201103747 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種貼合設備，尤其涉及一種用於製造面板 之貼合設備。 [先前技術] [0002] 於製造液晶顯示器面板或者觸控面板之過程中，會將二 塊基板於真空貼合裝置内進行貼合。通常情況下，於基 板加工好後，會於其表面貼上保護膜以保護其外觀，於 貼合前再通過撕膜裝置撕掉保護膜。 [0003] 一種貼合設備包括撕膜裝置、貼合機構以及連接二者之 ... ...... ... 輸送帶。首先將待貼合之基板放入撕膜裝置進行撕膜後 ，再通過輸送帶送入貼合機構内進行貼合。此種貼合設 . 備通過將撕膜裝置與貼合機構設置成流水線之方式，無 需手工操作，節省人力成本。因撕膜之時間小於基板貼 合之時間，於貼合時撕膜裝置需要設置等待時間，影響 設備之利用率以及貼合之效率。 【發明内容】 [0004] 鑒於上述狀況’有必要提供一種生產效率及設備利用率 較高之貼合設備。 [0005] 一種貼合設備，用於貼合第一基板及第二基板，貼合設 備包括基座、設置於基座上之第一撕膜裝置、第二撕膜 裝置、真空貼合裝置以及上料機構，第一撕膜裝置及第 二撕膜裝置分別對第一基板及第二基板撕膜，該真空貼 合裝置至少為二個，並排設置於基座上，上料機構包括 設置於基座表面之滑轨以及滑動設置於滑軌上之載料台 098125285 表單編號A0101 第4頁/共20頁 201103747 ，載料台將第一基板及第二基板移送至一真空貼合裝置 後，於滑軌上滑動，以將另一第一基板及第二基板移送 至另一真空貼合裝置中。 [0006] 一種貼合設備，用於貼合第一基板及第二基板，該貼合 設備包括基座、固定於基座上之真空貼合裝置以及上料 機構，真空貼合裝置至少有二個，並排設置於基座上， 上料機構相對至少二真空貼合裝置可滑動，以將第一基 板或第二基板移送至至少二真空貼合裝置中。 Ο [0007] 上述貼合設備中，載料台可滑動地設置於滑軌上，因此 可將第撕膜後之基板送至不同之真空貼合裝置中。於載 料台輸送第一基板及第二基板至其中一真空贴合裝置之 過程中，第一撕膜裝置及第二撕膜裝置可對另外之第一 基板及第二基板剝膜，載料台輸送完前一組基板便可將 另一組基板輸送至另一真空貼合裝置中。如此循環，可 使設備充分被利用，提高了貼合之效率。 【實施方式】 ❹ [0008] 下面結合附圖及實施方式對本發明提供之貼合設備作進 一步詳細說明。 [0009] 請參閱圖1，本發明實施方式提供之貼合設備100用於對 第一基板200 (如圖2所示）及第二基板300 (如圖3所示 )進行貼合。貼合設備100包括基座10、固定於基座10上 之第一撕膜裝置20、第二撕膜裝置30、上料機構40、至 少二真空貼合裝置50、卸料機構60以及定位機構70。上 料機構40及卸料機構60分別位於真空貼合裝置50之相對 二侧。 098125285 表單編號A0101 第5頁/共20頁 0982043269-0 201103747 [0010] 請同時參閱圖2及圖3，第 用於製造觸控面板、液㈣及第二基板可為 製造半導體等器件之^件,^之破·、亦可為用於 。本實施Μ中，者其他需要密封貼合之元件 。第—基板m衫二^:及第二基板_為玻璃板 。 哎d00上貼有保護膜（圖未標） [0011] 請再參，基座ίο用 有工作面11。 柃支撐其上之各裝置，基座10具 [0012] [0013] 請同時參閱圖i及圖2,第 ，包衽击* 撕膜裝置20設置於基座1〇上 定架21上作面11幾复之固携1，轉動設置於固 膠帶24、相對n科輪23、繞設於故料輪23上之 定_21 *疋” 1可移動之剝料板25以及設置於固 、㈣，壓緊件26。壤_目對剝料板25可上T 運動。第-撕膜裝置2〇用於對第—基板2嶋膜。 請同時參_丨關3，第二撕《獅設置於基座1〇上 ，與第-撕膜裝置20之結構基本相同，包括固定架31、 轉動X置於固^；架31上之收料輪32、放料輪33、繞設於 放料輪33上之膝帶34以及相對时架31可移動之剝料板 35。第二撕膜裝置30用於對第二基板3〇〇撕膜。201103747 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a bonding apparatus, and more particularly to a bonding apparatus for manufacturing a panel. [Prior Art] [0002] In the process of manufacturing a liquid crystal display panel or a touch panel, two substrates are bonded in a vacuum bonding apparatus. Normally, after the substrate is processed, a protective film is applied to the surface to protect its appearance, and the protective film is peeled off by a tear film device before bonding. [0003] A laminating apparatus includes a tear film device, a laminating mechanism, and a conveyor belt that connects the two. First, the substrate to be bonded is placed in a tear film device to be peeled off, and then fed into the bonding mechanism through a conveyor belt for bonding. This kind of laminating device can save labor costs by eliminating the need for manual operation by setting the tear film device and the bonding mechanism into a line. Since the time of tearing the film is less than the time of bonding the substrate, the tearing film device needs to set a waiting time at the time of bonding, which affects the utilization rate of the device and the efficiency of the bonding. SUMMARY OF THE INVENTION [0004] In view of the above situation, it is necessary to provide a bonding apparatus having high production efficiency and high equipment utilization rate. [0005] A bonding apparatus for bonding a first substrate and a second substrate, the bonding apparatus comprising a base, a first tear film device disposed on the base, a second tear film device, a vacuum bonding device, and The feeding mechanism, the first tearing film device and the second tearing film device respectively tear the film on the first substrate and the second substrate, the vacuum bonding device is at least two, arranged side by side on the base, and the loading mechanism comprises The slide rail on the surface of the base and the loading platform 098125285 which is slidably disposed on the slide rail. Form No. A0101, page 4 / 20 pages 201103747, after the loading platform transfers the first substrate and the second substrate to a vacuum bonding device, Slide on the slide rail to transfer the other first substrate and the second substrate to another vacuum bonding device. [0006] A bonding device for bonding a first substrate and a second substrate, the bonding device comprising a base, a vacuum bonding device fixed on the base, and a loading mechanism, the vacuum bonding device having at least two And arranged side by side on the base, the loading mechanism is slidable relative to at least two vacuum bonding devices to transfer the first substrate or the second substrate into at least two vacuum bonding devices. [0007] In the above bonding apparatus, the loading stage is slidably disposed on the slide rail, so that the substrate after the tear film can be sent to a different vacuum bonding apparatus. During the process of transporting the first substrate and the second substrate to one of the vacuum bonding devices, the first tearing film device and the second tearing film device may strip the other first substrate and the second substrate, and load the material. The other set of substrates can be transported to another vacuum laminating device by transporting the previous set of substrates. This cycle allows the device to be fully utilized and improves the efficiency of the fit. [Embodiment] [0008] The bonding apparatus provided by the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Referring to FIG. 1, a bonding apparatus 100 according to an embodiment of the present invention is used for bonding a first substrate 200 (shown in FIG. 2) and a second substrate 300 (shown in FIG. 3). The bonding apparatus 100 includes a base 10, a first tearing film device 20 fixed to the base 10, a second tearing film device 30, a loading mechanism 40, at least two vacuum bonding devices 50, a discharging mechanism 60, and a positioning mechanism 70. The loading mechanism 40 and the discharging mechanism 60 are respectively located on opposite sides of the vacuum bonding device 50. 098125285 Form No. A0101 Page 5 of 20 0982043269-0 201103747 [0010] Please refer to FIG. 2 and FIG. 3 simultaneously. The first method for manufacturing the touch panel, the liquid (four) and the second substrate can be used for manufacturing semiconductor devices. , ^ broken, can also be used. In this embodiment, other components that require sealing and bonding are required. The first substrate m shirt and the second substrate _ are glass plates.保护d00 is attached with a protective film (not shown) [0011] Please refer again, the base ίο has a working surface 11.基座Supporting the devices thereon, the susceptor 10 has [0012] [0013] Please refer to FIG. 1 and FIG. 2 at the same time, and the smashing and tearing device 20 is disposed on the pedestal 1 on the fixed frame 21 11 fixed solid carrying 1, rotating set on the solid tape 24, relative to the n-wheel 23, around the fixed material wheel 23 fixed _21 * 疋" 1 movable stripping plate 25 and set in solid, (four) , the pressing member 26. The soil _ eye to the stripping plate 25 can be moved by T. The first tear film device 2 〇 is used for the first substrate 2 嶋 film. Please also _ 丨 3 3, the second tear lion setting The structure of the first tear-off film device 20 is substantially the same as that of the first tear-off film device 20, and includes a fixing frame 31, a rotating X placed on the fixing plate, a receiving wheel 32 on the frame 31, a discharging wheel 33, and a winding device. The knee strap 34 on the wheel 33 and the stripping plate 35 movable relative to the time frame 31. The second tear film device 30 is used to tear the film from the second substrate 3.
[0014] 請同時參閱圖1、圖4及圖5，上料機構4〇包括鋪設於基座 10之工作面11上之滑轨41、滑動設置於滑軌41上之調節 組件43以及與調節組件43連接之載料台45。調節組件43 包括可垂直於基座10之工作面Π滑動之第一滑動件431、 可平行於工作面11滑動之第二滑動件433以及與第二滑動 098125285 表單編號A0101 第6頁/共20頁 0982043269-0 201103747 Ο [0015] 3連接之旋轉件435。第一滑動件431相對於基座ι〇 之工作面11可上下滑動，第二滑動件433滑動連接於第一 滑動件431上’並可於第—滑動件431上平行基座ι〇之工 作面11滑動，旋轉件435與第二滑動件433轉動連接。载 料口45固疋於旋轉件435之自由端，可隨旋轉件435於平 行於基座10之工作面丨丨之平面内轉動，並可隨第一滑動 件Ml及第一滑動件433相對基座1〇之工作面I〗上下左右 滑動。本實施方式中，載料台45包括相對基座1〇之工作 面η上下並排設置之第-載料板451及第二載料板453， 刀別裝载第一基板2 0 0及第二基板3 〇 〇。 請同時參閱圖1、圖4及圖6，真空貼合裝置50有二個，沿 上料機構4G之滑倾之延伸方向並排設置。真空貼合裝 置5 〇具有相狀第一側壁5!及第二侧壁5 3，其中第一側[0014] Please refer to FIG. 1, FIG. 4 and FIG. 5 at the same time, the loading mechanism 4〇 includes a slide rail 41 laid on the working surface 11 of the base 10, an adjustment component 43 slidably disposed on the slide rail 41, and adjustment The loading station 45 to which the assembly 43 is connected. The adjustment assembly 43 includes a first slider 431 slidable perpendicular to the work surface of the base 10, a second slider 433 slidable parallel to the work surface 11, and a second slide 098125285 Form No. A0101 Page 6 of 20 Page 9820423269-0 201103747 Ο [0015] 3 connected rotating member 435. The first sliding member 431 can slide up and down with respect to the working surface 11 of the base ι, the second sliding member 433 is slidably coupled to the first sliding member 431 and can work parallel to the pedestal on the first sliding member 431. The face 11 slides, and the rotating member 435 is rotatably coupled to the second slider 433. The loading port 45 is fixed to the free end of the rotating member 435, and can rotate with the rotating member 435 in a plane parallel to the working surface of the base 10, and can be opposite to the first sliding member M1 and the first sliding member 433. The working surface I of the pedestal 1 滑动 slides up and down and left and right. In the present embodiment, the loading platform 45 includes a first carrier plate 451 and a second carrier plate 453 which are arranged side by side with respect to the working surface η of the susceptor 1 ,, and the dies are loaded with the first substrate 200 and the second substrate. Substrate 3 〇〇. Referring to Fig. 1, Fig. 4 and Fig. 6, there are two vacuum laminating devices 50 which are arranged side by side along the extending direction of the sliding mechanism of the loading mechanism 4G. The vacuum bonding device 5 has a first first side wall 5! and a second side wall 5 3, wherein the first side
G 壁51面向上料機構5G。第—側壁51上開設有人料口 5ΐι ，第二側壁53上開設有出料Q531。待貼合之第一基板 200及第二基板300可從入料〇 511進入真空貼合裝㈣ ’貼合完畢後，可從出料 壁5 3上亦可不開設出料口 合後形成之基板A取出。 口531取半。可以理解，第二侧 531，而直接從入料口 Η!將貼 [0016] 請同時參閱圖1及圖7，卸料機構60位於靠近真空貼人裝 置5〇之第二側壁53 —側，卸料機構_上料機⑽結構 基本相同，區別在於卸料機構6q之載料⑽僅具有一載 料板，用於將基板A從真空站合震置5〇之出料口⑶中取 出。 098125285 請同時參閱圖1及圖8，定位機構7〇 表單編號Α0101 第7頁/共2〇貢 固定於基座1〇之工作 0982043269-0 [0017] 201103747 面11上，靠近第一撕膜裝置20設置，定位機構7〇包括承 載台71、夾爪73以及用於控制夾爪73之氣缸75。 [0018] 請同時參閱圖1至圖8，採用該貼合設備1〇〇對第一基板 200及第一基板3〇〇貼合時，可首先通過自動送料機構（ 圖未標）將第一基板200送至定位機構7〇之承載台71上， 氣缸75控制夾爪73相對運動以將第一基板20Q夾緊定位。 然後通過機械手（圖未示）將第一基板2〇〇送至第—撕祺 裝置之剝料板25上，然後使壓緊件26將第一基板200壓緊 ，轉動收料輪22及放料輪23，並移動剝料板25，使放料 輪23上之膠帶24將第一基板2〇〇下方之保護膜（圖未示） 剝離，並通過收料輪22回收剝離之保護膜β於第一撕膜 裝置20撕膜之同時，可將第二基板3〇〇放置於第二撕膜裝 置30之剝料板34上，轉動收料輪32及放料輪33，並移動 剝料板35，使放料輪33上之膠帶34將第一基板3〇〇上之 保護膜（圖未示）剝離’並通過收料輪32回收剝離之保 護膜。然後使上料機構4〇之載料台45運動至第一撕膜裝 置20及第二撕膜裝置3〇處，第一載料板451及第二載料板 453分別承栽第一基板200及第二基板300後，載料台45 運動至其中—真空貼合裝置50處，從入料口 511將第一基 板200及第二基板3〇〇送入該真空貼合裝置5〇内，以進行 貼合。於載料台45運送第一基板200及第二基板3〇〇之時 候，第一撕骐裝置2〇及第二撕膜裝置3〇可對另外之第一 基板200及第二基板300撕膜。載料台45運送完畢後，便 可再次運送另外之第一基板200及第二基板300至另一真 空貼合裝置50中。卸料機構6〇之載料板651可從真空貼合 098125285 表單編號Α0101 第8頁/共20頁 0982043269-0 201103747 裝置50之出料口 531處將貼合後形成之基板Α取出。如此 循環’便可保證各襞置都有良好之利用率，同時亦提高 了工作效率。 [0019] 可以理解’真空貼合•裝置50之數量不限於二，可為三或 者更多。其數量根據上料機構40運送第一基板2〇〇及第二 基板300之時間，真空貼合裝置50 —次貼合所需之時間以 及各裝置之尺寸等因素禮定。 [0020] Ο 乡示上所述’本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0021] 圖1係本發明實施方式之貼合設備之立體結構圖。 [0022] 圖2係圖1所示貼合設備之第一撕膜.裝.置之立體結構圖。 〇 [0023] 圖3係圖1所示貼合設備之第二撕膜裝置之立體結構圖。 [0024] 圖4係圖1所示貼合設備之上料機構之立體結構圖。 [0025] 圖5係圖4所示上料機構之載料台承載基板之結構示意圖 [0026] 圖6係圖1所示貼合設備之真空貼合裝置之立體結構圖。 [0027] 圖7係圖1所示貼合設備之卸料機構之立體結構圖。 [0028] 圖8係圖1所示貼合設備之定位機構之立體結構圖。 【主要元件符號說明】 098125285 表單蝙號A0101 第9頁/共20頁 0982043269-0 201103747 貼合設備 100 第一基板 200 第二基板 300 基座 10 第一撕膜裝置 20 工作面 11 第二撕膜裝置 30 固定架 21 ' 31 收料輪 22 ' 32 放料輪 23 ' 33 膠帶 24 ' 34 剝料板 25 ' 35 上料機構 40 壓緊件 26 滑軌 41 調節組件 43 第一滑動件 431 第二滑動件 433 旋轉件 435 載料台 45、65 第一載料板 451 第二載料板 453 真空貼合裝置 50 第一側壁 51 第二侧壁 53 入料口 511 出料口 531 卸料機構 60 定位機構 70 載料板 651 承載台 71 夾爪 73 氣缸 75 098125285 表單編號A0101 第10頁/共20頁 0982043269-0The G wall 51 faces the loading mechanism 5G. The first side wall 51 is provided with a material opening 5 ΐ, and the second side wall 53 is provided with a discharging material Q531. The first substrate 200 and the second substrate 300 to be bonded can enter the vacuum bonding device (4) from the loading port 511. After the bonding is completed, the substrate can be formed from the discharging wall 53 without opening the discharging port. A is taken out. The mouth 531 takes half. It can be understood that the second side 531, directly from the inlet port, will be attached [0016] Please refer to FIG. 1 and FIG. 7 at the same time, the unloading mechanism 60 is located near the second side wall 53 of the vacuum sticker device 5〇, The unloading mechanism_loader (10) has basically the same structure, except that the loading material (10) of the discharging mechanism 6q has only one loading plate for taking out the substrate A from the discharge port (3) of the vacuum station. 098125285 Please also refer to Figure 1 and Figure 8, the positioning mechanism 7 〇 form number Α 0101 page 7 / total 2 tribute fixed to the base 1 〇 work 0982043269-0 [0017] 201103747 on the face 11, close to the first tear film device 20, the positioning mechanism 7A includes a carrying table 71, a jaw 73 and a cylinder 75 for controlling the jaw 73. [0018] Please also refer to FIG. 1 to FIG. 8 , when the first substrate 200 and the first substrate 3 are pasted together by the bonding apparatus 1 ,, the first can be firstly adopted by an automatic feeding mechanism (not shown). The substrate 200 is sent to the carrier 71 of the positioning mechanism 7, and the cylinder 75 controls the relative movement of the jaws 73 to clamp the first substrate 20Q. Then, the first substrate 2 is sent to the stripping plate 25 of the first tearing device by a robot (not shown), and then the pressing member 26 presses the first substrate 200 to rotate the receiving wheel 22 and The discharge wheel 23 is moved, and the stripping plate 25 is moved, so that the adhesive tape 24 on the discharge wheel 23 peels off the protective film (not shown) under the first substrate 2, and the peeled protective film is recovered by the receiving wheel 22. While the first tear film device 20 is tearing the film, the second substrate 3 is placed on the stripping plate 34 of the second tear film device 30, the receiving wheel 32 and the discharge wheel 33 are rotated, and the stripping is performed. The material sheet 35 is such that the tape 34 on the discharge wheel 33 peels off the protective film (not shown) on the first substrate 3 and collects the peeled protective film through the take-up wheel 32. Then, the loading platform 45 of the loading mechanism 4 is moved to the first tearing film device 20 and the second tearing film device 3, and the first loading plate 451 and the second loading plate 453 respectively support the first substrate 200. After the second substrate 300, the loading table 45 is moved to the vacuum bonding device 50, and the first substrate 200 and the second substrate 3 are fed into the vacuum bonding device 5 from the inlet port 511. For bonding. When the first substrate 200 and the second substrate 3 are transported by the loading platform 45, the first tearing device 2 and the second tearing device 3 can tear the other first substrate 200 and the second substrate 300 . After the loading of the loading platform 45 is completed, the other first substrate 200 and the second substrate 300 can be transported again to the other vacuum bonding device 50. The loading plate 651 of the unloading mechanism 6 can be vacuum-fitted 098125285 Form No. Α0101 Page 8 of 20 0982043269-0 201103747 The discharge port of the device 50 is taken out at 531. This cycle ensures that each device has a good utilization rate and also increases work efficiency. [0019] It will be understood that the number of vacuum bonding devices 50 is not limited to two, and may be three or more. The amount is determined according to the time required for the loading mechanism 40 to transport the first substrate 2 and the second substrate 300, the time required for the vacuum bonding device 50 to be bonded, and the size of each device. [0020] 乡 乡 ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0021] FIG. 1 is a perspective structural view of a bonding apparatus according to an embodiment of the present invention. 2 is a perspective structural view of the first tear film of the bonding apparatus shown in FIG. 1. 3 is a perspective structural view of a second tear film device of the bonding apparatus shown in FIG. 1. 4 is a perspective structural view of the feeding mechanism of the bonding apparatus shown in FIG. 1. 5 is a schematic structural view of a loading platform of a loading platform of the loading mechanism shown in FIG. 4. [0026] FIG. 6 is a perspective structural view of a vacuum bonding apparatus of the bonding apparatus shown in FIG. 7 is a perspective structural view of a discharge mechanism of the bonding apparatus shown in FIG. 1. 8 is a perspective structural view of a positioning mechanism of the bonding apparatus shown in FIG. 1. [Main component symbol description] 098125285 Form bat number A0101 Page 9/20 pages 0982043269-0 201103747 Bonding device 100 First substrate 200 Second substrate 300 Base 10 First tear film device 20 Working surface 11 Second tear film Device 30 holder 21 ' 31 receiving wheel 22 ' 32 discharge wheel 23 ' 33 tape 24 ' 34 stripping plate 25 ' 35 feeding mechanism 40 pressing member 26 sliding rail 41 adjusting assembly 43 first sliding member 431 second Slide 433 Rotating member 435 Loading station 45, 65 First loading plate 451 Second loading plate 453 Vacuum bonding device 50 First side wall 51 Second side wall 53 Inlet port 511 Outlet port 531 Discharge mechanism 60 Positioning mechanism 70 Carrier plate 651 Carrier 71 Gripper 73 Cylinder 75 098125285 Form No. A0101 Page 10 of 20 0982043269-0