JPH03128945U - - Google Patents

Info

Publication number
JPH03128945U
JPH03128945U JP3864790U JP3864790U JPH03128945U JP H03128945 U JPH03128945 U JP H03128945U JP 3864790 U JP3864790 U JP 3864790U JP 3864790 U JP3864790 U JP 3864790U JP H03128945 U JPH03128945 U JP H03128945U
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit package
package device
lead extraction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3864790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3864790U priority Critical patent/JPH03128945U/ja
Publication of JPH03128945U publication Critical patent/JPH03128945U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図は本考案に係る一実施例の
外観図および側面図、第3図および第4図は従来
のSOP型半導体集積回路パツケージ装置の外観
図および側面図である。 図において、1はパツケージ本体、2はリード
ピン、3は刻みである。なお、各図中同一符号は
同一又は相当部分を示す。
1 and 2 are an external view and a side view of an embodiment of the present invention, and FIGS. 3 and 4 are an external view and a side view of a conventional SOP type semiconductor integrated circuit package device. In the figure, 1 is the package body, 2 is a lead pin, and 3 is a notch. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リード引出し面の数が2側面の半導体集積回路
パツケージ装置において、前記半導体集積回路パ
ツケージ装置のリード引出し面でない他の2側面
に、一定間隔の刻みを持つ半導体集積回路パツケ
ージ装置。
A semiconductor integrated circuit package device having two lead extraction surfaces, the other two sides of the semiconductor integrated circuit package device other than the lead extraction surface having indentations at regular intervals.
JP3864790U 1990-04-10 1990-04-10 Pending JPH03128945U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3864790U JPH03128945U (en) 1990-04-10 1990-04-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3864790U JPH03128945U (en) 1990-04-10 1990-04-10

Publications (1)

Publication Number Publication Date
JPH03128945U true JPH03128945U (en) 1991-12-25

Family

ID=31546841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3864790U Pending JPH03128945U (en) 1990-04-10 1990-04-10

Country Status (1)

Country Link
JP (1) JPH03128945U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226039B2 (en) * 1978-10-10 1987-06-05 Fuiritsupusu Furuuiranpenfuaburiken Nv
JPS6327049B2 (en) * 1982-02-22 1988-06-01 Ichimaru Fuarukosu Kk

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226039B2 (en) * 1978-10-10 1987-06-05 Fuiritsupusu Furuuiranpenfuaburiken Nv
JPS6327049B2 (en) * 1982-02-22 1988-06-01 Ichimaru Fuarukosu Kk

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