TWI468294B - Bonding apparatus - Google Patents
Bonding apparatusInfo
- Publication number
- TWI468294B TWI468294B TW98125285A TW98125285A TWI468294B TW I468294 B TWI468294 B TW I468294B TW 98125285 A TW98125285 A TW 98125285A TW 98125285 A TW98125285 A TW 98125285A TW I468294 B TWI468294 B TW I468294B
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- substrate
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- Lining Or Joining Of Plastics Or The Like (AREA)
Description
本發明涉及一種貼合設備,尤其涉及一種用於製造面板之貼合設備。 The present invention relates to a laminating apparatus, and more particularly to a laminating apparatus for manufacturing a panel.
於製造液晶顯示器面板或者觸控面板之過程中,會將二塊基板於真空貼合裝置內進行貼合。通常情況下,於基板加工好後,會於其表面貼上保護膜以保護其外觀,於貼合前再通過撕膜裝置撕掉保護膜。 During the manufacture of the liquid crystal display panel or the touch panel, the two substrates are bonded together in the vacuum bonding apparatus. Normally, after the substrate is processed, a protective film is attached to the surface to protect its appearance, and the protective film is peeled off by a tear film device before bonding.
一種貼合設備包括撕膜裝置、貼合機構以及連接二者之輸送帶。首先將待貼合之基板放入撕膜裝置進行撕膜後,再通過輸送帶送入貼合機構內進行貼合。此種貼合設備通過將撕膜裝置與貼合機構設置成流水線之方式,無需手工操作,節省人力成本。因撕膜之時間小於基板貼合之時間,於貼合時撕膜裝置需要設置等待時間,影響設備之利用率以及貼合之效率。 A laminating apparatus includes a tear film device, a laminating mechanism, and a conveyor belt connecting the two. First, the substrate to be bonded is placed in a tear film device to be peeled off, and then fed into the bonding mechanism through a conveyor belt for bonding. The laminating device saves labor costs by eliminating the need for manual operation by setting the tear film device and the bonding mechanism into a line. Since the tearing film time is less than the bonding time of the substrate, the tearing film device needs to set a waiting time during the bonding, which affects the utilization rate of the device and the efficiency of the bonding.
鑒於上述狀況,有必要提供一種生產效率及設備利用率較高之貼合設備。 In view of the above situation, it is necessary to provide a bonding device with high production efficiency and high equipment utilization rate.
一種貼合設備,用於貼合第一基板及第二基板,貼合設備包括基座、設置於基座上之第一撕膜裝置、第二撕膜裝置、真空貼合裝置以及上料機構,第一撕膜裝置及第二撕膜裝置分別對第一基板 及第二基板撕膜,該真空貼合裝置至少為二個,並排設置於基座上,上料機構包括設置於基座表面之滑軌以及滑動設置於滑軌上之載料台,載料台將第一基板及第二基板移送至一真空貼合裝置後,於滑軌上滑動,以將另一第一基板及第二基板移送至另一真空貼合裝置中,該第一撕膜裝置包括垂直於該基座設置之固定架,轉動設置於該固定架上之收料輪和放料輪、繞設於該放料輪上之膠帶、相對該固定架可移動之剝料板以及設置於該固定架上方之壓緊件,該壓緊件相對該剝料板可上下運動。 A bonding device for bonding a first substrate and a second substrate, the bonding device comprising a base, a first tear film device disposed on the base, a second tear film device, a vacuum bonding device, and a loading mechanism The first tear film device and the second tear film device respectively face the first substrate And a second substrate tearing film, the vacuum bonding device is at least two, arranged side by side on the base, the loading mechanism comprises a sliding rail disposed on the surface of the base and a loading platform slidingly disposed on the sliding rail, the loading material After transferring the first substrate and the second substrate to a vacuum bonding device, sliding on the sliding rail to transfer the other first substrate and the second substrate to another vacuum bonding device, the first tear film The device comprises a fixing bracket disposed perpendicular to the base, a receiving wheel and a discharging wheel disposed on the fixing frame, a tape wound around the discharging wheel, a stripping plate movable relative to the fixing frame, and a pressing member disposed above the fixing frame, the pressing member is movable up and down relative to the stripping plate.
一種貼合設備,用於貼合第一基板及第二基板,該貼合設備包括基座、設置於基座上之第一撕膜裝置、固定於基座上之真空貼合裝置以及上料機構,該第一撕膜裝置對該第一基板撕膜,真空貼合裝置至少有二個,並排設置於基座上,上料機構相對至少二真空貼合裝置可滑動,以將第一基板或第二基板移送至至少二真空貼合裝置中,該第一撕膜裝置包括垂直於該基座設置之固定架,轉動設置於該固定架上之收料輪和放料輪、繞設於該放料輪上之膠帶、相對該固定架可移動之剝料板以及設置於該固定架上方之壓緊件,該壓緊件相對該剝料板可上下運動。 A bonding device for bonding a first substrate and a second substrate, the bonding device comprising a base, a first tear film device disposed on the base, a vacuum bonding device fixed on the base, and a loading device The first tearing film device tears the film on the first substrate, and the vacuum bonding device has at least two, which are arranged side by side on the base, and the loading mechanism is slidable relative to at least two vacuum bonding devices to move the first substrate Or the second substrate is transferred to the at least two vacuum bonding device, the first tearing film device comprises a fixing frame disposed perpendicular to the base, and the receiving wheel and the discharging wheel disposed on the fixing frame are rotated around The tape on the discharge wheel, the stripping plate movable relative to the fixing frame, and the pressing member disposed above the fixing frame, the pressing member is movable up and down relative to the stripping plate.
上述貼合設備中,載料台可滑動地設置於滑軌上,因此可將第撕膜後之基板送至不同之真空貼合裝置中。於載料台輸送第一基板及第二基板至其中一真空貼合裝置之過程中,第一撕膜裝置及第二撕膜裝置可對另外之第一基板及第二基板剝膜,載料台輸送完前一組基板便可將另一組基板輸送至另一真空貼合裝置中。如此循環,可使設備充分被利用,提高了貼合之效率。 In the above bonding apparatus, the loading stage is slidably disposed on the slide rail, so that the substrate after the tear film can be sent to different vacuum bonding apparatuses. During the process of transporting the first substrate and the second substrate to one of the vacuum bonding devices, the first tearing film device and the second tearing film device may strip the other first substrate and the second substrate, and load the material. The other set of substrates can be transported to another vacuum laminating device by transporting the previous set of substrates. This cycle allows the device to be fully utilized and improves the efficiency of the fit.
100‧‧‧貼合設備 100‧‧‧Fitting equipment
200‧‧‧第一基板 200‧‧‧First substrate
300‧‧‧第二基板 300‧‧‧second substrate
10‧‧‧基座 10‧‧‧ Pedestal
20‧‧‧第一撕膜裝置 20‧‧‧First tear film device
11‧‧‧工作面 11‧‧‧Working face
30‧‧‧第二撕膜裝置 30‧‧‧Second tear film device
21、31‧‧‧固定架 21, 31‧‧‧ fixed frame
22、32‧‧‧收料輪 22, 32‧‧‧ receiving wheels
23、33‧‧‧放料輪 23, 33‧‧‧Discharge wheel
24、34‧‧‧膠帶 24, 34‧‧‧ Tape
25、35‧‧‧剝料板 25, 35‧‧‧ stripping board
40‧‧‧上料機構 40‧‧‧Feeding agency
26‧‧‧壓緊件 26‧‧‧Resist parts
41‧‧‧滑軌 41‧‧‧rails
43‧‧‧調節組件 43‧‧‧Adjustment components
431‧‧‧第一滑動件 431‧‧‧First slide
433‧‧‧第二滑動件 433‧‧‧Second slide
435‧‧‧旋轉件 435‧‧‧Rotating parts
45、65‧‧‧載料台 45, 65‧‧‧ loading platform
451‧‧‧第一載料板 451‧‧‧First carrier board
453‧‧‧第二載料板 453‧‧‧Second carrier board
50‧‧‧真空貼合裝置 50‧‧‧Vacuum laminating device
51‧‧‧第一側壁 51‧‧‧First side wall
53‧‧‧第二側壁 53‧‧‧second side wall
511‧‧‧入料口 511‧‧‧Inlet
531‧‧‧出料口 531‧‧‧Outlet
60‧‧‧卸料機構 60‧‧‧Discharge mechanism
70‧‧‧定位機構 70‧‧‧ Positioning mechanism
651‧‧‧載料板 651‧‧‧Loading plate
71‧‧‧承載台 71‧‧‧Loading station
73‧‧‧夾爪 73‧‧‧claw
75‧‧‧氣缸 75‧‧‧ cylinder
圖1係本發明實施方式之貼合設備之立體結構圖。 1 is a perspective structural view of a bonding apparatus according to an embodiment of the present invention.
圖2係圖1所示貼合設備之第一撕膜裝置之立體結構圖。 2 is a perspective structural view of a first tear film device of the bonding apparatus shown in FIG. 1.
圖3係圖1所示貼合設備之第二撕膜裝置之立體結構圖。 3 is a perspective structural view of a second tear film device of the bonding apparatus shown in FIG. 1.
圖4係圖1所示貼合設備之上料機構之立體結構圖。 Figure 4 is a perspective structural view of the feeding mechanism of the laminating apparatus shown in Figure 1.
圖5係圖4所示上料機構之載料台承載基板之結構示意圖。 Figure 5 is a schematic view showing the structure of the loading platform of the loading platform of the loading mechanism shown in Figure 4.
圖6係圖1所示貼合設備之真空貼合裝置之立體結構圖。 Figure 6 is a perspective structural view of the vacuum bonding apparatus of the bonding apparatus shown in Figure 1.
圖7係圖1所示貼合設備之卸料機構之立體結構圖。 Figure 7 is a perspective structural view of the unloading mechanism of the laminating apparatus shown in Figure 1.
圖8係圖1所示貼合設備之定位機構之立體結構圖。 Figure 8 is a perspective structural view of the positioning mechanism of the bonding apparatus shown in Figure 1.
下面結合附圖及實施方式對本發明提供之貼合設備作進一步詳細說明。 The laminating apparatus provided by the present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
請參閱圖1,本發明實施方式提供之貼合設備100用於對第一基板200(如圖2所示)及第二基板300(如圖3所示)進行貼合。貼合設備100包括基座10、固定於基座10上之第一撕膜裝置20、第二撕膜裝置30、上料機構40、至少二真空貼合裝置50、卸料機構60以及定位機構70。上料機構40及卸料機構60分別位於真空貼合裝置50之相對二側。 Referring to FIG. 1 , a bonding apparatus 100 according to an embodiment of the present invention is used to attach a first substrate 200 (shown in FIG. 2 ) and a second substrate 300 (shown in FIG. 3 ). The bonding apparatus 100 includes a base 10, a first tearing film device 20 fixed to the base 10, a second tearing film device 30, a loading mechanism 40, at least two vacuum bonding devices 50, a discharging mechanism 60, and a positioning mechanism 70. The loading mechanism 40 and the discharging mechanism 60 are respectively located on opposite sides of the vacuum bonding device 50.
請同時參閱圖2及圖3,第一基板200及第二基板300可為用於製造觸控面板、液晶顯示器之玻璃板、亦可為用於製造半導體等器件之元件或者其他需要密封貼合之元件。本實施方式中,第一基板200及第二基板300為玻璃板。第一基板200及第二基板300上貼有保護膜(圖未標)。 Referring to FIG. 2 and FIG. 3 , the first substrate 200 and the second substrate 300 may be used for manufacturing a touch panel, a glass panel of a liquid crystal display, or a component for manufacturing a semiconductor device or the like. The components. In the present embodiment, the first substrate 200 and the second substrate 300 are glass plates. A protective film (not shown) is attached to the first substrate 200 and the second substrate 300.
請再參閱圖1,基座10用於支撐其上之各裝置,基座10具有工作面11。 Referring again to Figure 1, the base 10 is for supporting the various devices thereon, and the base 10 has a working surface 11.
請同時參閱圖1及圖2,第一撕膜裝置20設置於基座10上,包括垂直於工作面11設置之固定架21,轉動設置於固定架21上之收料輪22、放料輪23、繞設於放料輪23上之膠帶24、相對固定架21可移動之剝料板25以及設置於固定架21上方之壓緊件26。壓緊件26相對剝料板25可上下運動。第一撕膜裝置20用於對第一基板200撕膜。 Referring to FIG. 1 and FIG. 2 , the first tear film device 20 is disposed on the base 10 , and includes a fixing frame 21 disposed perpendicular to the working surface 11 , and rotating the receiving wheel 22 and the discharging wheel disposed on the fixing frame 21 . 23. The tape 24 wound around the discharge wheel 23, the stripping plate 25 movable relative to the fixing frame 21, and the pressing member 26 disposed above the fixing frame 21. The pressing member 26 is movable up and down with respect to the stripping plate 25. The first tear film device 20 is used to tear the film from the first substrate 200.
請同時參閱圖1及圖3,第二撕膜裝置30設置於基座10上,與第一撕膜裝置20之結構基本相同,包括固定架31、轉動設置於固定架31上之收料輪32、放料輪33、繞設於放料輪33上之膠帶34以及相對固定架31可移動之剝料板35。第二撕膜裝置30用於對第二基板300撕膜。 Referring to FIG. 1 and FIG. 3 , the second tear film device 30 is disposed on the base 10 , and has the same structure as the first tear film device 20 , and includes a fixing frame 31 and a receiving wheel that is rotatably disposed on the fixing frame 31 . 32. A discharge wheel 33, an adhesive tape 34 wound around the discharge wheel 33, and a stripping plate 35 movable relative to the fixed frame 31. The second tear film device 30 is used to tear the film from the second substrate 300.
請同時參閱圖1、圖4及圖5,上料機構40包括鋪設於基座10之工作面11上之滑軌41、滑動設置於滑軌41上之調節組件43以及與調節組件43連接之載料台45。調節組件43包括可垂直於基座10之工作面11滑動之第一滑動件431、可平行於工作面11滑動之第二滑動件433以及與第二滑動件433連接之旋轉件435。第一滑動件431相對於基座10之工作面11可上下滑動,第二滑動件433滑動連接於第一滑動件431上,並可於第一滑動件431上平行基座10之工作面11滑動,旋轉件435與第二滑動件433轉動連接。載料台45固定於旋轉件435之自由端,可隨旋轉件435於平行於基座10之工作面11之平面內轉動,並可隨第一滑動件431及第二滑動件433相對基座10之工作面11上下左右滑動。本實施方式中,載料台45包括相 對基座10之工作面11上下並排設置之第一載料板451及第二載料板453,分別裝載第一基板200及第二基板300。 Referring to FIG. 1 , FIG. 4 and FIG. 5 , the loading mechanism 40 includes a sliding rail 41 laid on the working surface 11 of the base 10 , an adjusting component 43 slidably disposed on the sliding rail 41 , and the adjusting component 43 . Loading platform 45. The adjustment assembly 43 includes a first slider 431 slidable perpendicular to the work surface 11 of the base 10, a second slider 433 slidable parallel to the work surface 11, and a rotary member 435 coupled to the second slider 433. The first sliding member 431 is slidable up and down with respect to the working surface 11 of the base 10. The second sliding member 433 is slidably coupled to the first sliding member 431 and can be parallel to the working surface 11 of the base 10 on the first sliding member 431. Sliding, the rotating member 435 is rotatably coupled to the second slider 433. The loading table 45 is fixed to the free end of the rotating member 435, and can rotate with the rotating member 435 in a plane parallel to the working surface 11 of the base 10, and can be opposite to the base with the first sliding member 431 and the second sliding member 433. The working surface 11 of 10 slides up and down and left and right. In this embodiment, the loading platform 45 includes a phase The first substrate 200 and the second substrate 300 are mounted on the first carrier plate 451 and the second carrier plate 453 which are arranged side by side on the working surface 11 of the susceptor 10, respectively.
請同時參閱圖1、圖4及圖6,真空貼合裝置50有二個,沿上料機構40之滑軌41之延伸方向並排設置。真空貼合裝置50具有相對之第一側壁51及第二側壁53,其中第一側壁51面向上料機構50。第一側壁51上開設有入料口511,第二側壁53上開設有出料口531。待貼合之第一基板200及第二基板300可從入料口511進入真空貼合裝置50,貼合完畢後,可從出料口531取出。可以理解,第二側壁53上亦可不開設出料口531,而直接從入料口511將貼合後形成之基板A取出。 Referring to FIG. 1 , FIG. 4 and FIG. 6 simultaneously, there are two vacuum bonding devices 50 arranged side by side along the extending direction of the sliding rails 41 of the loading mechanism 40. The vacuum bonding device 50 has a first side wall 51 and a second side wall 53, wherein the first side wall 51 faces the loading mechanism 50. The first side wall 51 is provided with a feeding port 511, and the second side wall 53 is provided with a discharging port 531. The first substrate 200 and the second substrate 300 to be bonded can enter the vacuum bonding device 50 from the inlet port 511, and can be taken out from the discharge port 531 after bonding. It can be understood that the second side wall 53 may not be provided with the discharge port 531, and the substrate A formed after the bonding is directly taken out from the inlet port 511.
請同時參閱圖1及圖7,卸料機構60位於靠近真空貼合裝置50之第二側壁53一側,卸料機構60與上料機構40結構基本相同,區別在於卸料機構60之載料台65僅具有一載料板,用於將基板A從真空貼合裝置50之出料口531中取出。 Referring to FIG. 1 and FIG. 7 simultaneously, the unloading mechanism 60 is located on the side of the second side wall 53 of the vacuum laminating device 50. The unloading mechanism 60 and the loading mechanism 40 are basically the same, except that the loading mechanism 60 is loaded. The stage 65 has only one carrier plate for taking out the substrate A from the discharge opening 531 of the vacuum bonding apparatus 50.
請同時參閱圖1及圖8,定位機構70固定於基座10之工作面11上,靠近第一撕膜裝置20設置,定位機構70包括承載台71、夾爪73以及用於控制夾爪73之氣缸75。 Referring to FIG. 1 and FIG. 8 simultaneously, the positioning mechanism 70 is fixed on the working surface 11 of the base 10, and is disposed adjacent to the first tearing film device 20. The positioning mechanism 70 includes a carrying platform 71, a clamping jaw 73 and a control claw 73. Cylinder 75.
請同時參閱圖1至圖8,採用該貼合設備100對第一基板200及第二基板300貼合時,可首先通過自動送料機構(圖未標)將第一基板200送至定位機構70之承載台71上,氣缸75控制夾爪73相對運動以將第一基板200夾緊定位。然後通過機械手(圖未示)將第一基板200送至第一撕膜裝置之剝料板25上,然後使壓緊件26將第一基板200壓緊,轉動收料輪22及放料輪23,並移動剝料板25,使放料輪23上之膠帶24將第一基板200下方之保護膜(圖未示 )剝離,並通過收料輪22回收剝離之保護膜。於第一撕膜裝置20撕膜之同時,可將第二基板300放置於第二撕膜裝置30之剝料板34上,轉動收料輪32及放料輪33,並移動剝料板35,使放料輪33上之膠帶34將第一基板300上之保護膜(圖未示)剝離,並通過收料輪32回收剝離之保護膜。然後使上料機構40之載料台45運動至第一撕膜裝置20及第二撕膜裝置30處,第一載料板451及第二載料板453分別承載第一基板200及第二基板300後,載料台45運動至其中一真空貼合裝置50處,從入料口511將第一基板200及第二基板300送入該真空貼合裝置50內,以進行貼合。於載料台45運送第一基板200及第二基板300之時候,第一撕膜裝置20及第二撕膜裝置30可對另外之第一基板200及第二基板300撕膜。載料台45運送完畢後,便可再次運送另外之第一基板200及第二基板300至另一真空貼合裝置50中。卸料機構60之載料板651可從真空貼合裝置50之出料口531處將貼合後形成之基板A取出。如此循環,便可保證各裝置都有良好之利用率,同時亦提高了工作效率。 Referring to FIG. 1 to FIG. 8 , when the first substrate 200 and the second substrate 300 are bonded together by the bonding apparatus 100 , the first substrate 200 can be first sent to the positioning mechanism 70 by an automatic feeding mechanism (not shown). On the stage 71, the cylinder 75 controls the relative movement of the jaws 73 to clamp the first substrate 200. Then, the first substrate 200 is sent to the stripping plate 25 of the first tear film device by a robot (not shown), and then the pressing member 26 presses the first substrate 200 to rotate the receiving wheel 22 and discharge. Wheel 23, and moving the stripping plate 25, so that the tape 24 on the discharge wheel 23 will protect the film below the first substrate 200 (not shown) The film is peeled off, and the peeled protective film is recovered by the take-up wheel 22. While the first tear film device 20 tears the film, the second substrate 300 can be placed on the stripping plate 34 of the second tear film device 30, the receiving wheel 32 and the discharge wheel 33 are rotated, and the stripping plate 35 is moved. The adhesive tape 34 on the discharge wheel 33 peels off the protective film (not shown) on the first substrate 300, and the peeled protective film is recovered by the take-up wheel 32. Then, the loading platform 45 of the loading mechanism 40 is moved to the first tearing film device 20 and the second tearing film device 30, and the first loading plate 451 and the second loading plate 453 respectively carry the first substrate 200 and the second substrate After the substrate 300, the loading table 45 is moved to one of the vacuum bonding devices 50, and the first substrate 200 and the second substrate 300 are fed into the vacuum bonding device 50 from the inlet port 511 for bonding. When the first substrate 200 and the second substrate 300 are transported by the loading platform 45, the first tearing film device 20 and the second tearing film device 30 can tear the film between the other first substrate 200 and the second substrate 300. After the loading of the loading platform 45 is completed, the other first substrate 200 and the second substrate 300 can be transported again to the other vacuum bonding device 50. The carrier plate 651 of the discharge mechanism 60 can take out the substrate A formed after the bonding from the discharge port 531 of the vacuum bonding device 50. This cycle ensures that each device has a good utilization rate and also improves work efficiency.
可以理解,真空貼合裝置50之數量不限於二,可為三或者更多。其數量根據上料機構40運送第一基板200及第二基板300之時間,真空貼合裝置50一次貼合所需之時間以及各裝置之尺寸等因素確定。 It is to be understood that the number of the vacuum bonding devices 50 is not limited to two, and may be three or more. The number is determined according to factors such as the time required for the loading mechanism 40 to transport the first substrate 200 and the second substrate 300, the time required for the vacuum bonding apparatus 50 to be attached once, and the size of each device.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100‧‧‧貼合設備 100‧‧‧Fitting equipment
10‧‧‧基座 10‧‧‧ Pedestal
20‧‧‧第一撕膜裝置 20‧‧‧First tear film device
11‧‧‧工作面 11‧‧‧Working face
30‧‧‧第二撕膜裝置 30‧‧‧Second tear film device
40‧‧‧上料機構 40‧‧‧Feeding agency
50‧‧‧真空貼合裝置 50‧‧‧Vacuum laminating device
60‧‧‧卸料機構 60‧‧‧Discharge mechanism
70‧‧‧定位機構 70‧‧‧ Positioning mechanism
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW98125285A TWI468294B (en) | 2009-07-28 | 2009-07-28 | Bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW98125285A TWI468294B (en) | 2009-07-28 | 2009-07-28 | Bonding apparatus |
Publications (2)
Publication Number | Publication Date |
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TW201103747A TW201103747A (en) | 2011-02-01 |
TWI468294B true TWI468294B (en) | 2015-01-11 |
Family
ID=44813307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW98125285A TWI468294B (en) | 2009-07-28 | 2009-07-28 | Bonding apparatus |
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TW (1) | TWI468294B (en) |
Families Citing this family (3)
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CN103372771B (en) * | 2012-04-27 | 2016-08-03 | 深圳市联得自动化装备股份有限公司 | Middle size backlight group mould machine |
CN104589768A (en) * | 2015-01-07 | 2015-05-06 | 深圳市联得自动化装备股份有限公司 | Base material fitting method and base material fitting method |
CN112707102B (en) * | 2020-12-14 | 2022-12-13 | Tcl王牌电器(惠州)有限公司 | Full-automatic pasting machine |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5487808A (en) * | 1992-11-16 | 1996-01-30 | Fuji Electric Co., Ltd. | Apparatus for laminating plates |
US6241839B1 (en) * | 1996-08-13 | 2001-06-05 | Canon Kabushiki Kaisha | Continuous vacuum lamination treatment system and vacuum lamination apparatus |
US6453963B1 (en) * | 1999-07-29 | 2002-09-24 | Hitachi Techno Engineering Co., Ltd. | Vacuum film laminating apparatus |
-
2009
- 2009-07-28 TW TW98125285A patent/TWI468294B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5487808A (en) * | 1992-11-16 | 1996-01-30 | Fuji Electric Co., Ltd. | Apparatus for laminating plates |
US6241839B1 (en) * | 1996-08-13 | 2001-06-05 | Canon Kabushiki Kaisha | Continuous vacuum lamination treatment system and vacuum lamination apparatus |
US6453963B1 (en) * | 1999-07-29 | 2002-09-24 | Hitachi Techno Engineering Co., Ltd. | Vacuum film laminating apparatus |
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