portion 24 of the horizontal member 9 of the carrying jig 11
Two downwardly extending projections 41 are formed at intervals in the axial direction. On the other hand, the locking member 38
A hole (not shown) with which the outer protrusion 41 of the protrusions 41 is engaged is formed in the. The holes are formed at a predetermined pitch along the longitudinal direction of the locking member 38, and serve to position each substrate 1.

The inner projection 41 of the projections 41 is engaged with a hole (not shown) formed in the upper surface of the arm 23 (shown by the broken line in FIG. 6) of the buffer 15. ,
Positioning of each substrate 1 in the buffer portion 15 is performed.

A plurality of support bases 43 for supporting the bottom side of the substrate 1 are provided below the support frame 36 to improve the stability of the substrate 1.

As shown in FIG. 7, the holding portion 8 of the transfer jig 11 of the substrate transfer device 5 according to the present embodiment has a horizontal member 9 as shown in FIG.
Multiple (3 places) As shown in FIG. 8, the grip portion 8 includes a bracket 4 extending downward from the horizontal member 9.
4 has an inverted U-shaped leaf spring 45 attached to the bracket 44 thereof. The base end portion of the leaf spring 45 is fixed to a substantially intermediate portion of the bracket 44 by a bolt 46, and once extends upward and is folded back downward, and its tip portion extends to the position of the lower end portion of the bracket 44. .
A clamper 47 that narrows the substrate 1 is provided between the tip of the leaf spring 45 and the bottom of the bracket 44 so as to face each other. The clamper 47 is fixed to the front end of the leaf spring 45 and the lower end of the bracket 44 via a clamper pressing member 48. Substrate 1 is leaf spring 4
It is clamped by the clamper 47 by the urging force of 5.

The bracket 44 and the leaf spring 45 have the substrate 1
Through holes 51 and 52 used when attaching and detaching are formed offset from each other.

Next, the operation of attaching / detaching the substrate 1 to / from the carrying jig 11 will be described.

The substrate 1 is attached / detached to / from the transfer jig 11 by a substrate attaching / detaching device (not shown) arranged on the side of the workbench 14 or the like. In the substrate attaching / detaching device, as shown in FIG.
The transport jig 11 is arranged sideways.

When the substrate 1 is removed, the pin 55 is inserted downward from the through hole 52 of the leaf spring 45 of the grip portion 8 to press the bracket 44, and the pin 56 is moved upward from the through hole 51 of the bracket 44. And push the leaf spring 45 apart. As a result, the clampers 47 are separated from each other and the substrate 1 is released. Then, the substrate 1 is moved by rotating the roller 57 provided below the substrate 1.

On the other hand, when mounting the board 1, the board spring 45 is expanded and then the board 1 is moved between the clampers 47 and the pins 55 and 56 are pulled out as described above. The substrate 1 is held by the biasing force of 45.

Further, in the present embodiment, a low dusting curing UV tape 54 which is cured by ultraviolet irradiation is attached to the contact surface 53 of the clamper 47 with the substrate 1. The cured UV tape 54 is usually a tape with an adhesive applied to a semiconductor manufacturing process, which is cured by irradiating it with ultraviolet rays, and is used by reducing the adhesive strength. The cured UV tape 54 has an effect of generating low dust even after being cured, and particles attached to the substrate 1 can be reduced.

In order to investigate a specific numerical value, the inventor of the present invention used the PA that was conventionally used for the contact surface 53 with the substrate 1.
N, PEEK, and the above effect UV sheet were attached to the contact surface 53, and the adhesion state of particles was measured.

As shown in the graph of FIG. 10, in the cured UV tape, the number of adhered particles is reduced to 20% or less when the pressing frequency is 100, as compared with the conventionally used PAN and PEEK. I understood. It was also found that the reduction rate of the number of adhered particles is higher when the number of pressings that is considered to be pressed in the substrate manufacturing process is small (about 20 times).

In short, in the present embodiment, the transfer jig 1
By attaching the cured UV tape 54 to the contact surface 53 of the gripping portion 8 of the first substrate 1 with the substrate 1, the number of particles such as dust adhering to the substrate 1 can be significantly reduced. Further, the cured UV tape 54 originally has an adhesive force, but since the adhesive force is reduced by irradiating ultraviolet rays, the cured UV tape 54 does not become a resistance such as a release of the grip of the substrate 1.

On the other hand, in the present embodiment, since the transfer jig 11 can collectively transfer a plurality (4) of substrates 1, the transfer capability is improved and the manufacturing efficiency of the substrates 1 is improved. In addition, by using about four sheets as a conveyance unit, the conveyance space is not too wide, and it is possible to obtain the effect of making a tight turn.

The respective configurations of the transport jig 11 and the transport carriage 12 of the above embodiment are merely examples, and the configurations are not limited to the above.

[0066]

In summary, according to the present invention, since the substrate is held in the vertical state and is conveyed by gripping the upper portion thereof, the deformation of the substrate due to its own weight can be prevented and the horizontal area can be reduced. Therefore, the installation space of the transfer device can be reduced, and the initial and running costs of the entire manufacturing plant can be suppressed by that amount, which is an excellent effect.

Further, since the installation space of the substrate transfer device is reduced, the space for installing the manufacturing / processing block can be increased, and the productivity of the substrate can be improved.

Further, since the transfer carriage can transfer a plurality of substrates at the same time, the transfer efficiency is improved.

Further, by attaching the cured UV tape to the contact surface of the grip portion of the transfer jig with the substrate, the number of particles such as dust adhering to the substrate can be significantly reduced.

[Brief description of drawings]

FIG. 1 is an overall perspective view showing a preferred embodiment of a substrate transfer device according to the present invention.

FIG. 2 is a perspective view showing a transfer jig of a preferred embodiment of the substrate transfer device according to the present invention.

FIG. 3 is a perspective view showing a buffer section of a preferred embodiment of the substrate carrier according to the present invention.

FIG. 4 is a plan view showing an outline of a substrate manufacturing factory.

FIG. 5 is a perspective view showing a carrier truck of another preferred embodiment of the substrate carrier according to the present invention.

FIG. 6 is a side view showing a carrier truck of another preferred embodiment of the substrate carrier device according to the present invention.

FIG. 7 is a side view showing a carrying jig of another preferred embodiment of the board carrying apparatus according to the present invention.

FIG. 8A is a side view showing a grip portion of a transfer jig of another preferred embodiment of the substrate transfer device according to the present invention.
(B) is a front view.

FIG. 9 is a side view showing a released state of a grip portion of a transfer jig in another preferred embodiment of the substrate transfer device according to the present invention.

FIG. 10 is a graph showing the number of adhered particles for each pressing material on the contact surface of the grip portion of the transport jig.

[Explanation of symbols]

1 substrate 5 substrate transfer device 6 transport lines 7 Conveyor rail 8 grip 9 Horizontal member 11 Transport jig 12 carrier 14 Workbench 15 buffer section 16 Transfer device 23 arms 31 forks 32 Rotating part 37 Locking member 53 Contact surface (with substrate of transfer jig) 54 Cured UV tape

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Shin Murayama             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center (72) Inventor Kenji Iimura             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center (72) Inventor Kensuke Hirata             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center (72) Inventor Kengo Matsuo             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center (72) Inventor Yoshiyuki Wada             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center (72) Inventor Kei Hasegawa             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center (72) Inventor Shusaku Yamazaki             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center (72) Inventor Keiji Okada             3-15 Toyosu, Koto-ku, Tokyo Ishikawajima             Harima Heavy Industries Tokyo Engineering Co., Ltd.             In the center F-term (reference) 5F031 CA05 FA02 FA07 FA09 FA18                       FA21 GA08 GA16 GA58 PA13                       PA18 PA30

Claims (8)

[Claims] 1. A substrate transfer device for transferring a substrate in a vertical state, wherein at least two or more transfer rails arranged above the transfer line of the substrate and a holding portion for holding an upper part of the substrate in a vertical state are provided. A transfer jig formed of a horizontal member, a transfer carriage that integrally supports the transfer jig with the board and moves along the transfer rail, and a work for placing the board in a horizontal state and performing a manufacturing operation. A buffer unit provided on a side portion of the table for temporarily storing the substrate; and a transfer device for moving the substrate integrated with the transfer jig between the buffer unit and the work table. Substrate transfer device. 2. The substrate transfer apparatus according to claim 1, wherein the horizontal member of the transfer jig is formed so as to protrude from both upper ends of the substrate by a predetermined length. 3. The buffer portion includes a pair of arms that support horizontal members protruding from both ends of the upper portion of the substrate of the transfer jig from the lower portion thereof and that are movable in a direction orthogonal to the substrate. Alternatively, the substrate transfer device according to any one of 2 and 3. 4. The substrate transfer device according to claim 1, wherein the transfer device includes a fork having a suction cup for sucking the substrate, and a rotating portion for rotating the fork. 5. The transfer device includes a fork having a suction cup for sucking the substrate and a support portion for supporting a horizontal member of the transfer jig, and a rotating portion for rotating the fork. Item 4. The substrate transfer apparatus according to any one of Items 1 to 3. 6. The substrate transfer device according to claim 1, wherein the transfer carriage supports a plurality of the substrates integrated with the transfer jig. 7. The substrate transfer according to claim 1, wherein the transfer carriage includes a locking member that supports a horizontal member protruding from both upper ends of the substrate of the transfer jig from a lower portion thereof. apparatus. 8. The contact surface of the transfer jig with the substrate,
8. The substrate transfer device according to claim 1, further comprising a cured UV tape with low dust generation that is cured by ultraviolet irradiation.